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1. 发明授权

US07837529B2 Electron-emitting device and manufacturing method thereof 失效
标题翻译：电子发射器件及其制造方法
公开(公告)号：US07837529B2
公开(公告)日：2010-11-23
申请号：US12196883
申请日：2008-08-22
申请人： Hiroko Takada , Hisanobu Azuma , Jun Iba
发明人： Hiroko Takada , Hisanobu Azuma , Jun Iba
IPC分类号： H01J9/24 , H01J9/04
CPC分类号： H01J1/316 , H01J9/027 , H01J2201/3165
摘要： A manufacturing method of an electron-emitting device according to the present invention includes the steps of: preparing a substrate having a first electrode and a second electrode, and a conductive film for connecting the first electrode and the second electrode; and forming a gap on the conductive film by applying a voltage between the first electrode and the second electrode; wherein a planar shape of the conductive film has a V-shape portion between the first electrode and the second electrode.
摘要翻译：根据本发明的电子发射器件的制造方法包括以下步骤：制备具有第一电极和第二电极的衬底和用于连接第一电极和第二电极的导电膜; 以及通过在所述第一电极和所述第二电极之间施加电压在所述导电膜上形成间隙; 其中所述导电膜的平面形状在所述第一电极和所述第二电极之间具有V形部分。

2. 发明申请

US20100060137A1 ELECTRON BEAM APPARATUS 失效
标题翻译：电子束设备
公开(公告)号：US20100060137A1
公开(公告)日：2010-03-11
申请号：US12545432
申请日：2009-08-21
申请人： Hiroko Takada , Jun Iba
发明人： Hiroko Takada , Jun Iba
IPC分类号： H01J29/46
CPC分类号： H01J31/127 , H01J1/3046 , H01J29/04 , H01J29/467
摘要： It aims to improve electron emission efficiency in an electron beam apparatus which includes laminated electron-emitting devices. To achieve this, there are provided an insulating member which has a concave portion on its surface, a cathode which is positioned astride a side surface of the insulating member and an inner surface of the concave portion, a gate which is positioned opposite to the cathode, and a protruding portion which is formed on the gate. In this constitution, the low potential surface of the cathode which is positioned inside the concave portion is inclined to the side of the gate from the entrance toward the interior of the concave portion.
摘要翻译：其目的在于提高包括层压电子发射器件的电子束装置中的电子发射效率。为了实现这一点，提供了一种绝缘构件，其表面上具有凹部，跨越绝缘构件的侧表面设置的阴极和凹部的内表面，与阴极相对设置的栅极以及形成在门上的突出部。在该结构中，位于凹部内的阴极的低电位面从入口朝向凹部的内部倾斜到栅极的一侧。

3. 发明授权

US07969082B2 Electron beam apparatus 失效
标题翻译：电子束装置
公开(公告)号：US07969082B2
公开(公告)日：2011-06-28
申请号：US12545432
申请日：2009-08-21
申请人： Hiroko Takada , Jun Iba
发明人： Hiroko Takada , Jun Iba
IPC分类号： H01J1/62
CPC分类号： H01J31/127 , H01J1/3046 , H01J29/04 , H01J29/467
摘要： It aims to improve electron emission efficiency in an electron beam apparatus which includes laminated electron-emitting devices. To achieve this, there are provided an insulating member which has a concave portion on its surface, a cathode which is positioned astride a side surface of the insulating member and an inner surface of the concave portion, a gate which is positioned opposite to the cathode, and a protruding portion which is formed on the gate. In this constitution, the low potential surface of the cathode which is positioned inside the concave portion is inclined to the side of the gate from the entrance toward the interior of the concave portion.
摘要翻译：其目的在于提高包括层压电子发射器件的电子束装置中的电子发射效率。为了实现这一点，提供了一种绝缘构件，其表面上具有凹部，跨越绝缘构件的侧表面设置的阴极和凹部的内表面，与阴极相对设置的栅极以及形成在门上的突出部。在该结构中，位于凹部内的阴极的低电位面从入口朝向凹部的内部倾斜到栅极侧。

4. 发明申请

US20120103951A1 CONTROL APPARATUS AND LASER PROCESSING MACHINE 审中-公开
标题翻译：控制装置和激光加工机
公开(公告)号：US20120103951A1
公开(公告)日：2012-05-03
申请号：US13262794
申请日：2011-02-07
申请人： Hiroko Takada
发明人： Hiroko Takada
IPC分类号： B23K26/00 , G06F17/00
CPC分类号： B23K26/08 , G05B2219/31352 , G05B2219/45041
摘要： A control apparatus for controlling a laser processing machine, includes: a HDD as data storing means for storing shape data on a shape of a processed part to which laser processing of the laser processing machine is applied and data on a processing condition of the laser processing machine; and a CPU as processing condition adjusting means for performing adjustment of the processing condition with reference to the shape data and the data on the processing condition stored in the data storing means. The shape data that is acquired as to a work when the work to which the laser processing is applied is determined to be a defective item and the data on the processing condition that is adjusted by the processing condition adjusting means according to the determination of being a defective item are accumulated in the data storing means in association with each other.
摘要翻译：一种用于控制激光加工机的控制装置，包括：HDD，作为数据存储装置，用于存储关于激光加工机的激光加工的加工部的形状的形状数据，以及激光加工的处理条件的数据机; 以及作为处理条件调整装置的CPU，参照形状数据和存储在数据存储装置中的处理条件的数据进行处理条件的调整。将应用了激光加工的工件时的工件取得的形状数据确定为缺陷项目，并根据处理条件调整装置根据确定为故障项目彼此相关联地累积在数据存储装置中。

5. 发明授权

US08455787B2 Laser processing apparatus, process control apparatus, and processing apparatus 有权
标题翻译：激光加工装置，过程控制装置和处理装置
公开(公告)号：US08455787B2
公开(公告)日：2013-06-04
申请号：US12665574
申请日：2008-07-04
申请人： Hiroko Takada
发明人： Hiroko Takada
IPC分类号： B23K26/00
CPC分类号： B23K37/0461 , B23K26/38
摘要： A laser processing apparatus in which a workpiece is placed on a work support base that supports the workpiece at a plurality of support points and performs, while moving a processing head in a horizontal direction with respect to the workpiece, laser processing on the workpiece on the work support base by the processing head, includes a tilt judging unit that judges, based on a positional relationship between a product chip that is to be separated from the workpiece when the workpiece is subjected to laser processing and support points, whether the product chip tilts in a height direction and projects upward on a side of the processing head from the workpiece before laser processing; and a drive control unit that controls a height of the processing head with respect to the workpiece when moving the processing head to a processing position for a next product chip after completing laser processing on the product chip based on a judgment result of the tilt judging unit.
摘要翻译：一种激光加工装置，其中将工件放置在在多个支撑点处支撑工件的工件支撑基座上，并且在相对于工件在水平方向上移动处理头的同时执行对工件的激光加工处理头的工作支撑基座包括倾斜判定单元，其基于当工件经受激光加工和支撑点时与工件分离的产品芯片之间的位置关系来判断产品芯片是否倾斜在高度方向上，在激光加工之前从工件向上突出在处理头的一侧; 以及驱动控制单元，其基于倾斜判定单元的判断结果，在完成对产品芯片的激光处理之后，将处理头移动到下一个产品芯片的处理位置时，控制处理头相对于工件的高度。

6. 发明申请

US20100193479A1 LASER PROCESSING APPARATUS, PROCESS CONTROL APPARATUS, AND PROCESSING APPARATUS 有权
标题翻译：激光加工设备，工艺控制设备和加工设备
公开(公告)号：US20100193479A1
公开(公告)日：2010-08-05
申请号：US12665574
申请日：2008-07-04
申请人： Hiroko Takada
发明人： Hiroko Takada
IPC分类号： B23K26/00
CPC分类号： B23K37/0461 , B23K26/38
摘要： A laser processing apparatus in which a workpiece is placed on a work support base that supports the workpiece at a plurality of support points and performs, while moving a processing head in a horizontal direction with respect to the workpiece, laser processing on the workpiece on the work support base by the processing head, includes a tilt judging unit that judges, based on a positional relationship between a product chip that is to be separated from the workpiece when the workpiece is subjected to laser processing and support points, whether the product chip tilts in a height direction and projects upward on a side of the processing head from the workpiece before laser processing; and a drive control unit that controls a height of the processing head with respect to the workpiece when moving the processing head to a processing position for a next product chip after completing laser processing on the product chip based on a judgment result of the tilt judging unit.
摘要翻译：一种激光加工装置，其中将工件放置在在多个支撑点处支撑工件的工件支撑基座上，并且在相对于工件在水平方向上移动处理头的同时执行对工件的激光加工处理头的工作支撑基座包括倾斜判定单元，其基于当工件经受激光加工和支撑点时与工件分离的产品芯片之间的位置关系来判断产品芯片是否倾斜在高度方向上，在激光加工之前从工件向上突出在处理头的一侧; 以及驱动控制单元，其基于倾斜判定单元的判断结果，在完成对产品芯片的激光处理之后，将处理头移动到下一个产品芯片的处理位置时，控制处理头相对于工件的高度。

7. 发明申请

US20130213943A1 LASER MACHINING METHOD 审中-公开
标题翻译：激光加工方法
公开(公告)号：US20130213943A1
公开(公告)日：2013-08-22
申请号：US13700816
申请日：2012-02-17
申请人： Hiroko Takada
发明人： Hiroko Takada
IPC分类号： B23K26/38
CPC分类号： B23K26/38 , B23K26/0876 , B23K31/12
摘要： A laser machining method includes a trial machining step of placing a machined material serving as a target of laser machining on a machining table and performing trial machining of the machined material before performing actual machining for cutting out a product from the machined material, wherein the trial machining step includes a cutting-out step of cutting out a trial-machining cut piece having a preset shape from a trial machining area that is set in the machined material by laser machining, a detecting step of detecting whether the trial-machining cut piece remains in the machined material by using the machined material having undergone the cutting-out step as a target to confirm whether the trial-machining cut piece is present, and a determining step of determining whether shifting to the actual machining is permitted according to a detection result at the detecting step.
摘要翻译：激光加工方法包括将加工材料作为激光加工对象物放置在加工台上的试验加工步骤，并且在进行从加工材料切出产品的实际加工之前对加工材料进行试验加工，其中试验加工步骤包括：切割步骤，通过激光加工从设置在加工材料中的试制加工区域切割具有预定形状的试验加工切割片;检测步骤，检测试验加工切割片是否保留通过使用已经经过切割步骤的加工材料作为目标来确定是否存在试验加工切割片，并且根据检测结果确定是否允许切换到实际加工的确定步骤在检测步骤。

8. 发明申请

US20100066235A1 IMAGE DISPLAY APPARATUS 审中-公开
标题翻译：图像显示设备
公开(公告)号：US20100066235A1
公开(公告)日：2010-03-18
申请号：US12556346
申请日：2009-09-09
申请人： Kazunari Ooyama , Hiroko Takada , Shinichi Kawate , Masafumi Kyogaku , Noriaki Homma
发明人： Kazunari Ooyama , Hiroko Takada , Shinichi Kawate , Masafumi Kyogaku , Noriaki Homma
IPC分类号： H01J1/62
CPC分类号： H01J29/86 , H01J31/127
摘要： The shortest distance L [μm] from an arbitrary point on an exposed insulating surface on a base to a conductive member on the base and a sheet resistivity Rs [Ω/□] of the arbitrary point satisfy Rs×L2
摘要翻译：基底上露出的绝缘表面上的任意点与基底上的导电构件的最短距离L [μm]和任意点的薄层电阻率Rs [＆OHgr /□]满足Rs×L2 <4.2×1022 [ ＆OHgr;×μm2]。由此，在具有电子发射器件的图像显示装置中，抑制了衬底上的绝缘表面的电位的增加，并且防止了使用抗静电膜等的电子发射器件的劣化。

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