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1. 发明授权

US09455212B2 Loop heat pipe system and information processing apparatus 有权
标题翻译：回路热管系统及信息处理装置
公开(公告)号：US09455212B2
公开(公告)日：2016-09-27
申请号：US13473922
申请日：2012-05-17
申请人： Hiroki Uchida , Takeshi Shioga , Shigenori Aoki , Susumu Ogata , Hideaki Nagaoka
发明人： Hiroki Uchida , Takeshi Shioga , Shigenori Aoki , Susumu Ogata , Hideaki Nagaoka
IPC分类号： F28F27/00 , H01L23/427 , F28D15/04 , F28D15/06 , H01L23/34 , F28D15/02
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/043 , F28D15/06 , H01L23/345 , H01L2924/0002 , H01L2924/00
摘要： A loop heat pipe system includes a loop heat pipe (LHP), a temperature sensor, a heater and a controller. The temperature sensor measures temperature of a working fluid portion of the LHP in which the working fluid has different phases depending on whether or not the LHP is in a disable status not to start up a heat transportation, in which a liquid phase of the working fluid does not exist in an evaporator of the LHP. The heater heats a heating target part of a vapor line. The controller, in order to start up the LHP, turns on the heater, monitors temperature of the heating target part using the temperature sensor, and turns off the heater when detecting a change in the monitored temperature, caused by condensation of a vapor phase of the working fluid.
摘要翻译：回路热管系统包括回路热管（LHP），温度传感器，加热器和控制器。温度传感器根据LHP是否处于禁止状态而测量工作流体具有不同相位的LHP的工作流体部分的温度，而不启动热运输，其中工作流体的液相在LHP的蒸发器中不存在。加热器加热蒸气管线的加热目标部分。控制器为了启动LHP，打开加热器，使用温度传感器监测加热对象部件的温度，并且当检测到监测到的温度变化时，关闭加热器，该温度由蒸气相的冷凝引起工作流体。

2. 发明申请

US20120227954A1 LOOP HEAT PIPE SYSTEM AND INFORMATION PROCESSING APPARATUS 有权
标题翻译：循环热管系统和信息处理设备
公开(公告)号：US20120227954A1
公开(公告)日：2012-09-13
申请号：US13473922
申请日：2012-05-17
申请人： Hiroki UCHIDA , Takeshi Shioga , Shigenori Aoki , Susumu Ogata , Hideaki Nagaoka
发明人： Hiroki UCHIDA , Takeshi Shioga , Shigenori Aoki , Susumu Ogata , Hideaki Nagaoka
IPC分类号： F28F27/00 , F25B29/00
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/043 , F28D15/06 , H01L23/345 , H01L2924/0002 , H01L2924/00
摘要： A loop heat pipe system includes: a loop heat pipe (LHP) including an evaporator, a condenser, a vapor line, and a liquid; a temperature sensor to measure temperature of part of the LHP, a working fluid portion in which has different phases in a situation where the LHP functions as a heat transport device and in a situation where the LHP dose not function as a heat transport device and a liquid phase of the working fluid dose not exist in the evaporator; a heater to heat a heating target part of the vapor line; and a controller, in order to start the LHP, to turn on the heater, to monitor temperature of the heating target part using the temperature sensor, and to turn off the heater when detecting a change caused by condensation of a vapor phase of the working fluid in the monitored temperature.
摘要翻译：回路热管系统包括：包括蒸发器，冷凝器，蒸汽管线和液体的回路热管（LHP）; 用于测量LHP的一部分的温度的温度传感器，在LHP用作热传输装置的情况下以及LHP剂量不用作热输送装置的情况下具有不同相的工作流体部分在蒸发器中不存在工作流体的液相剂量; 用于加热所述蒸气管线的加热目标部分的加热器; 以及控制器，为了启动LHP，打开加热器，使用温度传感器监测加热对象部件的温度，并且当检测到加热器的气相的冷凝所引起的变化时关闭加热器流体在监测温度。

3. 发明申请

US20130044432A1 LOOP HEAT PIPE, AND ELECTRONIC APPARATUS INCLUDING LOOP HEAT PIPE 有权
标题翻译：环形热管和包括循环热管的电子设备
公开(公告)号：US20130044432A1
公开(公告)日：2013-02-21
申请号：US13567257
申请日：2012-08-06
申请人： Susumu Ogata , Hiroki Uchida , Seiji Hibino , Takeshi Shioga , Takahiro Kimura
发明人： Susumu Ogata , Hiroki Uchida , Seiji Hibino , Takeshi Shioga , Takahiro Kimura
IPC分类号： F28D15/04 , H05K7/20
CPC分类号： F28D15/043 , F28D15/046 , H05K7/20336
摘要： There is provided a loop heat pipe which includes an evaporator that internally includes at least one wick built, a condenser, a liquid pipe and a vapor pipe that connect the evaporator and the condenser to each other, and a heat dispersion cavity that is formed inside the evaporator, and disperses a vapor, wherein the wick includes, a first wick that is porous, a second wick that is porous, the second wick being inserted into the first wick from the liquid pipe side and including a pore size larger than the first wick, and a vapor channel that is defined between the first wick and the second wick. The vapor channel is connected at an end on the liquid pipe side to the heat dispersion cavity.
摘要翻译：提供了一种环路热管，其包括内部包括至少一个灯芯的冷凝器，冷凝器，液体管和将蒸发器和冷凝器彼此连接的蒸气管的蒸发器，以及形成在内部的散热腔蒸发器，并且分散蒸气，其中所述芯包括多孔的第一芯，第二芯是多孔的，所述第二芯从所述液管侧插入所述第一芯中，并且包括大于所述第一芯的孔径灯芯和在第一灯芯和第二灯芯之间限定的蒸气通道。蒸气通道在液体管侧的一端连接到散热腔。

4. 发明申请

US20120132402A1 LOOP HEAT PIPE AND STARTUP METHOD FOR THE SAME 审中-公开
标题翻译：循环热管及其启动方法
公开(公告)号：US20120132402A1
公开(公告)日：2012-05-31
申请号：US13323973
申请日：2011-12-13
申请人： Shigenori Aoki , Takeshi Shioga , Hiroki Uchida
发明人： Shigenori Aoki , Takeshi Shioga , Hiroki Uchida
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/06 , F28F2250/06 , H01L2924/0002 , H05K7/20809 , H01L2924/00
摘要： A loop heat pipe includes: a first evaporator and a second evaporator each of which vaporizes a liquid-phase working fluid and converts the liquid-phase working fluid to a vapor-phase working fluid; a first condenser and a second condenser each of which condenses the vapor-phase working fluid and converts the vapor-phase working fluid back to the liquid-phase working fluid; a first vapor line through which the working fluid converted to the vapor phase is transported to the first condenser; a first liquid line through which the working fluid converted to the liquid phase is transported to the second evaporator; a second vapor line through which the working fluid converted to the vapor phase is transported to the second condenser; and a second liquid line through which the working fluid converted to the liquid phase is transported to the first evaporator.
摘要翻译：环路热管包括：第一蒸发器和第二蒸发器，其中每个蒸发器将液相工作流体蒸发并将液相工作流体转化为气相工作流体; 第一冷凝器和第二冷凝器，每个冷凝器和第二冷凝器冷凝气相工作流体并将气相工作流体转换回液相工作流体; 将工作流体转化成气相的第一蒸气管线被输送到第一冷凝器; 将工作流体转化为液相的第一液体管线被输送到第二蒸发器; 将工作流体转化成气相的第二蒸气管线被输送到第二冷凝器; 以及第二液体管线，通过所述第二液体管线将转化为液相的工作流体输送到第一蒸发器。

5. 发明授权

US08780560B2 Loop heat pipe, and electronic apparatus including loop heat pipe 有权
标题翻译：回路热管，以及包括回路热管的电子设备
公开(公告)号：US08780560B2
公开(公告)日：2014-07-15
申请号：US13567257
申请日：2012-08-06
申请人： Susumu Ogata , Hiroki Uchida , Seiji Hibino , Takeshi Shioga , Takahiro Kimura
发明人： Susumu Ogata , Hiroki Uchida , Seiji Hibino , Takeshi Shioga , Takahiro Kimura
IPC分类号： H05K7/20 , F28D15/00 , H01L23/34
CPC分类号： F28D15/043 , F28D15/046 , H05K7/20336
摘要： There is provided a loop heat pipe which includes an evaporator that internally includes at least one wick built, a condenser, a liquid pipe and a vapor pipe that connect the evaporator and the condenser to each other, and a heat dispersion cavity that is formed inside the evaporator, and disperses a vapor, wherein the wick includes, a first wick that is porous, a second wick that is porous, the second wick being inserted into the first wick from the liquid pipe side and including a pore size larger than the first wick, and a vapor channel that is defined between the first wick and the second wick. The vapor channel is connected at an end on the liquid pipe side to the heat dispersion cavity.
摘要翻译：提供了一种环路热管，其包括内部包括至少一个灯芯的冷凝器，冷凝器，液体管和将蒸发器和冷凝器彼此连接的蒸气管的蒸发器，以及形成在内部的散热腔蒸发器，并且分散蒸气，其中所述芯包括多孔的第一芯，第二芯是多孔的，所述第二芯从所述液管侧插入所述第一芯中，并且包括大于所述第一芯的孔径灯芯和在第一灯芯和第二灯芯之间限定的蒸气通道。蒸气通道在液体管侧的一端连接到散热腔。

6. 发明申请

US20110168564A1 PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT BOARD FABRICATION METHOD 有权
标题翻译：电镀方法，半导体器件制造方法和电路板制造方法
公开(公告)号：US20110168564A1
公开(公告)日：2011-07-14
申请号：US13043854
申请日：2011-03-09
申请人： Masataka Mizukoshi , Kanae Nakagawa , Takeshi Shioga , Kazuaki Kurihara , John David Baniecki
发明人： Masataka Mizukoshi , Kanae Nakagawa , Takeshi Shioga , Kazuaki Kurihara , John David Baniecki
IPC分类号： C25D7/12
CPC分类号： H01L24/91 , H01L21/4846 , H01L21/4857 , H01L21/486 , H01L21/76801 , H01L21/7687 , H01L21/76873 , H01L21/76874 , H01L21/76885 , H01L23/5283 , H01L23/5389 , H01L24/11 , H01L24/19 , H01L24/45 , H01L24/48 , H01L24/82 , H01L2224/02333 , H01L2224/0401 , H01L2224/04105 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05644 , H01L2224/05655 , H01L2224/1134 , H01L2224/12105 , H01L2224/13144 , H01L2224/13147 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48132 , H01L2224/73267 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01046 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/381 , H05K3/4602 , H05K3/4661 , H05K2201/0209 , H05K2201/086 , H05K2201/09509 , H05K2203/0195 , H05K2203/0228 , H01L2224/13099 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The plating method comprises the step of forming a resin layer 10 over a substrate 16; the step of cutting the surface part of the resin layer 10 with a cutting tool 12; the step of forming a seed layer 36 on the resin layer 10 by electroless plating; and the step of forming a plating film 44 on the seed layer 36 by electroplating. Suitable roughness can be give to the surface of the resin layer 10, whereby the adhesion between the seed layer 36 and the resin layer 10 can be sufficiently ensured. Excessively deep pores are not formed in the surface of the resin layer 10 as are by desmearing treatment, whereby a micronized pattern of a photoresist film 40 can be formed on the resin layer 10. Thus, interconnections 44, etc. can be formed over the resin layer 10 at a narrow pitch with high reliability ensured.
摘要翻译：电镀方法包括在基板16上形成树脂层10的步骤; 用切割工具12切割树脂层10的表面部分的步骤; 通过无电解电镀在树脂层10上形成种子层36的步骤; 以及通过电镀在种子层36上形成电镀膜44的步骤。可以赋予树脂层10的表面适当的粗糙度，由此能够充分确保种子层36与树脂层10之间的粘附性。在树脂层10的表面没有形成过度的深孔，如通过去污处理，从而可以在树脂层10上形成光致抗蚀剂膜40的微粉化图案。因此，可以在确保了高可靠性的窄间距树脂层10。

7. 发明授权

US07832069B2 Capacitor device and method of manufacturing the same 失效
标题翻译：电容器及其制造方法
公开(公告)号：US07832069B2
公开(公告)日：2010-11-16
申请号：US11790732
申请日：2007-04-27
申请人： Takeshi Shioga , John David Baniecki , Kazuaki Kurihara
发明人： Takeshi Shioga , John David Baniecki , Kazuaki Kurihara
IPC分类号： H01G7/00
CPC分类号： H01L27/0805 , H01L21/76877 , H01L24/11 , H01L28/40 , H01L2224/06102 , H01L2224/1147 , H01L2224/13023 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/43 , Y10T29/435 , Y10T29/49126 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156
摘要： A capacitor device includes a capacitor Q constituted by a lower electrode (12) formed on a substrate (10), a dielectric film (14), and an upper electrode (16); an insulating film (18) covering the capacitor Q; a first contact hole (18a) formed in the insulating film (18) on a connection portion (16a) of the upper electrode (16); an electrode pad (20) for preventing a diffusion of solder, formed in the first contact hole (18a); and a solder bump (22) electrically connected to the electrode pad (20), and the upper electrode (16) has a protrusion portion (16a) protruding from the dielectric film (14), and is connected to the first contact hole (18a) on the protrusion portion (16a).
摘要翻译：电容器装置包括由形成在基板（10）上的下电极（12），电介质膜（14）和上电极（16）构成的电容器Q; 覆盖电容器Q的绝缘膜（18）; 形成在所述上电极（16）的连接部（16a）上的绝缘膜（18）中的第一接触孔（18a）用于防止形成在第一接触孔（18a）中的焊料扩散的电极焊盘（20）; 和与电极焊盘（20）电连接的焊料凸块（22），上部电极（16）具有从电介质膜（14）突出的突出部（16a），与第一接触孔）突出部（16a）。

8. 发明申请

US20100112775A1 PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT BOARD FABRICATION METHOD 有权
标题翻译：电镀方法，半导体器件制造方法和电路板制造方法
公开(公告)号：US20100112775A1
公开(公告)日：2010-05-06
申请号：US12684570
申请日：2010-01-08
申请人： Masataka Mizukoshi , Kanae Nakagawa , Takeshi Shioga , Kazuaki Kurihara , John David Baniecki
发明人： Masataka Mizukoshi , Kanae Nakagawa , Takeshi Shioga , Kazuaki Kurihara , John David Baniecki
IPC分类号： H01L21/02 , H01L21/768
CPC分类号： H01L24/91 , H01L21/4846 , H01L21/4857 , H01L21/486 , H01L21/76801 , H01L21/7687 , H01L21/76873 , H01L21/76874 , H01L21/76885 , H01L23/5283 , H01L23/5389 , H01L24/11 , H01L24/19 , H01L24/45 , H01L24/48 , H01L24/82 , H01L2224/02333 , H01L2224/0401 , H01L2224/04105 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05644 , H01L2224/05655 , H01L2224/1134 , H01L2224/12105 , H01L2224/13144 , H01L2224/13147 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48132 , H01L2224/73267 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01046 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/381 , H05K3/4602 , H05K3/4661 , H05K2201/0209 , H05K2201/086 , H05K2201/09509 , H05K2203/0195 , H05K2203/0228 , H01L2224/13099 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The plating method comprises the step of forming a resin layer 10 over a substrate 16; the step of cutting the surface part of the resin layer 10 with a cutting tool 12; the step of forming a seed layer 36 on the resin layer 10 by electroless plating; and the step of forming a plating film 44 on the seed layer 36 by electroplating. Suitable roughness can be give to the surface of the resin layer 10, whereby the adhesion between the seed layer 36 and the resin layer 10 can be sufficiently ensured. Excessively deep pores are not formed in the surface of the resin layer 10, as are by desmearing treatment, whereby a micronized pattern of a photoresist film 40 can be formed on the resin layer 10. Thus, interconnections 44, etc. can be formed over the resin layer 10 at a narrow pitch with high reliability ensured.
摘要翻译：电镀方法包括在基板16上形成树脂层10的步骤; 用切割工具12切割树脂层10的表面部分的步骤; 通过无电解电镀在树脂层10上形成种子层36的步骤; 以及通过电镀在种子层36上形成电镀膜44的步骤。可以赋予树脂层10的表面适当的粗糙度，由此能够充分确保种子层36与树脂层10之间的粘附性。树脂层10的表面上也不会形成过度的深孔，如通过干燥处理，可以在树脂层10上形成光致抗蚀剂膜40的微细化图案。因此，可以形成互连44等能够确保高可靠性的窄间距的树脂层10。

9. 发明授权

US07670940B2 Plating method, semiconductor device fabrication method and circuit board fabrication method 有权
标题翻译：电镀方法，半导体器件制造方法和电路板制造方法
公开(公告)号：US07670940B2
公开(公告)日：2010-03-02
申请号：US11250399
申请日：2005-10-17
申请人： Masataka Mizukoshi , Kanae Nakagawa , Takeshi Shioga , Kazuaki Kurihara , John David Baniecki
发明人： Masataka Mizukoshi , Kanae Nakagawa , Takeshi Shioga , Kazuaki Kurihara , John David Baniecki
IPC分类号： H01L21/76
CPC分类号： H01L24/91 , H01L21/4846 , H01L21/4857 , H01L21/486 , H01L21/76801 , H01L21/7687 , H01L21/76873 , H01L21/76874 , H01L21/76885 , H01L23/5283 , H01L23/5389 , H01L24/11 , H01L24/19 , H01L24/45 , H01L24/48 , H01L24/82 , H01L2224/02333 , H01L2224/0401 , H01L2224/04105 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05644 , H01L2224/05655 , H01L2224/1134 , H01L2224/12105 , H01L2224/13144 , H01L2224/13147 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48132 , H01L2224/73267 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01046 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/381 , H05K3/4602 , H05K3/4661 , H05K2201/0209 , H05K2201/086 , H05K2201/09509 , H05K2203/0195 , H05K2203/0228 , H01L2224/13099 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The plating method comprises the step of forming a resin layer 10 over a substrate 16; the step of cutting the surface part of the resin layer 10 with a cutting tool 12; the step of forming a seed layer 36 on the resin layer 10 by electroless plating; and the step of forming a plating film 44 on the seed layer 36 by electroplating. Suitable roughness can be give to the surface of the resin layer 10, whereby the adhesion between the seed layer 36 and the resin layer 10 can be sufficiently ensured. Excessively deep pores are not formed in the surface of the resin layer 10, as are by desmearing treatment, whereby a micronized pattern of a photoresist film 40 can be formed on the resin layer 10. Thus, interconnections 44, etc. can be formed over the resin layer 10 at a narrow pitch with high reliability ensured.
摘要翻译：电镀方法包括在基板16上形成树脂层10的步骤; 用切割工具12切割树脂层10的表面部分的步骤; 通过无电解电镀在树脂层10上形成种子层36的步骤; 以及通过电镀在种子层36上形成电镀膜44的步骤。可以赋予树脂层10的表面适当的粗糙度，由此能够充分确保种子层36与树脂层10之间的粘附性。树脂层10的表面上也不会形成过度的深孔，如通过干燥处理，可以在树脂层10上形成光致抗蚀剂膜40的微细化图案。因此，可以形成互连44等能够确保高可靠性的窄间距的树脂层10。

10. 发明申请

US20080315358A1 Capacitive element, method of manufacture of the same, and semiconductor device 有权
标题翻译：电容元件及其制造方法以及半导体器件
公开(公告)号：US20080315358A1
公开(公告)日：2008-12-25
申请号：US12222764
申请日：2008-08-15
申请人： Takeshi Shioga , John David Baniecki , Kazuaki Kurihara
发明人： Takeshi Shioga , John David Baniecki , Kazuaki Kurihara
IPC分类号： H01L29/00 , H01G4/06
CPC分类号： H01L28/55 , H01G4/33 , H01L24/73 , H01L27/0805 , H01L28/65 , H01L28/75 , H01L2224/16225 , H01L2224/16265 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2924/12044 , H01L2924/1515 , H01L2924/15311 , H01L2924/181 , H01L2924/19103 , H01L2924/19104 , H01L2924/30107 , H01L2924/3011 , Y10S257/924 , Y10S438/957 , Y10T29/435 , H01L2924/00012 , H01L2924/00
摘要： A capacitive element is characterized by including: a base (12); a lower barrier layer (13) formed on the base (12); capacitors (Q1 and Q2) made by forming a lower electrode (14a), capacitor dielectric layers (15a), and upper electrodes (16a) in this order on the lower barrier layer (13); and an upper barrier layer (20) covering at least the capacitor dielectric layers (15a) and the lower barrier layer (13).
摘要翻译：电容元件的特征在于包括：基座（12）; 形成在所述基座（12）上的下阻挡层（13）; 在下阻挡层（13）上依次形成下电极（14a），电容电介质层（15a）和上电极（16a）制成的电容器（Q1和Q2）; 和覆盖至少所述电容器电介质层（15a）和所述下阻挡层（13）的上阻挡层（20）。

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