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    • 5. 发明授权
    • Laser processing method
    • 激光加工方法
    • US08877612B2
    • 2014-11-04
    • US13643424
    • 2011-06-03
    • Yoshinori Abe
    • Yoshinori Abe
    • H01L21/00B23K26/08B23K26/40B23K26/06B28D5/00H01L21/67B23K26/00H01L33/00
    • B28D5/0011B23K26/0622B23K26/0823B23K26/0853B23K26/40B23K26/53B23K2101/40B23K2103/50H01L21/67092H01L33/0095
    • In a modified region forming step, an element-group formation substrate (20) having plural semiconductor light emitting elements (21) formed on a substrate front surface (11a) of a wafer substrate (11) is irradiated with laser light (64) from the substrate back surface (11b) of the substrate, thereby forming the following inside the substrate: first and third modified regions (L1) and (L3) oriented in a y-direction (corresponding to a first direction) that is parallel to the surfaces of the substrate; and second and fourth modified regions (L2) and (L4) oriented in an x-direction (corresponding to a second direction) that is parallel to the surfaces of the substrate and differs from the y-direction. In the step, the first modified region (L1), the second modified region (L2), the third modified region (L3) and the fourth modified region (L4) are formed at different depths from the substrate back surface of the substrate.
    • 在改质区域形成工序中,将形成在晶片基板(11)的基板前表面(11a)上的多个半导体发光元件(21)的元件群形成用基板(20)从激光(64)照射 基板的基板背面(11b),从而在基板的内部形成以下内容:在与该表面平行的y方向(相当于第一方向)上取向的第一和第三改质区域(L1)和(L3) 的基底; 以及在与基板的表面平行的x方向(相当于第二方向)取向的第二和第四变形区域(L2)和(L4),并且与y方向不同。 在该步骤中,在与基板的基板背面不同的深度形成有第一改质区域(L1),第二改质区域(L2),第三改质区域(L3)和第四改质区域(L4)。
    • 6. 发明申请
    • LASER PROCESSING METHOD
    • 激光加工方法
    • US20130040466A1
    • 2013-02-14
    • US13643424
    • 2011-06-03
    • Yoshinori Abe
    • Yoshinori Abe
    • H01L21/268
    • B28D5/0011B23K26/0622B23K26/0823B23K26/0853B23K26/40B23K26/53B23K2101/40B23K2103/50H01L21/67092H01L33/0095
    • In a modified region forming step, an element-group formation substrate (20) having plural semiconductor light emitting elements (21) formed on a substrate front surface (11a) of a wafer substrate (11) is irradiated with laser light (64) from the substrate back surface (11b) of the substrate, thereby forming the following inside the substrate: first and third modified regions (L1) and (L3) oriented in a y-direction (corresponding to a first direction) that is parallel to the surfaces of the substrate; and second and fourth modified regions (L2) and (L4) oriented in an x-direction (corresponding to a second direction) that is parallel to the surfaces of the substrate and differs from the y-direction. In the step, the first modified region (L1), the second modified region (L2), the third modified region (L3) and the fourth modified region (L4) are formed at different depths from the substrate back surface of the substrate.
    • 在改质区域形成工序中,将形成在晶片基板(11)的基板前表面(11a)上的多个半导体发光元件(21)的元件群形成用基板(20)从激光(64)照射 基板的基板背面(11b),从而在基板的内部形成以下内容:在与该表面平行的y方向(相当于第一方向)上取向的第一和第三改质区域(L1)和(L3) 的基底; 以及在与基板的表面平行的x方向(相当于第二方向)取向的第二和第四变形区域(L2)和(L4),其与y方向不同。 在该步骤中,在与基板的基板背面不同的深度形成有第一改质区域(L1),第二改质区域(L2),第三改质区域(L3)和第四改质区域(L4)。
    • 7. 发明授权
    • Light-emitting apparatus and method of manufacturing the same
    • 发光装置及其制造方法
    • US08035125B2
    • 2011-10-11
    • US12296813
    • 2007-04-12
    • Yoshinori Abe
    • Yoshinori Abe
    • H01L33/00H01L33/62
    • H01L33/54H01L33/52H01L33/60H01L2224/45144H01L2224/48247H01L2224/73265H01L2924/3025H01L2924/00
    • The present invention provides a light-emitting apparatus capable of improving brightness and reducing power consumption and a method of manufacturing the same. The light-emitting apparatus includes: a light-emitting device 2 including electrode pads 9 and 10; and a lead frame 3 including electrode leads 11 and 12. The electrode pads 9 and 10 and the electrode leads 11 and 12 are electrically connected to each other by bonding wires 14 and 15, and the light-emitting device 2 is arranged with a gap H between the lead frame 3 and the light-emitting device 2. In this way, it is possible to effectively use light emitted from one surface of the light-emitting device 2 facing the lead frame 3. Therefore, it is possible to improve the utilization efficiency of light emitted from the light-emitting device 2.
    • 本发明提供能够提高亮度和降低功耗的发光装置及其制造方法。 发光装置包括:包括电极焊盘9和10的发光装置2; 以及包括电极引线11和12的引线框架3.电极焊盘9和10以及电极引线11和12通过接合引线14和15彼此电连接,并且发光器件2被布置成间隙 H,从而能够有效地利用从发光装置2的面向引线框3的一个面发射的光。因此,可以提高发光装置 从发光装置2发射的光的利用效率。
    • 8. 发明授权
    • Image pickup device with zoom function
    • 具有变焦功能的摄像设备
    • US07701491B2
    • 2010-04-20
    • US11339274
    • 2006-01-25
    • Yoshinori AbeKazunori YanagiKeiichi Imamura
    • Yoshinori AbeKazunori YanagiKeiichi Imamura
    • H04N5/262
    • H04N1/3875H04N5/23212H04N5/23293H04N5/2628
    • When a continuous-zoom-photographing mode is selected, a through image of a subject and first and second continuous-zoom-photographing frames are produced on an image-display section. When a user operates a cross key, recorded information about a trimming position of each of the first and second continuous-zoom-photographing frames is updated according to the cross-key operation, and the first and second continuous-zoom-photographing frames are produced at the updated trimming position recorded after the update. When a shutter button is operated, still-image photographing is started and obtained image data is stored in a buffer memory. On the basis of the obtained image data, image data is generated for each of the first and second continuous-zoom-photographing frames through trimming processing and stored in the buffer memory. The obtained image data and the generated image data are stored in a flash memory.
    • 当选择连续变焦拍摄模式时,在图像显示部分上产生被摄体的直通图像和第一和第二连续变焦拍摄帧。 当用户操作十字键时,根据交叉键操作更新关于第一和第二连续变焦拍摄帧中的每一个的修剪位置的记录信息,并且产生第一和第二连续变焦拍摄帧 在更新后记录的更新的修剪位置。 当操作快门按钮时,静止图像拍摄开始并且获得的图像数据被存储在缓冲存储器中。 基于所获得的图像数据,通过修剪处理为第一和第二连续变焦拍摄帧中的每一个产生图像数据,并存储在缓冲存储器中。 获得的图像数据和所生成的图像数据被存储在闪速存储器中。
    • 9. 发明授权
    • Image processing apparatus and image processing method
    • 图像处理装置和图像处理方法
    • US07352480B2
    • 2008-04-01
    • US10393463
    • 2003-03-21
    • Yoshinori Abe
    • Yoshinori Abe
    • G06F3/12
    • H04N1/00933H04N1/00204H04N1/32358H04N2201/001H04N2201/0081H04N2201/0082H04N2201/3297
    • An image processing apparatus which comprises a RAM acting as a shared memory for storing image data, and an image processing board, connected to the RAM through a PCI bus acting as a general-purpose bus, for performing raster conversion to the image data and performing a necessary image process to the converted data by using a line memory is provided. In this apparatus, in a case where the image processing board can not input or output the data from or to the PCI bus, it is controlled not to generate a sync signal used for a process in the image processing board, whereby a stable operation is possible in an image forming apparatus and an image processing method which include the image processing apparatus.
    • 一种图像处理装置,包括用作存储图像数据的共享存储器的RAM和通过用作通用总线的PCI总线连接到RAM的图像处理板,用于对图像数据进行光栅转换并执行 提供了通过使用行存储器对转换的数据进行必要的图像处理。 在该装置中,在图像处理板不能从PCI总线输入或输出数据的情况下,控制不产生用于图像处理板中的处理的同步信号,从而稳定的操作是 可能在包括图像处理装置的图像形成装置和图像处理方法中。