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    • 10. 发明授权
    • Composite substrate and method for manufacturing the same
    • 复合基板及其制造方法
    • US08686622B2
    • 2014-04-01
    • US13386854
    • 2010-07-21
    • Hiroki KobayashiYuji HoriYasunori Iwasaki
    • Hiroki KobayashiYuji HoriYasunori Iwasaki
    • H01L41/09H01L41/22
    • H03H3/08Y10T29/42
    • The composite substrate is a substrate used to manufacture an acoustic wave device, and includes a support substrate, a piezoelectric substrate, and a adhesive layer with which the support substrate and the piezoelectric substrate are bonded to each other. In the composite substrate, assuming that a surface of the piezoelectric substrate that is bonded to the support substrate is defined as a first surface and a surface at the side opposite to the first surface is defined as a second surface, the piezoelectric substrate is formed such that the first surface is inside the second surface when the first surface is projected onto the second surface in a direction perpendicular to the second surface. In other words, the composite substrate has an outer peripheral surface that is formed such that the circumference thereof increases toward the top surface of the piezoelectric substrate.
    • 复合衬底是用于制造声波器件的衬底,并且包括支撑衬底,压电衬底和支撑衬底和压电衬底彼此结合的粘合层。 在复合基板中,假定将与支撑基板接合的压电基板的表面定义为第一表面,将与第一表面相反的一侧的表面定义为第二表面,则形成压电基板 当第一表面在垂直于第二表面的方向上投影到第二表面上时,第一表面在第二表面内。 换句话说,复合基板具有外周面,其形成为使得其周向朝向压电基板的顶面增大。