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1. 发明授权

US08809328B2 Imidazole derivative 有权
标题翻译：咪唑衍生物
公开(公告)号：US08809328B2
公开(公告)日：2014-08-19
申请号：US14113730
申请日：2012-04-24
申请人： Hirokazu Kawagishi , Jae-Hoon Choi
发明人： Hirokazu Kawagishi , Jae-Hoon Choi
IPC分类号： A61K31/535 , C07D487/00
CPC分类号： A01N43/90 , C07D487/04 , C12P17/182
摘要： An object of the present invention is to provide a compound that can regulate plant growth. The compound selected from the group consisting of (A) and (B):(A) 3H-imidazo[4,5-d][1,2,3]triazin-4,6(5H,7H)-dione; and(B) 3-methyl-3H-imidazo[4,5-d][1,2,3]triazin-4,6(5H,7H)-dione;has a plant growth regulating action.
摘要翻译：本发明的目的是提供可以调节植物生长的化合物。选自（A）和（B）的化合物：（A）3H-咪唑并[4,5-d] [1,2,3]三嗪-4,6（5H，7H） - 二酮; 和（B）3-甲基-3H-咪唑并[4,5-d] [1,2,3]三嗪-4,6（5H，7H） - 二酮; 具有植物生长调节作用。

2. 发明申请

US20140148598A1 IMIDAZOLE DERIVATIVE 有权
标题翻译：咪唑衍生物
公开(公告)号：US20140148598A1
公开(公告)日：2014-05-29
申请号：US14113730
申请日：2012-04-24
申请人： Hirokazu Kawagishi , Jae-Hoon Choi
发明人： Hirokazu Kawagishi , Jae-Hoon Choi
IPC分类号： A01N43/90
CPC分类号： A01N43/90 , C07D487/04 , C12P17/182
摘要： An object of the present invention is to provide a compound that can regulate plant growth. The compound selected from the group consisting of (A) and (B):(A) 3H-imidazo[4,5-d][1,2,3]triazin-4,6(5H,7H)-dione; and (B) 3-methyl-3H-imidazo[4,5-d][1,2,3]triazin-4,6(5H,7H)-dione; has a plant growth regulating action.
摘要翻译：本发明的目的是提供可以调节植物生长的化合物。选自（A）和（B）的化合物：（A）3H-咪唑并[4,5-d] [1,2,3]三嗪-4,6（5H，7H） - 二酮; 和（B）3-甲基-3H-咪唑并[4,5-d] [1,2,3]三嗪-4,6（5H，7H） - 二酮; 具有植物生长调节作用。

3. 发明授权

US08518859B2 Method for increasing yield of staple food crop 有权
标题翻译：提高主食作物产量的方法
公开(公告)号：US08518859B2
公开(公告)日：2013-08-27
申请号：US13386607
申请日：2010-07-22
申请人： Hirokazu Kawagishi , Akio Morita , Jae-Hoon Choi
发明人： Hirokazu Kawagishi , Akio Morita , Jae-Hoon Choi
IPC分类号： A01N43/46
CPC分类号： A01N43/50 , A01G2/00 , A01N43/90
摘要： Provided is a method of increasing a yield of a staple food crop which comprises bringing a compound represented by the following Formula (I) into contact with a plant body, excluding seeds, of a staple food crop to be cultured. The staple food crop is preferably a cereal crop, a tuber crop or the like. In the following Formula (I), R1 and R2 each independently represent a hydrogen atom or a monovalent substituent, or R1 and R2 are bound together to form an azo group; and R3 represents a hydrogen atom or a monovalent substituent.
摘要翻译：本发明提供一种提高主食作物的产量的方法，其包括使下述式（I）所示的化合物与待培养的主食作物的植物（不包括种子）接触。主食最好是谷类作物，块茎作物等。在下式（I）中，R 1和R 2各自独立地表示氢原子或一价取代基，或者R 1和R 2结合在一起形成偶氮基; R 3表示氢原子或一价取代基。

4. 发明申请

US20120122690A1 Method For Increasing Yield Of Staple Food Crop 有权
标题翻译：提高食品作物产量的方法
公开(公告)号：US20120122690A1
公开(公告)日：2012-05-17
申请号：US13386607
申请日：2010-07-22
申请人： Hirokazu Kawagishi , Akio Morita , Jae-Hoon Choi
发明人： Hirokazu Kawagishi , Akio Morita , Jae-Hoon Choi
IPC分类号： A01N43/90 , A01P21/00
CPC分类号： A01N43/50 , A01G2/00 , A01N43/90
摘要： Provided is a method of increasing a yield of a staple food crop which comprises bringing a compound represented by the following Formula (I) into contact with a plant body, excluding seeds, of a staple food crop to be cultured. The staple food crop is preferably a cereal crop, a tuber crop or the like. In the following Formula (I), R1 and R2 each independently represent a hydrogen atom or a monovalent substituent, or R1 and R2 are bound together to form an azo group; and R3 represents a hydrogen atom or a monovalent substituent.
摘要翻译：本发明提供了提高主食作物的产量的方法，其包括使下述式（I）所示的化合物与待培养的主食作物的植物（不包括种子）接触。主食最好是谷类作物，块茎作物等。在下式（I）中，R 1和R 2各自独立地表示氢原子或一价取代基，或者R 1和R 2结合在一起形成偶氮基; R 3表示氢原子或一价取代基。

5. 发明授权

US08385079B2 Pressure conductive sheet 有权
标题翻译：压力导电片
公开(公告)号：US08385079B2
公开(公告)日：2013-02-26
申请号：US12624552
申请日：2009-11-24
申请人： Jae-Hoon Choi , Jae-Seon Hwang , Hyo-Jae Bang , Hai-Young Lee
发明人： Jae-Hoon Choi , Jae-Seon Hwang , Hyo-Jae Bang , Hai-Young Lee
IPC分类号： H05K7/00
CPC分类号： H01L23/49827 , H01L2224/16225 , H01L2924/3011 , H05K1/025 , H05K3/326 , H05K2201/0133 , H05K2201/09336 , H05K2201/09718 , H05K2201/10378 , H05K2203/0278
摘要： A pressure conductive sheet includes a connector body formed of a thin plate of insulation material, an elastic body deposited as one body with the connector body, pluralities of connection terminals provided with a given interval to pass through the elastic body and the connector body, and a ground plate constituting a matching circuit, the ground plate being buried by a given width in between the connector body and the elastic body. The ground plate is coupled to a ground terminal among the connection terminals and is separated from an outer circumference face of a signal terminal. The connector body, the elastic body, the connection terminals and the ground plate are combined with one another to substantially reduce an interference between signal terminals through the matching circuit formed based on capacitance of a gap between a ground face of the ground plate and the signal terminal, and to improve electrical characteristics.
摘要翻译：压力传导片包括由绝缘材料薄板形成的连接器主体，与连接器本体一体地沉积的弹性体，设置有给定间隔的多个连接端子以穿过弹性体和连接器主体，以及构成匹配电路的接地板，接地板在连接器主体和弹性体之间被掩埋一定宽度。接地板与连接端子之间的接地端子连接，并与信号端子的外周面分离。连接器主体，弹性体，连接端子和接地板彼此组合，以通过基于接地板的接地面和信号之间的间隙的电容形成的匹配电路来大大减小信号端子之间的干扰端子，并提高电气特性。

6. 发明授权

US08070048B2 Method of attaching a solder ball and method of repairing a memory module 有权
标题翻译：连接焊球的方法和修复存储器模块的方法
公开(公告)号：US08070048B2
公开(公告)日：2011-12-06
申请号：US12881439
申请日：2010-09-14
申请人： Nam-Yong Oh , Seong-Chan Han , Jae-Young Kim , Jae-Hoon Choi
发明人： Nam-Yong Oh , Seong-Chan Han , Jae-Young Kim , Jae-Hoon Choi
IPC分类号： B23K1/00
CPC分类号： B23K1/0016 , B23K3/0623 , H01L21/4853 , H01L23/13 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/98 , H01L2224/13017 , H01L2224/13082 , H01L2224/13083 , H01L2224/13109 , H01L2224/13111 , H01L2224/13186 , H01L2224/13562 , H01L2224/13564 , H01L2224/13566 , H01L2224/16058 , H01L2224/48091 , H01L2224/4824 , H01L2224/8102 , H01L2224/81193 , H01L2224/81232 , H01L2224/81359 , H01L2224/81399 , H01L2224/8192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H05K3/225 , H05K3/3436 , H05K3/3494 , H05K2201/10734 , H05K2203/1163 , H05K2203/176 , Y02P70/613 , H01L2924/00014 , H01L2924/01083
摘要： In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat.
摘要翻译：在焊球附着的方法中，将第一材料涂覆在焊球上。将第二材料涂覆在要焊接焊锡球的基板的焊盘上以与第一材料放热反应。焊球与焊盘接触，使得第一材料和第二材料彼此放热反应以释放热量，以使用热将焊球粘附到焊盘。

7. 发明申请

US20110126970A1 METALLIC LAMINATE AND MANUFACTURING METHOD OF CORE SUBSTRATE USING THE SAME 审中-公开
标题翻译：金属层压板和使用其的芯基板的制造方法
公开(公告)号：US20110126970A1
公开(公告)日：2011-06-02
申请号：US12773325
申请日：2010-05-04
申请人： Sang-Youp LEE , Joung-Gul Ryu , Dong-Sun Kim , Jae-Hoon Choi , In-Ho Seo , Joon-Sung Lee
发明人： Sang-Youp LEE , Joung-Gul Ryu , Dong-Sun Kim , Jae-Hoon Choi , In-Ho Seo , Joon-Sung Lee
IPC分类号： B32B38/10 , B32B15/04 , B32B15/00
CPC分类号： B32B15/20 , B32B37/185 , B32B2305/342 , B32B2311/12 , B32B2457/00 , Y10T428/12535
摘要： A metallic laminate and a method of manufacturing a core substrate using the same are disclosed. In accordance with an embodiment of the present invention, the metallic laminate includes an insulation material, a carrier layer, which is stacked on both surfaces of the insulation layer and in which the carrier layer is a metal, and a first metal foil, which is stacked on one surface of the carrier layer. By symmetrically forming two core substrates on either surface above and below the insulation material, each process of forming the core substrate can be performed at the same time in the shape of a pair of facing core substrates, thereby increasing the productivity by twice. The remaining insulation material having the carrier layer stacked thereon can be used as a base substrate that is used to manufacture a printed circuit board, thus preventing unnecessary waste of the insulation material.
摘要翻译：公开了一种金属层压体和使用其的芯基板的制造方法。根据本发明的实施例，金属层压体包括绝缘材料，层叠在绝缘层的两个表面上并且载体层是金属的载体层和第一金属箔层叠在载体层的一个表面上。通过在绝缘材料上方和下方的任一表面对称地形成两个芯基板，形成芯基板的每个工艺可以同时以一对相对的芯基板的形状进行，从而将生产率提高两倍。具有堆叠在其上的载体层的剩余绝缘材料可以用作用于制造印刷电路板的基底，从而防止绝缘材料的不必要的浪费。

8. 发明申请

US20090014503A1 Reflow apparatuses and methods for reflow 审中-公开
标题翻译：回流装置和回流方法
公开(公告)号：US20090014503A1
公开(公告)日：2009-01-15
申请号：US12217862
申请日：2008-07-09
申请人： Jae-Hoon Choi , Seong-Chan Han , Se-Hyung Ryu , Nam-Yong Oh
发明人： Jae-Hoon Choi , Seong-Chan Han , Se-Hyung Ryu , Nam-Yong Oh
IPC分类号： B23K1/005 , B23K3/04 , B23K1/00
CPC分类号： B23K1/008 , B23K2101/40
摘要： There are provided reflow apparatuses and a methods therefor. In some embodiments, a reflow apparatus includes a first heating unit capable of heating a solder on a substrate up to just below before a melting point of the solder at ambient pressure such that the solder on the substrate is melted and electronic components mounted on the substrate are then soldered to the substrate; and a second heating unit connected to the first heating unit, the second heating unit capable of heating the solder on the substrate heated in the first heating unit through at least a portion of a solder melting temperature range in a vacuum state.
摘要翻译：提供回流装置及其方法。在一些实施例中，回流装置包括第一加热单元，其能够在环境压力下在焊料的熔点之前将衬底上的焊料加热到刚刚下面，使得衬底上的焊料熔化并将电子部件安装在衬底上然后被焊接到基材上; 以及连接到第一加热单元的第二加热单元，所述第二加热单元能够通过在真空状态下的焊料熔化温度范围的至少一部分来加热在第一加热单元中加热的基板上的焊料。

9. 发明申请

US20070181993A1 Printed circuit board including reinforced copper plated film and method of fabricating the same 审中-公开
标题翻译：包括增强镀铜膜的印刷电路板及其制造方法
公开(公告)号：US20070181993A1
公开(公告)日：2007-08-09
申请号：US11699498
申请日：2007-01-30
申请人： Jae-Hoon Choi , Kwang-Su Yu , Hyo-Jae Bang , Dong-Chun Lee
发明人： Jae-Hoon Choi , Kwang-Su Yu , Hyo-Jae Bang , Dong-Chun Lee
IPC分类号： H01L23/04
CPC分类号： H05K1/09 , H05K3/241 , H05K3/282 , H05K3/428 , H05K2201/0209 , H05K2201/0215
摘要： A printed circuit board (PCB) may include a substrate. A copper layer may be formed over a portion of the substrate, the copper layer including at least one of a metallic powder and a ceramic powder.
摘要翻译：印刷电路板（PCB）可以包括基板。可以在基板的一部分上形成铜层，铜层包括金属粉末和陶瓷粉末中的至少一种。

10. 发明申请

US20120244726A1 DATA STORAGE DEVICE 有权
标题翻译：数据存储设备
公开(公告)号：US20120244726A1
公开(公告)日：2012-09-27
申请号：US13424858
申请日：2012-03-20
申请人： Young-Hoon Kim , Dong-Chun Lee , Jae-Hoon Choi , Hyung-Mo Hwang
发明人： Young-Hoon Kim , Dong-Chun Lee , Jae-Hoon Choi , Hyung-Mo Hwang
IPC分类号： H01R12/00
CPC分类号： H01R12/7005 , H01R12/718
摘要： A data storage device includes a printed circuit board (PCB), a connection tab, a dummy tab and a guiding member. A memory chip is mounted on the PCB. The connection tab is formed on a first surface of the PCB to electrically connect the PCB with a first cable. The dummy tab is formed on the first surface of the PCB. The guiding member is formed on the dummy tab to guide an insertion direction of the first cable. Thus, the data storage device without a separate connector may be manufactured by a relatively simple process at a lower cost.
摘要翻译：数据存储装置包括印刷电路板（PCB），连接片，虚拟片和引导件。存储芯片安装在PCB上。连接片形成在PCB的第一表面上，以将PCB与第一电缆电连接。虚设凸片形成在PCB的第一表面上。引导构件形成在虚拟翼片上以引导第一缆线的插入方向。因此，没有单独的连接器的数据存储装置可以通过相对简单的过程以较低的成本制造。

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