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1. 发明授权

US5560785A Method for forming a protective chemical layer on copper and copper alloy surfaces 失效
标题翻译：在铜和铜合金表面上形成保护化学层的方法
公开(公告)号：US5560785A
公开(公告)日：1996-10-01
申请号：US520477
申请日：1995-08-29
申请人： Hirohiko Hirao , Yoshimasa Kikukawa , Toshihiro Okamoto , Takayuki Murai , Seiji Sogabe , Miya Tanioka , Rie Nakayama , Takashi Yoshioka
发明人： Hirohiko Hirao , Yoshimasa Kikukawa , Toshihiro Okamoto , Takayuki Murai , Seiji Sogabe , Miya Tanioka , Rie Nakayama , Takashi Yoshioka
IPC分类号： C23F11/10 , C23F11/14 , H05K3/28 , C23C22/06
CPC分类号： C23F11/149 , C23F11/10 , H05K3/282
摘要： A water-based surface treatment agent is used to provide a chemical layer on a copper or copper alloy printing wiring board (PWB). The chemical layer shows excellent heat-resistance and moisture-resistance. The treated PWB maintains excellent solderability for extended lengths of time. The water-based surface treatment agent contains as an active ingredient 2,4-diphenylimidazole, 2,4-diphenyl-5-methylimidazole or 2-phenyl-4-benzyl-5-methylimidazole. The treating compositions with a lower carboxylic acid of up to 4 carbon atoms are soluble in water, and have improved solder wetting properties and improved solder paste spreading property. A copper compound may be included in the aqueous solution to increase the rate at which the chemical layer is formed.
摘要翻译：使用水性表面处理剂在铜或铜合金印刷线路板（PWB）上提供化学层。化学层显示出优异的耐热性和耐湿性。经处理的PWB在延长的时间内保持优异的可焊性。水性表面处理剂含有作为活性成分的2,4-二苯基咪唑，2,4-二苯基-5-甲基咪唑或2-苯基-4-苄基-5-甲基咪唑。具有最多4个碳原子的低级羧酸的处理组合物可溶于水，并且具有改善的焊料润湿性能和改善的焊膏扩散性能。可以在水溶液中包含铜化合物以增加形成化学层的速率。

2. 发明授权

US5498301A Agent for treating surfaces of copper and copper alloys 失效
标题翻译：铜和铜合金表面处理剂
公开(公告)号：US5498301A
公开(公告)日：1996-03-12
申请号：US239557
申请日：1994-05-09
申请人： Hirohiko Hirao , Yoshimasa Kikukawa , Toshihiro Okamoto , Takayuki Murai , Seiji Sogabe , Miya Tanioka , Rie Nakayama , Takashi Yoshioka
发明人： Hirohiko Hirao , Yoshimasa Kikukawa , Toshihiro Okamoto , Takayuki Murai , Seiji Sogabe , Miya Tanioka , Rie Nakayama , Takashi Yoshioka
IPC分类号： C23F11/10 , C23F11/14 , H05K3/28 , C23C22/06
CPC分类号： C23F11/149 , C23F11/10 , H05K3/282
摘要： An water-based surface treatment agent used for the copper on a printed wiring board (PWB). Chemical layer formed on PWB shows excellent heat-resistance and moisture-resistance; therefore, the treated PWB preserves excellent soldability for a long time. The water-based surface treatment agent contains, as an active ingredient, a 2-arylimidazole compound represented by the following formula, ##STR1## wherein R is a hydrogen atom or a methyl group, R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, and R3 and R4 are hydrogen atoms, lower alkyl groups, halogen atoms, lower alkoxy groups, di-lower alkylamino groups, cyano groups or nitro groups, ##STR2## wherein R is a hydrogen atom or a methyl group, and R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, but excluding the case where R, R1 and R2 are all hydrogen atoms.
摘要翻译：用于印刷电路板（PWB）上的铜的水性表面处理剂。在PWB上形成的化学层具有优异的耐热性和耐湿性; 因此，处理后的PWB长时间保持优异的可售性。水性表面处理剂含有作为活性成分的下式表示的2-芳基咪唑化合物，其中R是氢原子或甲基，R 1和R 2是氢原子，低级烷基或卤素原子，R3和R4是氢原子，低级烷基，卤原子，低级烷氧基，二低级烷基氨基，氰基或硝基，其中R是氢原子或甲基，R1 并且R 2是氢原子，低级烷基或卤素原子，但不包括R 1，R 2和R 2都是氢原子的情况。

3. 发明授权

US08378116B2 Phenylnaphthylimidazole compound and usage of the same 有权
标题翻译：苯基萘基咪唑化合物及其用途
公开(公告)号：US08378116B2
公开(公告)日：2013-02-19
申请号：US13449006
申请日：2012-04-17
申请人： Hirohiko Hirao , Yoshimasa Kikukawa , Takayuki Murai
发明人： Hirohiko Hirao , Yoshimasa Kikukawa , Takayuki Murai
IPC分类号： C07D233/56 , C23C22/05
CPC分类号： C07D233/64 , B23K35/007 , C23C22/52 , H05K3/282 , H05K2203/124
摘要： A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.
摘要翻译：含有下式所示的新型苯基萘基咪唑化合物的表面处理剂与铜或铜合金的表面接触。在该式中，当A 1为苯基时，A 2表示1-萘基或2-萘基，A 1为1-萘基或2-萘基时，A 2表示苯基。 R表示氢原子或甲基。

4. 发明申请

US20120199385A1 PHENYLNAPHTHYLIMIDAZOLE COMPOUND AND USAGE OF THE SAME 有权
标题翻译：苯并咪唑类化合物及其用途
公开(公告)号：US20120199385A1
公开(公告)日：2012-08-09
申请号：US13449006
申请日：2012-04-17
申请人： Hirohiko Hirao , Yoshimasa Kikukawa , Takayuki Murai
发明人： Hirohiko Hirao , Yoshimasa Kikukawa , Takayuki Murai
IPC分类号： H05K1/09 , B23K31/02 , B23K1/20
CPC分类号： C07D233/64 , B23K35/007 , C23C22/52 , H05K3/282 , H05K2203/124
摘要： A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.
摘要翻译：含有下式所示的新型苯基萘基咪唑化合物的表面处理剂与铜或铜合金的表面接触。在该式中，当A 1为苯基时，A 2表示1-萘基或2-萘基，A 1为1-萘基或2-萘基时，A 2表示苯基。 R表示氢原子或甲基。

5. 发明申请

US20070113930A1 Novel imidazole compound and use thereof 有权
标题翻译：新型咪唑化合物及其用途
公开(公告)号：US20070113930A1
公开(公告)日：2007-05-24
申请号：US10548544
申请日：2004-03-18
申请人： Takayuki Murai , Yoshimasa Kikukawa , Hirohiko Hirao
发明人： Takayuki Murai , Yoshimasa Kikukawa , Hirohiko Hirao
IPC分类号： B23K35/34
CPC分类号： C07D233/64 , B23K35/3615 , B23K35/3616 , C23C22/52 , C23F11/149 , H05K3/282 , H05K2203/124
摘要： A water-based composition for treating copper or copper alloy surface for lead-free soldering, the composition comprising a compound represented by general formula (1): wherein R1 is hydrogen or methyl, and either R2 and R3 represent chlorine and R4 and R5 represent hydrogen, or R2 and R3 represent hydrogen and R4 and R5 represent chlorine.
摘要翻译：一种用于无铜焊接处理铜或铜合金表面的水性组合物，该组合物包含由通式（1）表示的化合物：其中R 1是氢或甲基， SUP> 2和R 3表示氯，R 4和R 5表示氢或R 2， SUP>和R 3代表氢，R 4和R 5代表氯。

6. 发明授权

US08183386B2 Phenylnaphthylimidazole compound and usage of the same 有权
标题翻译：苯基萘基咪唑化合物及其用途
公开(公告)号：US08183386B2
公开(公告)日：2012-05-22
申请号：US11629179
申请日：2005-06-08
申请人： Hirohiko Hirao , Yoshimasa Kikukawa , Takayuki Murai
发明人： Hirohiko Hirao , Yoshimasa Kikukawa , Takayuki Murai
IPC分类号： C07D233/56 , C23C22/05
CPC分类号： C07D233/64 , B23K35/007 , C23C22/52 , H05K3/282 , H05K2203/124
摘要： A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.
摘要翻译：含有下式所示的新型苯基萘基咪唑化合物的表面处理剂与铜或铜合金的表面接触。在该式中，当A 1为苯基时，A 2表示1-萘基或2-萘基，A 1为1-萘基或2-萘基时，A 2表示苯基。 R表示氢原子或甲基。

7. 发明授权

US07754105B2 Water-soluble preflux and usage of the same 有权
标题翻译：水溶性前驱物和使用相同
公开(公告)号：US07754105B2
公开(公告)日：2010-07-13
申请号：US11914138
申请日：2006-05-23
申请人： Hirohiko Hirao , Yoshimasa Kikukawa , Takayuki Murai
发明人： Hirohiko Hirao , Yoshimasa Kikukawa , Takayuki Murai
IPC分类号： C23F11/10 , C23F11/12 , C23F11/14 , B23K35/362 , B23K1/20 , B23K5/213 , B23K20/24 , B23K31/02 , B05D5/12 , B23B15/04
CPC分类号： B23K35/362 , B23K35/3613 , C23F11/149 , H05K3/282 , H05K2203/0786 , Y10T428/31678
摘要： It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux.
摘要翻译：本发明的目的是提供一种水溶性前驱物，其含有将咪唑化合物溶解在水中的性能优异的低挥发性增溶剂，能够提供咪唑化合物的优异的成膜性，还提供了一种治疗方法用于金属导电部件的表面，其包括使表面与上述水溶性前流体接触。

8. 发明授权

US07661577B2 Imidazole compound and use thereof 有权
标题翻译：咪唑化合物及其用途
公开(公告)号：US07661577B2
公开(公告)日：2010-02-16
申请号：US10548544
申请日：2004-03-18
申请人： Takayuki Murai , Yoshimasa Kikukawa , Hirohiko Hirao
发明人： Takayuki Murai , Yoshimasa Kikukawa , Hirohiko Hirao
IPC分类号： B23K1/20
CPC分类号： C07D233/64 , B23K35/3615 , B23K35/3616 , C23C22/52 , C23F11/149 , H05K3/282 , H05K2203/124
摘要： A water-based composition for treating copper or copper alloy surface for lead-free soldering, the composition comprising a compound represented by general formula (1): wherein R1 is hydrogen or methyl, and either R2 and R3 represent chlorine and R4 and R5 represent hydrogen, or R2 and R3 represent hydrogen and R4 and R5 represent chlorine.
摘要翻译：一种用于无铜焊接处理铜或铜合金表面的水性组合物，所述组合物包含由通式（1）表示的化合物：其中R1是氢或甲基，R2和R3表示氯，R4和R5表示氢或R 2和R 3表示氢，R 4和R 5表示氯。

9. 发明申请

US20080318070A1 Water-Soluble Preflux and Usage of the Same 有权
标题翻译：水溶性预流量及其用途
公开(公告)号：US20080318070A1
公开(公告)日：2008-12-25
申请号：US11914138
申请日：2006-05-23
申请人： Hirohiko Hirao , Yoshimasa Kikukawa , Takayuki Murai
发明人： Hirohiko Hirao , Yoshimasa Kikukawa , Takayuki Murai
IPC分类号： B32B15/04 , B23K35/22 , B23K1/20
CPC分类号： B23K35/362 , B23K35/3613 , C23F11/149 , H05K3/282 , H05K2203/0786 , Y10T428/31678
摘要： It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux.Another object is to provide a printed wiring board wherein the surface of a metal conductive part has been brought into contact with the above water-soluble preflux and a soldering method which comprises bringing the surface of a metal conductive part into contact with the above water-soluble preflux and subsequently soldering the surface.A water-soluble preflux comprising an imidazole compound and a carboxylic acid compound having 4 to 16 carbon atoms represented by the following general formula 1: wherein R1 represents a linear or branched alkyl group having 1 to 4 carbon atoms, R2 represents a hydrogen atom or a methyl group, m represents an integer of 0 to 3, and n represents 1 or 2.
摘要翻译：本发明的目的是提供一种水溶性前驱物，其含有将咪唑化合物溶解在水中的性能优异的低挥发性增溶剂，能够提供咪唑化合物的优异的成膜性，还提供了一种处理方法用于金属导电部件的表面，其包括使表面与上述水溶性前流体接触。另一个目的是提供一种印刷电路板，其中金属导电部件的表面已经与上述水溶性前流体接触，并且包括使金属导电部件的表面与上述水溶性前流体接触的焊接方法，可溶性前流体并随后焊接表面。一种包含咪唑化合物和由以下通式1表示的具有4至16个碳原子的羧酸化合物的水溶性前通路：其中R 1表示具有1至4个碳原子的直链或支链烷基，R 2表示氢原子或甲基，m表示0〜3的整数，n表示1或2。

10. 发明申请

US20070246134A1 Phenylnaphthylimidazole Compound and Usage of the Same 有权
标题翻译：苯基萘基咪唑化合物及其用途
公开(公告)号：US20070246134A1
公开(公告)日：2007-10-25
申请号：US11629179
申请日：2005-06-08
申请人： Hirohiko Hirao , Yoshimasa Kikukawa , Takayuki Murai
发明人： Hirohiko Hirao , Yoshimasa Kikukawa , Takayuki Murai
IPC分类号： B23K35/24 , C07D235/08 , H05K1/11
CPC分类号： C07D233/64 , B23K35/007 , C23C22/52 , H05K3/282 , H05K2203/124
摘要： A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.
摘要翻译：含有下式所示的新型苯基萘基咪唑化合物的表面处理剂与铜或铜合金的表面接触。在该式中，当A 1是苯基时，则A 2代表1-萘基或2-萘基，当A 1 < / SUB>为1-萘基或2-萘基，则A 2代表苯基; R表示氢原子或甲基。

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