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1. 发明申请

US20130199818A1 RADIATION CURABLE RESIN COMPOSITION FOR ELECTRICAL WIRE 审中-公开
标题翻译：用于电线的辐射可固化树脂组合物
公开(公告)号：US20130199818A1
公开(公告)日：2013-08-08
申请号：US13814023
申请日：2011-07-21
申请人： Hirofumi Uchida , Hirokazu Imai , Yuutoku Yamashita , Takahiko Kurosawa
发明人： Hirofumi Uchida , Hirokazu Imai , Yuutoku Yamashita , Takahiko Kurosawa
IPC分类号： C09D133/14
CPC分类号： C09D133/14 , C08F220/18 , C08F220/58 , C08F226/08 , C08F2222/1086 , C08G18/4808 , C08G18/4879 , C08G18/672 , C08L75/16 , C09D4/00 , H01B3/44 , C08G18/48
摘要： The invention relates to a radiation curable resin composition for forming a coating layer for electrical wire; wherein the electrical wire is destined for use as automotive electrical wire. In addition, this invention relates to a radiation curable resin composition for forming a coating layer for telephone cable and electrical wire for connecting between electronic devices and inside electronic devices. The resin composition includes the following: (A) a urethane (meth)acrylate having a hard segment derived from an aromatic polyol and a soft segment derived from an aliphatic polyol in a single molecule; (B) a compound with a cyclic structure and one ethylenic unsaturated group; and (C) a radiation polymerization initiator.
摘要翻译：本发明涉及一种用于形成电线涂层的辐射固化树脂组合物，其中电线用作汽车电线。另外，本发明涉及一种用于形成用于电子设备和内部电子设备之间连接的电话电缆和电线用涂层的辐射固化树脂组合物。树脂组合物包括：（A）具有衍生自芳族多元醇的硬链段的氨基甲酸酯（甲基）丙烯酸酯和单分子中衍生自脂族多元醇的软链段; （B）具有环状结构和1个烯属不饱和基团的化合物; 和（C）辐射聚合引发剂。

2. 发明申请

US20120321270A1 D1499 RADIATION CURABLE RESIN COMPOSITION 审中-公开
标题翻译： D1499可辐射固化树脂组合物
公开(公告)号：US20120321270A1
公开(公告)日：2012-12-20
申请号：US13517216
申请日：2010-12-22
申请人： Hirokazu Imai , Yuutoku Yamashita , Hiroshi Yamaguchi , Takahiko Kurosawa
发明人： Hirokazu Imai , Yuutoku Yamashita , Hiroshi Yamaguchi , Takahiko Kurosawa
IPC分类号： C09D175/14 , C09D143/04 , G02B6/00
CPC分类号： C03C25/106 , C03C25/1065 , C08F290/147 , C08G18/10 , C08G18/672 , C09D175/16 , G02B6/02395 , G02B6/036 , C08G18/2825 , C08G18/48 , C08G18/42
摘要： A radiation curable resin composition, containing (A) urethane oligomer containing the reactants of an aliphatic polyester or polyether diol and a diisocyanate and a monohydric alcohol, or urethane oligomer obtained by reacting the reactants of an aliphatic polyester or polyether diol and a diisocyanate with a monohydric alcohol and then reacting a hydroxyl group-containing (meth)acrylate, and (B) monofunctional acrylic monomer, and the contained quantity of (C) polyfunctional acrylic monomer is 2 mass % or less is described and claimed.
摘要翻译：含有（A）含有脂肪族聚酯或聚醚二醇与二异氰酸酯和一元醇的反应物的氨基甲酸酯低聚物或通过使脂肪族聚酯或聚醚二醇与二异氰酸酯的反应物与二异氰酸酯反应得到的氨基甲酸酯低聚物的辐射固化型树脂组合物，一元醇，然后使含羟基的（甲基）丙烯酸酯和（B）单官能丙烯酸类单体反应，并且含有（C）多官能丙烯酸类单体的含量为2质量％以下。

3. 发明授权

US07736748B2 Insulating-film-forming composition, method of producing the same, silica-based insulating film, and method of forming the same 失效
标题翻译：绝缘膜形成用组合物及其制造方法，二氧化硅系绝缘膜及其形成方法
公开(公告)号：US07736748B2
公开(公告)日：2010-06-15
申请号：US11580959
申请日：2006-10-16
申请人： Masahiro Akiyama , Hisashi Nakagawa , Takahiko Kurosawa , Atsushi Shiota
发明人： Masahiro Akiyama , Hisashi Nakagawa , Takahiko Kurosawa , Atsushi Shiota
IPC分类号： B32B27/00 , B32B9/04 , C08L83/00 , C08G77/04
CPC分类号： C08L83/14 , C08G77/50 , C08G77/60 , C09D183/14 , H01B3/30 , H01L21/02126 , H01L21/0234 , H01L21/02348 , H01L21/02351 , H01L21/3121 , Y10T428/31663
摘要： An insulating-film-forming composition including an organic solvent and a hydrolysis-condensation product which is obtained by hydrolysis and condensation of a component (A) in the presence of a component (B).
摘要翻译：一种绝缘膜形成组合物，其包含通过在（B）成分的存在下水解和缩合组分（A）而获得的有机溶剂和水解缩合产物。

4. 发明授权

US07556860B2 Laminate and method of forming the same, insulating film, and semiconductor device 有权
标题翻译：层叠体及其形成方法，绝缘膜和半导体器件
公开(公告)号：US07556860B2
公开(公告)日：2009-07-07
申请号：US11410895
申请日：2006-04-26
申请人： Masahiro Akiyama , Seitaro Hattori , Takahiko Kurosawa , Manabu Sekiguchi , Terukazu Kokubo , Michihiro Mita , Tatsuya Yamanaka , Masaki Obi
发明人： Masahiro Akiyama , Seitaro Hattori , Takahiko Kurosawa , Manabu Sekiguchi , Terukazu Kokubo , Michihiro Mita , Tatsuya Yamanaka , Masaki Obi
IPC分类号： B32B9/04 , B32B27/00 , C08L83/04
CPC分类号： H01L21/02118 , C09D183/14 , H01L21/02126 , H01L21/022 , H01L21/02216 , H01L21/02282 , H01L21/3122 , H01L21/76801 , H01L21/76825 , H01L21/76828 , H01L21/76829 , H01L21/76832 , Y10T428/1014 , Y10T428/31663
摘要： A laminate including: a first silica-based film; a second silica-based film; and an organic film, wherein the second silica-based film includes an organic group containing a carbon-carbon double bond or a carbon-carbon triple bond. A method of forming the laminate includes: forming a first coating for a first silica-based film on a substrate; forming a second coating for a second silica-based film on the first coating, the second coating including an organic group containing a carbon-carbon double bond or a carbon-carbon triple bond; forming a third coating for an organic film on the second coating; and curing a multilayer film including the first to third coatings.
摘要翻译：一种层压体，包括：第一二氧化硅基膜; 第二硅胶膜; 和有机膜，其中所述第二二氧化硅基膜包括含有碳 - 碳双键或碳 - 碳三键的有机基团。形成层压体的方法包括：在基材上形成用于第一二氧化硅基膜的第一涂层; 在第一涂层上形成第二二氧化硅基膜的第二涂层，第二涂层包括含有碳 - 碳双键或碳 - 碳三键的有机基团; 在第二涂层上形成用于有机膜的第三涂层; 以及固化包括第一至第三涂层的多层膜。

5. 发明申请

US20070031687A1 Insulating-film-forming composition, method of producing the same, silica-based insulating film, and method of forming the same 失效
标题翻译：绝缘膜形成用组合物及其制造方法，二氧化硅系绝缘膜及其形成方法
公开(公告)号：US20070031687A1
公开(公告)日：2007-02-08
申请号：US11580959
申请日：2006-10-16
申请人： Masahiro Akiyama , Hisashi Nakagawa , Takahiko Kurosawa , Atsushi Shiota
发明人： Masahiro Akiyama , Hisashi Nakagawa , Takahiko Kurosawa , Atsushi Shiota
IPC分类号： B32B27/00 , C08L83/00 , C08G77/04 , B32B9/04
CPC分类号： C08L83/14 , C08G77/50 , C08G77/60 , C09D183/14 , H01B3/30 , H01L21/02126 , H01L21/0234 , H01L21/02348 , H01L21/02351 , H01L21/3121 , Y10T428/31663
摘要： An insulating-film-forming composition including an organic solvent and a hydrolysis-condensation product which is obtained by hydrolysis and condensation of a component (A) in the presence of a component (B).
摘要翻译：一种绝缘膜形成组合物，其包含通过在（B）成分的存在下水解和缩合组分（A）而获得的有机溶剂和水解缩合产物。

6. 发明授权

US06410151B1 Composition for film formation, method of film formation, and insulating film 有权
标题翻译：用于成膜的成分，成膜方法和绝缘膜
公开(公告)号：US06410151B1
公开(公告)日：2002-06-25
申请号：US09670547
申请日：2000-09-27
申请人： Takahiko Kurosawa , Eiji Hayashi , Seo Youngsoon , Atsushi Shiota , Kinji Yamada
发明人： Takahiko Kurosawa , Eiji Hayashi , Seo Youngsoon , Atsushi Shiota , Kinji Yamada
IPC分类号： B32B904
CPC分类号： H01L21/3122 , C09D183/04 , C09D183/14 , H01L21/02126 , H01L21/02216 , H01L21/02282 , Y10T428/31663 , C08L83/00
摘要： A polyorganosiloxane-based composition for film formation which gives a film having low dielectric constant and high modulus of elasticity and useful as an interlayer insulating film in semiconductor devices and the like. The composition for film formation comprises: (A) a product of hydrolysis and condensation obtained by hydrolyzing and condensing, in the presence of an alkali catalyst, at least one member selected from the group consisting of compounds (1) represented by RaSi (OR1)4−a (wherein R represents hydrogen, fluorine, or a monovalent organic group; R1 represents a monovalent organic group; and a Is an integer of 1 or 2), compounds (2) represented by Si(OR2)4 (wherein R2 represents a monovalent organic group), and compounds (3) represented by R3b(R4O)3−bSi—(R7)d—Si(OR5)3−cR6c [wherein R3 to R6 may be the same or different and each represent a monovalent organic group; b and c may be the same or different and each are an integer of 0 to 2; R7 represents oxygen, phenylene, or a group represented by —(CH2)n—, wherein n is an integer of 1 to 6; and d is 0 or 1]; and (B) a product of hydrolysis and condensation obtained by hydrolyzing and condensing, in the presence of a metal chelate compound catalyst, at least one member selected from the group consisting of the compounds (1), (2), and (3).
摘要翻译：一种用于成膜的聚有机硅氧烷基组合物，其具有低介电常数和高弹性模量的膜，并且可用作半导体器件等中的层间绝缘膜。用于成膜的组合物包括：（A）水解和在碱催化剂存在下，通过水解和缩合得到的缩合物，所述缩合物选自由RaSi（OR 1）4-a（其中R表示氢，氟或一价有机物）表示的化合物（1）中的至少一种基团; R1表示一价有机基团，Is表示1或2的整数），由Si（OR 2）4表示的化合物（2）（其中，R2表示一价有机基团），R3b（ R4O）3-bSi-（R7）d-Si（OR5）3-cR6c [其中R3至R6可以相同或不同，各自表示一价有机基团; b和c可以相同或不同，各自为0〜2的整数; R7表示氧，亚苯基或由 - （CH2）n-表示的基团，其中n为1至6的整数; 和d为0或1]; 和（B）在金属螯合化合物催化剂存在下，通过水解和缩合得到的水解和缩合产物，选自化合物（1），（2）和（3）中的至少一种，。

7. 发明授权

US08404786B2 Polymer and process for producing the same, composition for forming insulating film, and insulating film and method of forming the same 有权
标题翻译：聚合物及其制造方法，用于形成绝缘膜的组合物和绝缘膜及其形成方法
公开(公告)号：US08404786B2
公开(公告)日：2013-03-26
申请号：US12717225
申请日：2010-03-04
申请人： Masahiro Akiyama , Takahiko Kurosawa , Hisashi Nakagawa , Atsushi Shiota
发明人： Masahiro Akiyama , Takahiko Kurosawa , Hisashi Nakagawa , Atsushi Shiota
IPC分类号： C08G77/60
CPC分类号： C08G77/42 , C08G77/48 , C09D183/14 , H01B3/30 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/02337 , H01L21/02348 , H01L21/02351 , H01L21/3122 , H01L21/31633
摘要： A process for producing a polymer includes mixing (A) a polysiloxane compound and (B) a polycarbosilane compound in the presence of a catalyst, water, and an organic solvent, and heating the mixture.
摘要翻译：制备聚合物的方法包括在催化剂，水和有机溶剂的存在下混合（A）聚硅氧烷化合物和（B）聚碳硅烷化合物，并加热该混合物。

8. 发明申请

US20120055693A1 KIT FOR PREPARING WATER-SEALING MATERIAL FOR ELECTRICAL WIRE, WATER-SEALING MATERIAL FOR ELECTRICAL WIRE, WATER-SEALING MEMBER, WATER-SEALED ELECTRICAL WIRE, AND WATER-SEALING METHOD 审中-公开
标题翻译：用于电线水封封材料，电线密封材料，水封封水封电线和水密封方法的工具包
公开(公告)号：US20120055693A1
公开(公告)日：2012-03-08
申请号：US13318847
申请日：2010-05-13
申请人： Hiroshi Yamaguchi , Katsuyuki Takase , Kazuyuki Kondou , Takahiko Kurosawa
发明人： Hiroshi Yamaguchi , Katsuyuki Takase , Kazuyuki Kondou , Takahiko Kurosawa
IPC分类号： H01B3/00 , H01B19/04 , C09J175/16 , C08L75/16 , C09J4/02
CPC分类号： H02G15/003 , C08F283/008 , C09J4/06 , H01B19/04 , Y02A30/14
摘要： A kit for preparing a water-sealing agent, a water-sealing material for an electrical wire, a water-sealed electrical wire, and a water-sealing method, which are used for insulated wires and the like.A kit for preparing water-sealing material for electrical wire comprising compositions (I) and (II), wherein the water-sealing material for electrical wire is prepared by mixing them in an arbitrary ratio. (I): a liquid composition containing one or more components selected from the following components (A) to (C), and (D), without containing (E). (II): a liquid composition containing one or more components selected from the following components (A) to (C), and (E), without containing (D). (A) a urethane (meth)acrylate, (B) a compound having one ethylenically unsaturated group, (C) a radiation polymerization initiator, (D) an organic peroxide, and (E) a polymerization promotor; and water-sealing material for electrical wire: which is a liquid curing composition containing 5 to 50% by mass of (A), 30 to 90% by mass of (B), 0.01 to 10% by mass of (C), 0.1 to 5% by mass of (D), and 0.01 to 0.5% by mass of (E).
摘要翻译：用于绝缘电线等的用于制备水密封剂的试剂盒，电线用水密封材料，水密电线和水密封方法。一种用于制备用于电线的水封材料的试剂盒，其包含组合物（I）和（II），其中电线用水封材料是通过以任意比例混合而制备的。（I）：含有选自以下成分（A）〜（C）和（D）中的一种以上成分的液体组合物，不含（E）。（II）：含有选自以下成分（A）〜（C）和（E））中的一种以上成分的液体组合物，不含（D）。（A）氨基甲酸酯（甲基）丙烯酸酯，（B）具有一个烯属不饱和基团的化合物，（C）辐射聚合引发剂，（D）有机过氧化物和（E）聚合促进剂; （A）5〜50质量％，（B）为30〜90质量％，（C）为0.01〜10质量％，（C）为0.1〜10质量％的液体固化组合物，〜（D）的5质量％，（E）的0.01〜0.5质量％。

9. 发明申请

US20080038527A1 Method for Forming Organic Silica Film, Organic Silica Film, Wiring Structure, Semiconductor Device, and Composition for Film Formation 审中-公开
标题翻译：用于形成有机硅膜，有机硅膜，接线结构，半导体器件和用于成膜的组合物的方法
公开(公告)号：US20080038527A1
公开(公告)日：2008-02-14
申请号：US11596188
申请日：2005-05-11
申请人： Masahiro Akiyama , Takahiko Kurosawa , Hisashi Nakagawa , Atsushi Shiota
发明人： Masahiro Akiyama , Takahiko Kurosawa , Hisashi Nakagawa , Atsushi Shiota
IPC分类号： B05D3/02 , B32B27/28 , C08G77/04
CPC分类号： H01L21/02126 , C09D183/14 , H01B3/46 , H01L21/02211 , H01L21/02216 , H01L21/02282 , H01L21/02351 , H01L21/31058 , H01L21/31633
摘要： A method of forming an organic silica film capable of efficiently curing a coating at a lower dose of electron beams in a shorter time at a lower temperature and forming a film which may be suitably used as an interlayer dielectric for semiconductor devices and the like and exhibits a low relative dielectric constant and excellent mechanical strength, adhesion, plasma resistance, and chemical resistance, a film-forming composition used for the method, an organic silica film obtained by the method, a wiring structure including the organic silica film, and a semiconductor device including the wiring structure. A method of forming an organic silica film according to the invention includes forming a coating including a silicon compound having an —Si—O—Si— structure and an —Si—CH2—Si— structure on a substrate, heating the coating, and curing the coating by applying electron beams.
摘要翻译：一种形成有机二氧化硅膜的方法，其能够在较低温度下在较短时间内以较低剂量的电子束有效地固化涂层，并形成适合用作半导体器件等的层间电介质的膜，并且显示出低相对介电常数和优异的机械强度，粘附性，等离子体电阻和耐化学性，用于该方法的成膜组合物，通过该方法获得的有机二氧化硅膜，包含有机二氧化硅膜的布线结构和半导体装置包括布线结构。根据本发明的形成有机二氧化硅膜的方法包括在a上形成包含具有-Si-O-Si-结构和-Si-CH 2 -Si-结构的硅化合物的涂层衬底，加热涂层，并通过施加电子束固化涂层。

10. 发明申请

US20060216531A1 Laminate and method of forming the same, insulating film, and semiconductor device 有权
公开(公告)号：US20060216531A1
公开(公告)日：2006-09-28
申请号：US11410895
申请日：2006-04-26
申请人： Masahiro Akiyama , Seitaro Hattori , Takahiko Kurosawa , Manabu Sekiguchi , Terukazu Kokubo , Michihiro Mita , Tatsuya Yamanaka , Masaki Obi
发明人： Masahiro Akiyama , Seitaro Hattori , Takahiko Kurosawa , Manabu Sekiguchi , Terukazu Kokubo , Michihiro Mita , Tatsuya Yamanaka , Masaki Obi
IPC分类号： B32B27/00 , B32B9/04 , C08L83/04
CPC分类号： H01L21/02118 , C09D183/14 , H01L21/02126 , H01L21/022 , H01L21/02216 , H01L21/02282 , H01L21/3122 , H01L21/76801 , H01L21/76825 , H01L21/76828 , H01L21/76829 , H01L21/76832 , Y10T428/1014 , Y10T428/31663
摘要： A laminate including: a first silica-based film; a second silica-based film; and an organic film, wherein the second silica-based film includes an organic group containing a carbon-carbon double bond or a carbon-carbon triple bond. A method of forming the laminate includes: forming a first coating for a first silica-based film on a substrate; forming a second coating for a second silica-based film on the first coating, the second coating including an organic group containing a carbon-carbon double bond or a carbon-carbon triple bond; forming a third coating for an organic film on the second coating; and curing a multilayer film including the first to third coatings.

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