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1. 发明授权

US08309295B2 Photosensitive insulating resin composition, hardening product thereof, and circuit board equipped therewith 有权
标题翻译：光敏性绝缘树脂组合物，其硬化产物和配备有它们的电路板
公开(公告)号：US08309295B2
公开(公告)日：2012-11-13
申请号：US12438133
申请日：2007-07-30
申请人： Hirofumi Sasaki , Atsushi Ito , Takashi Nishioka , Hirofumi Goto
发明人： Hirofumi Sasaki , Atsushi Ito , Takashi Nishioka , Hirofumi Goto
IPC分类号： H05K1/00 , G03F7/004
CPC分类号： H01L21/02118 , G03F7/0233 , G03F7/0388 , H01L21/02282 , H01L21/312 , H05K3/0023 , H05K3/287 , H05K3/4676 , H05K2201/0212
摘要： A photosensitive insulating resin composition capable of forming an interlayer insulating film, or planarized film, or surface protective film, or insulating film for high-density mount substrate excelling in properties, such as resolution, adherence, thermal impact, electrical insulation, patterning performance and elongation; a hardening product thereof; and a circuit board equipped with the hardening product. There is provided a positive photosensitive insulating resin composition comprising an alkali-soluble resin; a compound having a quinonediazido group; and crosslinked resin particles of a particulate copolymer whose 20 to 90 mol % constituent is derived from a hydroxylated and/or carboxylated monomer.
摘要翻译：一种能够形成层间绝缘膜或平坦化膜或表面保护膜的感光绝缘树脂组合物或用于高分辨率，粘附性，热冲击，电绝缘性，图案化性能等性能优异的高密度安装基板的绝缘膜，伸长; 其硬化产物; 以及配备有硬化产品的电路板。提供一种包含碱溶性树脂的正性感光绝缘树脂组合物; 具有醌二叠氮基的化合物; 和20〜90摩尔％成分衍生自羟基化和/或羧化单体的颗粒状共聚物的交联树脂颗粒。

2. 发明申请

US20100276186A1 PHOTOSENSITIVE INSULATING RESIN COMPOSITION, HARDENING PRODUCT THEREOF, AND CIRCUIT BOARD EQUIPPED THEREWITH 有权
标题翻译：光敏绝缘树脂组合物，其硬化产品及其配备的电路板
公开(公告)号：US20100276186A1
公开(公告)日：2010-11-04
申请号：US12438133
申请日：2007-07-30
申请人： Hirofumi Sasaki , Atsushi Ito , Takashi Nishioka , Hirofumi Goto
发明人： Hirofumi Sasaki , Atsushi Ito , Takashi Nishioka , Hirofumi Goto
IPC分类号： H05K1/00 , G03F7/004
CPC分类号： H01L21/02118 , G03F7/0233 , G03F7/0388 , H01L21/02282 , H01L21/312 , H05K3/0023 , H05K3/287 , H05K3/4676 , H05K2201/0212
摘要： A photosensitive insulating resin composition capable of forming an interlayer insulating film, or planarized film, or surface protective film, or insulating film for high-density mount substrate excelling in properties, such as resolution, adherence, thermal impact, electrical insulation, patterning performance and elongation; a hardening product thereof; and a circuit board equipped with the hardening product. There is provided a positive photosensitive insulating resin composition comprising an alkali-soluble resin; a compound having a quinonediazido group; and crosslinked resin particles of a particulate copolymer whose 20 to 90 mol % constituent is derived from a hydroxylated and/or carboxylated monomer.
摘要翻译：一种能够形成层间绝缘膜或平坦化膜或表面保护膜的感光绝缘树脂组合物或用于高分辨率，粘附性，热冲击，电绝缘性，图案化性能等性能优异的高密度安装基板的绝缘膜，伸长; 其硬化产物; 以及配备有硬化产品的电路板。提供一种包含碱溶性树脂的正性感光绝缘树脂组合物; 具有醌二叠氮基的化合物; 和20〜90摩尔％成分衍生自羟基化和/或羧化单体的颗粒状共聚物的交联树脂颗粒。

3. 发明授权

US07714033B2 Photosensitive insulating resin composition, cured product thereof and electronic component comprising the same 有权
标题翻译：感光性绝缘树脂组合物及其固化物和包含该组合物的电子部件
公开(公告)号：US07714033B2
公开(公告)日：2010-05-11
申请号：US11831258
申请日：2007-07-31
申请人： Atsushi Ito , Hirofumi Goto , Hirofumi Sasaki , Ryuichi Okuda
发明人： Atsushi Ito , Hirofumi Goto , Hirofumi Sasaki , Ryuichi Okuda
IPC分类号： G03F7/004 , C08G59/68 , C08G65/10
CPC分类号： G03F7/0382 , G03F7/0045
摘要： The objective of the present invention is to provide a photosensitive insulating resin composition which is highly sensitive to g-line and h-line and enables to form a surface-protecting film, an interlayer insulation film and a planarized film that are excellent in various properties including resolution, electrical insulation property and thermal shock resistance, a cured product and an electronic component having the cured product. The present photosensitive insulating resin composition comprises an alkali-soluble resin having a phenolic hydroxyl group, a radiation sensitive acid generator comprising an s-triazine derivative represented by the following general formula (1), and a crosslinking agent. [In the formula (1), R is hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxyl group having 1 to 4 carbon atoms, X is a halogen atom and Y is oxygen atom or sulfur atom.]
摘要翻译：本发明的目的是提供对g线和h线高度敏感的感光性绝缘树脂组合物，能够形成各种性能优异的表面保护膜，层间绝缘膜和平坦化膜包括分辨率，电绝缘性和耐热冲击性，固化产物和具有固化产物的电子部件。本发明的感光性绝缘性树脂组合物含有具有酚性羟基的碱溶性树脂，含有下述通式（1）表示的s-三嗪衍生物的辐射敏感性酸发生剂和交联剂。 [式（1）中，R为氢原子，碳原子数1〜4的烷基或碳原子数1〜4的烷氧基，X为卤素原子，Y为氧原子或硫原子。

4. 发明申请

US20080045621A1 PHOTOSENSITIVE INSULATING RESIN COMPOSITION, CURED PRODUCT THEREOF AND ELECTRONIC COMPONENT COMPRISING THE SAME 有权
标题翻译：光敏绝缘树脂组合物，其固化产物和包含其的电子组分
公开(公告)号：US20080045621A1
公开(公告)日：2008-02-21
申请号：US11831258
申请日：2007-07-31
申请人： Atsushi Ito , Hirofumi Goto , Hirofumi Sasaki , Ryuichi Okuda
发明人： Atsushi Ito , Hirofumi Goto , Hirofumi Sasaki , Ryuichi Okuda
IPC分类号： G03C1/73
CPC分类号： G03F7/0382 , G03F7/0045
摘要： The objective of the present invention is to provide a photosensitive insulating resin composition which is highly sensitive to g-line and h-line and enables to form a surface-protecting film, an interlayer insulation film and a planarized film that are excellent in various properties including resolution, electrical insulation property and thermal shock resistance, a cured product and an electronic component having the cured product. The present photosensitive insulating resin composition comprises an alkali-soluble resin having a phenolic hydroxyl group, a radiation sensitive acid generator comprising an s-triazine derivative represented by the following general formula (1), and a crosslinking agent. [In the formula (1), R is hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxyl group having 1 to 4 carbon atoms, X is a halogen atom and Y is oxygen atom or sulfur atom.]
摘要翻译：本发明的目的是提供对g线和h线高度敏感的感光性绝缘树脂组合物，能够形成各种性能优异的表面保护膜，层间绝缘膜和平坦化膜包括分辨率，电绝缘性和耐热冲击性，固化产物和具有固化产物的电子部件。本发明的感光性绝缘性树脂组合物含有具有酚性羟基的碱溶性树脂，含有下述通式（1）表示的s-三嗪衍生物的辐射敏感性酸发生剂和交联剂。 [式（1）中，R为氢原子，碳原子数1〜4的烷基或碳原子数1〜4的烷氧基，X为卤素原子，Y为氧原子或硫原子。

5. 发明授权

US07332254B2 Positive photosensitive insulating resin composition, cured product thereof, and electronic component 有权
标题翻译：正性感光绝缘树脂组合物，其固化产物和电子部件
公开(公告)号：US07332254B2
公开(公告)日：2008-02-19
申请号：US11465671
申请日：2006-08-18
申请人： Hirofumi Sasaki , Atsushi Ito , Hirofumi Goto , Yuichi Hashiguchi
发明人： Hirofumi Sasaki , Atsushi Ito , Hirofumi Goto , Yuichi Hashiguchi
IPC分类号： G03F7/023 , G03F7/30
CPC分类号： G03F7/0236 , G03F7/0226 , G03F7/0233 , H05K3/287 , H05K3/4676
摘要： Disclosed is a positive photosensitive insulating resin composition including: (A) an alkali soluble resin, (B) a compound having a quinonediazide group, and (C) an epoxy resin having a softening point of not lower than 30° C.; and a cured product which is obtained by curing the composition. The cured product obtained by curing the composition is excellent in resolution, electrical insulation, thermal shock resistance and adhesion, and exhibits reduced deformation after post-baking.
摘要翻译：公开了一种正型感光性绝缘树脂组合物，其包含：（A）碱溶性树脂，（B）具有醌二叠氮基的化合物和（C）软化点不低于30℃的环氧树脂; 和通过固化组合物获得的固化产物。通过固化该组合物得到的固化物的分辨率，电绝缘性，耐热冲击性和粘合性优异，后烘后呈现较小的变形。

6. 发明申请

US20070042296A1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND ELECTRONIC COMPONENT 有权
标题翻译：阳离子光敏绝缘树脂组合物，固化产品和电子组件
公开(公告)号：US20070042296A1
公开(公告)日：2007-02-22
申请号：US11465671
申请日：2006-08-18
申请人： Hirofumi Sasaki , Atsushi Ito , Hirofumi Goto , Yuichi Hashiguchi
发明人： Hirofumi Sasaki , Atsushi Ito , Hirofumi Goto , Yuichi Hashiguchi
IPC分类号： G03C1/00
CPC分类号： G03F7/0236 , G03F7/0226 , G03F7/0233 , H05K3/287 , H05K3/4676
摘要： Disclosed is a positive photosensitive insulating resin composition including: (A) an alkali soluble resin, (B) a compound having a quinonediazide group, and (C) an epoxy resin having a softening point of not lower than 30° C.; and a cured product which is obtained by curing the composition. The cured product obtained by curing the composition is excellent in resolution, electrical insulation, thermal shock resistance and adhesion, and exhibits reduced deformation after post-baking.
摘要翻译：公开了一种正型感光性绝缘树脂组合物，其包含：（A）碱溶性树脂，（B）具有醌二叠氮基的化合物和（C）软化点不低于30℃的环氧树脂; 和通过固化组合物获得的固化产物。通过固化该组合物得到的固化物的分辨率，电绝缘性，耐热冲击性和粘合性优异，后烘后呈现较小的变形。

7. 发明申请

US20090239080A1 PHOTOSENSITIVE INSULATION RESIN COMPOSITION AND CURED PRODUCT THEREOF 审中-公开
标题翻译：光敏绝缘树脂组合物及其固化产品
公开(公告)号：US20090239080A1
公开(公告)日：2009-09-24
申请号：US12439006
申请日：2007-07-23
申请人： Atsushi Ito , Hirofumi Goto , Hirofumi Sasaki
发明人： Atsushi Ito , Hirofumi Goto , Hirofumi Sasaki
IPC分类号： G03F7/004 , B32B27/06
CPC分类号： G03F7/0385 , C08F212/08 , C08F212/14 , Y10T428/31504 , C08F220/10
摘要： An object of the present invention is to provide a cured product which is excellent in characteristics such as an electric insulation property, a heat impact resistance, an adhesive property and the like and to provide a photosensitive insulation resin composition from which the above cured product can be obtained and which is suited to uses such as an interlayer insulation film, a surface protecting layer and the like in semiconductor elements. The photosensitive insulation resin composition according to the present invention is characterized by comprising (A) a copolymer comprising 10 to 99 mole % of a constitutional unit (A1) represented by the following Formula (1) and 90 to 1 mole % of a constitutional unit (A2) represented by the following Formula (2) (provided that the total of all constitutional units constituting the above copolymer (A) is 100 mole %): (wherein R1 represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group or an aryl group; R2 represents a hydrogen atom or methyl; m is an integer of 1 to 3, and n is an integer of 0 to 3; and m+n≦5; R3 represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group or an aryl group; R4 represents a hydrogen atom or methyl; and k is an integer of 0 to 3), (B) a compound (B1) having an oxetanyl group, (C) a photosensitive acid generator, (D) a solvent and (F) cross-linked fine particles.
摘要翻译：本发明的目的是提供一种电绝缘性，耐热冲击性，粘合性等特性优异的固化物，并提供一种感光绝缘树脂组合物，其中上述固化产物可由可以得到并适用于半导体元件中的层间绝缘膜，表面保护层等的用途。本发明的感光性绝缘性树脂组合物的特征在于，包含（A）由下述通式（1）表示的结构单元（A1）和10〜99摩尔％的由下式（1）表示的结构单元（A1）和90〜1摩尔％（A2）（条件是构成上述共聚物（A）的全部构成单元的总量为100摩尔％）：（其中，R1表示碳原子数1〜4的烷基，烷氧基或芳基; R 2表示氢原子或甲基; m表示1〜3的整数，n表示0〜3的整数，m + n <= 5，R 3表示碳原子数1〜4的烷基原子，烷氧基或芳基; R4表示氢原子或甲基; k表示0〜3的整数），（B）具有氧杂环丁烷基的化合物（B1），（C）感光性酸发生剂，（D）溶剂和（F）交联的细颗粒。

8. 发明申请

US20060079609A1 Heat curable resin composition having a low elastic modulus, heat curable film using same, and cured products 审中-公开
标题翻译：具有低弹性模量的热固性树脂组合物，使用它的热固化膜和固化产物
公开(公告)号：US20060079609A1
公开(公告)日：2006-04-13
申请号：US11280328
申请日：2005-11-17
申请人： Takashi Nishioka , Hirofumi Goto , Katsumi Inomata , Shin-ichirou Iwanaga
发明人： Takashi Nishioka , Hirofumi Goto , Katsumi Inomata , Shin-ichirou Iwanaga
IPC分类号： C08L63/00
CPC分类号： H05K1/0271 , C08J5/18 , C08J2363/00 , H01L23/293 , H01L23/49894 , H01L23/5329 , H01L2924/0002 , H01L2924/09701 , H05K3/4626 , H05K2201/0133 , H05K2201/0212 , H01L2924/00
摘要： A heat curable resin composition having a low elastic modulus comprising (A) an epoxy resin, (B) crosslinked fine particles, and (C) a curing agent, which when cured with heat, produces a cured product having a elastic modulus of less than 1 GPa is provided. A cured product excelling in characteristics such as stress relaxation property (low stress properties), electric insulation properties, heat shock resistance, and heat resistance can be produced from the heat curable resin.
摘要翻译：一种具有低弹性模量的热固性树脂组合物，其包含（A）环氧树脂，（B）交联的细颗粒和（C）固化剂，其在通过热固化时产生弹性模量小于提供1 GPa。可以从热固性树脂制造出具有应力松弛性（低应力性），电绝缘性，耐热冲击性，耐热性等特性优异的固化物。

9. 发明授权

US08247481B2 Photosensitive insulating resin composition, cured product thereof and ABA block copolymer 有权
标题翻译：感光绝缘树脂组合物，其固化产物和ABA嵌段共聚物
公开(公告)号：US08247481B2
公开(公告)日：2012-08-21
申请号：US13072788
申请日：2011-03-28
申请人： Atsushi Ito , Shigehito Asano , Hirofumi Goto , Takayoshi Tanabe
发明人： Atsushi Ito , Shigehito Asano , Hirofumi Goto , Takayoshi Tanabe
IPC分类号： C08L53/00 , G03F7/004 , C08F293/00
CPC分类号： G03F7/033 , C08F297/00 , G03F7/0045 , G03F7/038
摘要： A photosensitive insulating resin composition includes a block copolymer, a crosslinking agent, a photosensitive compound, and a solvent. The block copolymer includes a first structural unit shown by a following formula (1) and a second structural unit shown by a following formula (2), wherein R1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R2 represents an alkyl group having 1 to 4 carbon atoms.
摘要翻译：光敏绝缘树脂组合物包括嵌段共聚物，交联剂，光敏化合物和溶剂。嵌段共聚物包括由下式（1）表示的第一结构单元和由下式（2）表示的第二结构单元，其中R 1表示氢原子或具有1至4个碳原子的烷基，R 2表示具有1至4个碳原子的烷基。

10. 发明申请

US20110172349A1 PHOTOSENSITIVE INSULATING RESIN COMPOSITION, CURED PRODUCT THEREOF AND ABA BLOCK COPOLYMER 有权
标题翻译：光敏绝缘树脂组合物，固化产品和ABA嵌段共聚物
公开(公告)号：US20110172349A1
公开(公告)日：2011-07-14
申请号：US13072788
申请日：2011-03-28
申请人： Atsushi ITO , Shigehito Asano , Hirofumi Goto , Takayoshi Tanabe
发明人： Atsushi ITO , Shigehito Asano , Hirofumi Goto , Takayoshi Tanabe
IPC分类号： C08L53/00 , G03F7/004 , C08F293/00
CPC分类号： G03F7/033 , C08F297/00 , G03F7/0045 , G03F7/038
摘要： A photosensitive insulating resin composition includes a block copolymer, a crosslinking agent, a photosensitive compound, and a solvent. The block copolymer includes a first structural unit shown by a following formula (1) and a second structural unit shown by a following formula (2), wherein R1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R2 represents an alkyl group having 1 to 4 carbon atoms.
摘要翻译：光敏绝缘树脂组合物包括嵌段共聚物，交联剂，光敏化合物和溶剂。嵌段共聚物包括由下式（1）表示的第一结构单元和由下式（2）表示的第二结构单元，其中R 1表示氢原子或具有1至4个碳原子的烷基，R 2表示具有1至4个碳原子的烷基。

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