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1. 发明申请

US20090107522A1 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS 审中-公开
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20090107522A1
公开(公告)日：2009-04-30
申请号：US12255132
申请日：2008-10-21
申请人： Hiroaki Uchida , Tadashi Maegawa , Seiji Ano
发明人： Hiroaki Uchida , Tadashi Maegawa , Seiji Ano
IPC分类号： C23G1/02 , H01L21/30
CPC分类号： H01L21/6708 , H01L21/67051
摘要： An inventive substrate treatment method is performed by a substrate treatment apparatus including a plate having an opposed surface to be kept in opposed spaced relation to one surface of a substrate for treating the substrate with a treatment liquid, and includes: a pre-supply liquid filling step of supplying a pre-supply liquid into a space defined between the one surface of the substrate and the plate through a spout which is provided in the opposed surface in opposed relation to the center of the substrate, and filling the space with the pre-supply liquid, the pre-supply liquid having a smaller contact angle with respect to the substrate and the plate than the treatment liquid; a treatment liquid replacing step of, after a liquid-filled state is established in the space filled with the pre-supply liquid, supplying the treatment liquid into the space to replace the pre-supply liquid present in the space with the treatment liquid while keeping the space in the liquid-filled state; and a treatment liquid contacting step of, after the replacement of the pre-supply liquid, filling the space with the treatment liquid to cause the treatment liquid to contact the one surface of the substrate.
摘要翻译：本发明的基板处理方法由基板处理装置进行，该基板处理装置包括具有相对表面的板，以与处理液处理基板的基板的一个表面保持相对间隔的关系，并且包括：预供给液体填充通过相对于基板的中心设置在相对的表面中的喷口将预供应液供给到在基板的一个表面和板之间限定的空间中的步骤，供给液体，预处理液体相比于处理液体相对于基板和板具有较小的接触角; 处理液体置换步骤，在填充有预供应液体的空间中建立液体填充状态之后，将处理液供给到空间中以用处理液替换存在于处理液体中的预供应液体，同时保持液体填充状态的空间; 以及处理液接触步骤，在更换所述预供应液体之后，用所述处理液填充所述空间，以使所述处理液体接触所述基板的所述一个表面。

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