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1. 发明申请

US20080210007A1 Angular velocity sensor 审中-公开
标题翻译：角速度传感器
公开(公告)号：US20080210007A1
公开(公告)日：2008-09-04
申请号：US12010249
申请日：2008-01-23
申请人： Takayuki Yamaji , Hiroshi Ishikawa , Yuji Takahashi , Takashi Katsuki , Fumihiko Nakazawa , Hiroaki Inoue
发明人： Takayuki Yamaji , Hiroshi Ishikawa , Yuji Takahashi , Takashi Katsuki , Fumihiko Nakazawa , Hiroaki Inoue
IPC分类号： G01P9/04
CPC分类号： G01C19/5712 , G01C19/5628
摘要： An angular velocity sensor includes: a first tuning-fork vibrator having a first base and first aims extending from the first base in a first direction; a second tuning-fork vibrator having a second bass and second arms extending from the second base in a second direction; and a double gimbal portion mat has a drive gimbal portion vibrating about an axis extending in a fourth direction, and a sense gimbal portion vibrating about an axis extending in a fifth direction and senses an angular velocity about an axis extending in a third direction.
摘要翻译：角速度传感器包括：第一音叉振子，具有第一基座和第一目标，从第一基座沿第一方向延伸; 具有第二低音和第二臂的第二音叉振子，所述第二音叉和第二臂在第二方向上从所述第二基座延伸; 并且双云母部分垫具有绕围绕第四方向延伸的轴线振动的驱动万向节部分和围绕沿第五方向延伸的轴线振动的感测万向节部分，并感测围绕在第三方向延伸的轴线的角速度。

2. 发明申请

US20090139328A1 Packaged micro movable device and method for making the same 审中-公开
标题翻译：包装微动移动装置及其制造方法
公开(公告)号：US20090139328A1
公开(公告)日：2009-06-04
申请号：US12071862
申请日：2008-02-27
申请人： Hiroaki Inoue , Fumihiko Nakazawa , Hiroshi Ishikawa , Takashi Katsuki , Takayuki Yamaji
发明人： Hiroaki Inoue , Fumihiko Nakazawa , Hiroshi Ishikawa , Takashi Katsuki , Takayuki Yamaji
IPC分类号： G01P15/00 , B32B38/00 , C23F1/00 , B23K37/00
CPC分类号： G01P15/125 , G01C19/5719 , G01P1/023 , G01P15/0802 , H01L23/041 , H01L2924/0002 , Y10T156/1052 , H01L2924/00
摘要： A method is provided for making packaged micro-devices each including a micro movable element, a first packaging member formed with a recess, and a second packaging member formed with another recess. The micro movable element has a movable part. In accordance with the method, a device wafer is prepared for forming a plurality of micromovable elements. A first packaging wafer, formed with a plurality of recesses corresponding in position to the movable parts of the respective movable elements, is bonded to one surface of the device wafer. A second packaging wafer, formed with a plurality of recesses, is bonded to the other surface of the device wafer. The resulting laminate assembly is cut into separate products.
摘要翻译：提供一种用于制造包括微型可移动元件，形成有凹部的第一包装构件和形成有另一凹部的第二包装构件的包装微型装置的方法。微动元件具有可动部。根据该方法，制备用于形成多个微型可移动元件的器件晶片。形成有与相应可移动元件的可移动部分相对应的多个凹部的第一封装晶片被结合到器件晶片的一个表面。形成有多个凹部的第二封装晶片被接合到器件晶片的另一个表面。将所得的层压组件切割成单独的产品。

3. 发明申请

US20080105051A1 Vibration sensor and method for manufacturing the same 审中-公开
标题翻译：振动传感器及其制造方法
公开(公告)号：US20080105051A1
公开(公告)日：2008-05-08
申请号：US11907432
申请日：2007-10-12
申请人： Takayuki Yamaji , Hiroshi Ishikawa , Yuji Takahashi , Takashi Katsuki , Fumihiko Nakazawa , Hiroaki Inoue
发明人： Takayuki Yamaji , Hiroshi Ishikawa , Yuji Takahashi , Takashi Katsuki , Fumihiko Nakazawa , Hiroaki Inoue
IPC分类号： G01P15/097 , H01S4/00
CPC分类号： G01C19/5607 , H03H9/0519 , H03H9/1021 , H03H9/21 , Y10T29/49002
摘要： A vibration sensor includes a tuning-fork vibrator having a base and arms extending from the base, a mounting portion for mounting the tuning-fork vibrator, and a supporting member that mounts the tuning-fork vibrator on the mounting portion and has a narrow portion.
摘要翻译：振动传感器包括音叉振子，其具有从基座延伸的基部和臂，用于安装音叉振动器的安装部分和将音叉振动器安装在安装部分上并具有狭窄部分的支撑部件。

4. 发明授权

US08289723B2 Method of fabricating packaged-device 有权
标题翻译：制造包装装置的方法
公开(公告)号：US08289723B2
公开(公告)日：2012-10-16
申请号：US12458604
申请日：2009-07-16
申请人： Hiroaki Inoue , Takashi Katsuki , Fumihiko Nakazawa
发明人： Hiroaki Inoue , Takashi Katsuki , Fumihiko Nakazawa
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： G01P15/125 , B81C1/00301 , G01C19/5719 , G01P1/023 , G01P15/0802 , H01L21/76898 , H01L23/481 , H01L2924/0002 , Y10T29/49128 , H01L2924/00
摘要： A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer.
摘要翻译：一种方法包括在包括在第一晶片中的第一区域中形成凹槽以形成由凹槽限定的布线区域; 在槽中形成绝缘部分; 在形成有所述布线区域的所述第一晶片的表面之后，在形成所述绝缘部分之后，将包括器件形成区域的器件晶片的第一表面接合; 在将所述第一晶片连接到所述器件晶片之后，在所述第一晶片的布线区域中形成通孔，所述孔延伸穿过所述第一晶片; 用导电材料填充孔; 将第二晶片连接到与所述第一表面相对的所述器件晶片的第二表面，所述第二晶片包括第二区域; 在将第一晶片连接到器件晶片之后，通过使第一晶片变薄来暴露布线区域; 以及在使所述第一晶片变薄之后切割所述器件晶片，所述第一晶片和所述第二晶片。

5. 发明授权

US08283735B2 Packaged device and producing method thereof 有权
标题翻译：包装装置及其制造方法
公开(公告)号：US08283735B2
公开(公告)日：2012-10-09
申请号：US12688302
申请日：2010-01-15
申请人： Hiroaki Inoue , Takashi Katsuki , Fumihiko Nakazawa
发明人： Hiroaki Inoue , Takashi Katsuki , Fumihiko Nakazawa
IPC分类号： H01L29/84 , H01L23/04 , H01L21/00
CPC分类号： B32B37/12 , B32B2309/027 , B32B2309/68 , B32B2310/0806 , B32B2457/00 , B81B2207/096 , B81C1/00301 , B81C2203/0118 , B81C2203/019 , H01L23/10 , H01L2924/0002 , H01L2924/00
摘要： A packaged device includes a device substrate and a packaging unit. The device substrate includes a first surface and a device formed in the device substrate. The packaging unit includes an insulating layer which faces the device substrate. The insulating layer includes a second surface bonded to the first surface. A metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface on the device substrate side in the insulating layer. An outline of the first surface is retreated inward from an outline of the second surface.
摘要翻译：包装装置包括装置基板和包装单元。器件衬底包括形成在器件衬底中的第一表面和器件。包装单元包括面向设备基板的绝缘层。绝缘层包括结合到第一表面的第二表面。绝缘层中的外围表面的至少一部分的金属浓度高于绝缘层中的器件基板侧的端面的金属浓度。第一表面的轮廓从第二表面的轮廓向内退回。

6. 发明申请

US20100024547A1 ANGULAR SPEED SENSOR AND ELECTRONIC APPARATUS 有权
标题翻译：角速传感器和电子设备
公开(公告)号：US20100024547A1
公开(公告)日：2010-02-04
申请号：US12502499
申请日：2009-07-14
申请人： Takashi KATSUKI , Fumihiko Nakazawa , Hiroaki Inoue
发明人： Takashi KATSUKI , Fumihiko Nakazawa , Hiroaki Inoue
IPC分类号： G01C19/56
CPC分类号： G01C19/5719
摘要： An angular speed sensor includes two oscillating portions arranged to oscillate in X-axis direction and Y-axis direction, where the oscillating portions are spaced from each other in X-axis direction. The sensor also includes two coupling beams capable of producing a standing wave oscillation, elongated in X-axis direction and spaced from each other in Y-axis direction, with the oscillating portions located therebetween. The coupling beams are connected to a supporting substrate via fixing posts. The coupling beams are bridged by first and second link portions, the first link portion being also connected to one of the oscillating portions and the second link portion to the other. The fixing posts are connected to the coupling beams at fixed points of the standing wave oscillation. The link portions include widened portions connected to the coupling beams at the fixed points of the standing wave oscillation.
摘要翻译：角速度传感器包括两个摆动部分，它们被设置为在X轴方向和Y轴方向上摆动，其中振动部分在X轴方向上彼此间隔开。该传感器还包括能够产生驻波振荡的两个耦合光束，该驻波振荡在X轴方向上延伸并且在Y轴方向上彼此间隔开，并且摆动部分位于它们之间。耦合梁通过固定柱连接到支撑基板。耦合光束由第一和第二连接部分桥接，第一连接部分也连接到振荡部分之一和第二连接部分之一。固定柱在驻波振荡的固定点处连接到耦合梁。连杆部分包括在驻波振荡的固定点处连接到耦合梁的加宽部分。

7. 发明授权

US09372202B2 Packaged device 有权
标题翻译：打包装置
公开(公告)号：US09372202B2
公开(公告)日：2016-06-21
申请号：US13618643
申请日：2012-09-14
申请人： Hiroaki Inoue , Takashi Katsuki , Fumihiko Nakazawa
发明人： Hiroaki Inoue , Takashi Katsuki , Fumihiko Nakazawa
IPC分类号： H05K7/00 , G01P15/125 , B81C1/00 , G01C19/5719 , G01P1/02 , G01P15/08 , H01L21/768 , H01L23/48
CPC分类号： G01P15/125 , B81C1/00301 , G01C19/5719 , G01P1/023 , G01P15/0802 , H01L21/76898 , H01L23/481 , H01L2924/0002 , Y10T29/49128 , H01L2924/00
摘要： A packaged device of one embodiment includes a device layer section, and first and second packaging members. The device layer section is one where a movable microdevice including a movable part and a terminal part is formed. The first packaging member is joined to the device layer section, and includes a wiring region provided at a position corresponding to the terminal part and a conductive plug extending through the wiring region. The second packaging member is joined to a side of the device layer section opposite the first packaging member.
摘要翻译：一个实施例的包装装置包括装置层部分，以及第一和第二包装部件。装置层部是形成有可动部和端子部的可动微型装置的部分。第一包装部件连接到器件层部分，并且包括设置在与端子部分相对应的位置处的布线区域和延伸穿过布线区域的导电插塞。第二包装部件与第一包装部件相对的装置层部分的一侧连接。

8. 发明申请

US20130010447A1 PACKAGED DEVICE AND METHOD OF FABRICATING PACKAGED-DEVICE 有权
标题翻译：包装装置和制造包装装置的方法
公开(公告)号：US20130010447A1
公开(公告)日：2013-01-10
申请号：US13618643
申请日：2012-09-14
申请人： Hiroaki Inoue , Takashi Katsuki , Fumihiko Nakazawa
发明人： Hiroaki Inoue , Takashi Katsuki , Fumihiko Nakazawa
IPC分类号： H05K1/14
CPC分类号： G01P15/125 , B81C1/00301 , G01C19/5719 , G01P1/023 , G01P15/0802 , H01L21/76898 , H01L23/481 , H01L2924/0002 , Y10T29/49128 , H01L2924/00
摘要： A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer.
摘要翻译：一种方法包括在包括在第一晶片中的第一区域中形成凹槽以形成由凹槽限定的布线区域; 在槽中形成绝缘部分; 在形成有所述布线区域的所述第一晶片的表面之后，在形成所述绝缘部分之后，将包括器件形成区域的器件晶片的第一表面接合; 在将所述第一晶片连接到所述器件晶片之后，在所述第一晶片的布线区域中形成通孔，所述孔延伸穿过所述第一晶片; 用导电材料填充孔; 将第二晶片连接到与所述第一表面相对的所述器件晶片的第二表面，所述第二晶片包括第二区域; 在将第一晶片连接到器件晶片之后，通过使第一晶片变薄来暴露布线区域; 以及在使所述第一晶片变薄之后切割所述器件晶片，所述第一晶片和所述第二晶片。

9. 发明申请

US20100218977A1 PACKAGED DEVICE AND PRODUCING METHOD THEREOF 有权
标题翻译：包装装置及其制造方法
公开(公告)号：US20100218977A1
公开(公告)日：2010-09-02
申请号：US12688302
申请日：2010-01-15
申请人： Hiroaki Inoue , Takashi Katsuki , Fumihiko Nakazawa
发明人： Hiroaki Inoue , Takashi Katsuki , Fumihiko Nakazawa
IPC分类号： H05K1/00 , B32B37/00
CPC分类号： B32B37/12 , B32B2309/027 , B32B2309/68 , B32B2310/0806 , B32B2457/00 , B81B2207/096 , B81C1/00301 , B81C2203/0118 , B81C2203/019 , H01L23/10 , H01L2924/0002 , H01L2924/00
摘要： A packaged device includes a device substrate and a packaging unit. The device substrate includes a first surface and a device formed in the device substrate. The packaging unit includes an insulating layer which faces the device substrate. The insulating layer includes a second surface bonded to the first surface. A metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface on the device substrate side in the insulating layer. An outline of the first surface is retreated inward from an outline of the second surface.
摘要翻译：包装装置包括装置基板和包装单元。器件衬底包括形成在器件衬底中的第一表面和器件。包装单元包括面向设备基板的绝缘层。绝缘层包括结合到第一表面的第二表面。绝缘层中的外围表面的至少一部分的金属浓度高于绝缘层中的器件基板侧的端面的金属浓度。第一表面的轮廓从第二表面的轮廓向内退回。

10. 发明授权

US08230740B2 Angular speed sensor and electronic apparatus 有权
标题翻译：角速度传感器和电子设备
公开(公告)号：US08230740B2
公开(公告)日：2012-07-31
申请号：US12502499
申请日：2009-07-14
申请人： Takashi Katsuki , Fumihiko Nakazawa , Hiroaki Inoue
发明人： Takashi Katsuki , Fumihiko Nakazawa , Hiroaki Inoue
IPC分类号： G01P9/04 , G01C19/56
CPC分类号： G01C19/5719
摘要： An angular speed sensor includes two oscillating portions arranged to oscillate in X-axis direction and Y-axis direction, where the oscillating portions are spaced from each other in X-axis direction. The sensor also includes two coupling beams capable of producing a standing wave oscillation, elongated in X-axis direction and spaced from each other in Y-axis direction, with the oscillating portions located therebetween. The coupling beams are connected to a supporting substrate via fixing posts. The coupling beams are bridged by first and second link portions, the first link portion being also connected to one of the oscillating portions and the second link portion to the other. The fixing posts are connected to the coupling beams at fixed points of the standing wave oscillation. The link portions include widened portions connected to the coupling beams at the fixed points of the standing wave oscillation.
摘要翻译：角速度传感器包括两个摆动部分，它们被设置为在X轴方向和Y轴方向上摆动，其中振动部分在X轴方向上彼此间隔开。该传感器还包括能够产生驻波振荡的两个耦合光束，该驻波振荡在X轴方向上延伸并且在Y轴方向上彼此间隔开，并且摆动部分位于它们之间。耦合梁通过固定柱连接到支撑基板。耦合光束由第一和第二连接部分桥接，第一连接部分也连接到振荡部分之一和第二连接部分之一。固定柱在驻波振荡的固定点处连接到耦合梁。连杆部分包括在驻波振荡的固定点处连接到耦合梁的加宽部分。

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