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    • 5. 发明授权
    • Polyphenylene ether-based resin composition and method for producing the same
    • 聚苯醚系树脂组合物及其制造方法
    • US09187640B2
    • 2015-11-17
    • US14127775
    • 2012-06-20
    • Hiroaki FurukawaTadayuki Ishii
    • Hiroaki FurukawaTadayuki Ishii
    • C08L71/12C08K5/521C08L25/02C08L53/02C08L71/10C08K5/523
    • C08L71/10C08K5/523C08L53/02C08L71/12
    • To provide a resin composition that has a high impact resistance, hardly causes peeling during molding, and is excellent in flame retardancy, heat resistance, and heat aging resistance for a long period. A resin composition containing (A) polyphenylene ether, (B) a hydrogenated block copolymer that is obtained by hydrogenating a block copolymer including a polystyrene block and a conjugated diene compound polymer block, and that has a weight average molecular weight of 100,000 to 500,000, and (C) an organic phosphorus-based flame retardant within a specified amount, wherein a value of the loss tangent (tan δ) peak height of the (B) component in a dynamic viscoelasticity spectrum obtained by measurement of the resin composition at a frequency of 10 Hz is in a specified range.
    • 为了提供耐冲击性高的树脂组合物,在成型时几乎不发生剥离,并且长时间地具有优异的阻燃性,耐热性和耐热老化性。 一种含有(A)聚苯醚的树脂组合物,(B)氢化嵌段共聚物,其通过氢化包含聚苯乙烯嵌段和共轭二烯化合物聚合物嵌段的嵌段共聚物而得到,重均分子量为100,000〜500,000, 和(C)规定量的有机磷系阻燃剂,其中通过以一定频率测量树脂组合物而获得的动态粘弹性谱中(B)成分的损耗角正切(tanδ)峰值的值 10 Hz在指定范围内。
    • 6. 发明申请
    • TWO-HAND SWITCH DEVICE
    • 两手开关装置
    • US20090146506A1
    • 2009-06-11
    • US11817306
    • 2006-07-12
    • Tatsuya IidaManabu ShuttoHiroaki FurukawaToshiki KoshiTakashi Tanaka
    • Tatsuya IidaManabu ShuttoHiroaki FurukawaToshiki KoshiTakashi Tanaka
    • F16P3/20G08B1/00
    • B30B15/285F16P3/20
    • Task—To provide a two-hand switch device that requires only a small load for each operation cycle.Means to Achieve the Task—The device comprises a left hand RF antenna placed in such a position as to enable a communication with the first RFID tag worn on the pre-determined position of the left hand of the worker only when the left hand of the worker is placed in a pre-determined left hand safe position, a right hand RF antenna placed in such a position as to enable a communication with the second RFID tag worn on the pre-determined position of the right hand of the worker only when the right hand of the worker is placed in a pre-determined right hand safe position and an output signal generating means for generating an output signal according to signals received by the left hand RF antenna and the right hand RF antenna.
    • 任务 - 提供双手开关设备,每个操作周期只需要较小的负载。 实现任务的手段 - 该装置包括放置在如下位置的左手RF天线,即,只有当左手的左手可以与穿戴在工作人员左手的预定位置上的第一RFID标签通信时, 工人被放置在预定的左手安全位置,右手RF天线放置在使得能够与穿戴在工人的右手的预定位置上的第二RFID标签的通信只有当 工人的右手放置在预定的右手安全位置,以及输出信号发生装置,用于根据由左手RF天线和右手RF天线接收的信号产生输出信号。
    • 9. 发明授权
    • Thin film transistor and semiconductor layer
    • 薄膜晶体管和半导体层
    • US08415673B2
    • 2013-04-09
    • US13130141
    • 2009-11-02
    • Hiroaki Furukawa
    • Hiroaki Furukawa
    • H01L31/112H01L29/04
    • H01L27/12H01L21/0335H01L29/0657
    • A semiconductor layer (100) according to the present invention includes a top surface (100o), a bottom surface (100u) and a side surface (100s). In a portion of the side surface (100s) which is in the vicinity of a border with the top surface (100o), a tangential line (T1) to the portion is inclined with respect to the normal to the bottom surface (100u). In a certain portion of the side surface (100s) which is farther from the top surface (100o) than the portion in the vicinity of the border, an angle made by a tangential line (T2) to the certain portion and a plane defined by the bottom surface (100u) is larger than an angle made by the tangential line (T1) to the portion in the vicinity of the border and the plane defined by the bottom surface (100u).
    • 根据本发明的半导体层(100)包括顶表面(100o),底表面(100u)和侧表面(100s)。 在与顶表面(100o)的边界附近的侧表面(100s)的一部分中,该部分的切线(T1)相对于底表面(100u)的法线倾斜。 在比顶部表面(100o)远离边界附近的侧表面(100s)的某一部分中,由切线(T2)与特定部分形成的角度和由 底表面(100u)大于由切线(T1)与边界附近的部分和由底表面(100u)限定的平面所形成的角度。
    • 10. 发明申请
    • SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME
    • 半导体器件及其制造方法
    • US20130037870A1
    • 2013-02-14
    • US13643389
    • 2011-04-18
    • Hiroaki Furukawa
    • Hiroaki Furukawa
    • H01L21/20H01L29/78
    • H01L29/78633G02F1/136209G02F1/136286G02F2001/13606H01L21/76816H01L27/124H01L29/78648
    • Disclosed is a manufacturing method for a semiconductor device that prevents excessive etching of a conductive layer, even if the section where a conductive layer contact hole is formed is etched a plurality of times. A light-shielding film 20 is formed on a substrate 30. A buffer film 21, a gate insulating film 22, and a silicon film 11 are formed on the substrate 30 and the light-shielding film 20. A cleared section 40 is formed by etching to remove a section of the buffer film 21 and the gate insulating film 22, the section being on the light-shielding film 20 and disposed outside the area in which the silicon film 11 is formed. A gate electrode film 33 is formed in the cleared section 40. An inter-layer insulating film 23 is formed above the substrate 30. Etching is used to simultaneously form contact holes 45 and 46 extending to the silicon film 11 and a contact hole 44 extending to the light-shielding film 20 in the cleared section 40.
    • 公开了防止导电层过度蚀刻的半导体器件的制造方法,即使形成导电层接触孔的部分被蚀刻多次。 在基板30上形成有遮光膜20.在基板30和遮光膜20上形成有缓冲膜21,栅极绝缘膜22和硅膜11.清除部40由 蚀刻以除去缓冲膜21和栅极绝缘膜22的截面,该截面位于遮光膜20上,并且设置在形成有硅膜11的区域的外侧。 栅极电极膜33形成在清除部分40中。层间绝缘膜23形成在基板30上方。蚀刻用于同时形成延伸到硅膜11的接触孔45和46以及延伸到硅膜11的接触孔44 到清除部分40中的遮光膜20。