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    • 2. 发明授权
    • Transducer assembly for a bonding apparatus
    • 用于粘合装置的传感器组件
    • US07757926B2
    • 2010-07-20
    • US11363763
    • 2006-02-28
    • Chi Po ChongHing Leung Marchy LiWing Fai Lam
    • Chi Po ChongHing Leung Marchy LiWing Fai Lam
    • B23K37/00
    • B06B3/00B23K20/10H01L24/75
    • A transducer assembly for a bonding apparatus is provided that comprises a horn having first and second base ends and a bonding tool attached to the horn between the first and second base ends. First and second ultrasonic generators are secured to the first and second base ends respectively. A first fastening mechanism is located on the horn between the bonding tool and the first ultrasonic generator and a second fastening mechanism is located on the horn between the bonding tool and the second ultrasonic generator such that the horn is releasably attachable to a mounting interface using the first and second fastening mechanisms. There are also transducer mounting positions disposed on the mounting interface for mounting the mounting interface to a bond head.
    • 提供了一种用于粘合装置的传感器组件,其包括具有第一和第二基端的喇叭和在第一和第二基端之间附接到喇叭的接合工具。 第一和第二超声波发生器分别固定到第一和第二基端。 第一紧固机构位于接合工具和第一超声波发生器之间的喇叭上,并且第二紧固机构位于接合工具和第二超声波发生器之间的喇叭上,使得喇叭可释放地附接到安装界面,使用 第一和第二紧固机构。 传感器安装位置也安装在安装界面上,用于将安装界面安装到粘结头。