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1. 发明授权

US5543454A Reinforced polypropylene resin composition 失效
标题翻译：增强聚丙烯树脂组合物
公开(公告)号：US5543454A
公开(公告)日：1996-08-06
申请号：US285627
申请日：1994-08-04
申请人： Hikoichi Kamakura , Kiyoshi Tsutsui , Tomohiko Akagawa , Ikunori Sakai , Shigeji Ichikawa , Katsunori Arai
发明人： Hikoichi Kamakura , Kiyoshi Tsutsui , Tomohiko Akagawa , Ikunori Sakai , Shigeji Ichikawa , Katsunori Arai
IPC分类号： C08K3/34 , C08L23/16 , C08L33/00 , C08L53/00 , C08L53/02
CPC分类号： C08L53/00 , C08K3/34 , C08L23/16 , C08L53/02
摘要： A reinforced polypropylene resin composition contains the following components (A), (B) and (C) in amounts of 67 to 82% by weight of, 6 to 12% by weight and 12 to 21% by weight, respectively:Component (A): crystalline ethylene-propylene block copolymer having an ethylene content of 2 to 4% by weight, a molecular distribution of polypropylene component (Q=M.sub.w /M.sub.n) of at least 7, isotacticity of polypropylene component of at least 98%, an intrinsic viscosity (decalin, 135.degree. C.) of room temperature p-xylene soluble content of at least 6 dl/g, a melt flow rate (MFR) of 3 to 15 g/10 minutes, and the product of flexural modulus at room temperature and Izod impact strength at room temperature of at least 120000.Component (B): at least one elastomer selected from the group of consisting of (a) hydrogenated block copolymer rubbers each comprising block (I) composed of an aromatic vinyl compound copolymer and block (II) composed of a conjugated diene copolymer, and having a bonding structure of I-II or I-(II-I).sub.n (wherein n=1 or 2), wherein block (I) is contained in an amount of 10 to 40% by weight of the copolymer and is hydrogenated in an amount of 10 mol % or less, and block (II) is contained in an amount of 60 to 90% by weight of the copolymer and is hydrogenated in an amount of at least 90 mol %; and (b) ethylene-.alpha.-olefin copolymer rubbers each containing 30 to 95% by weight of ethylene.Component (C): talc having an average particle size of 3 to 5 .mu.m, which is measured by a laser diffraction method, a BET specific surface area of 5 to 13 m.sup.2 /g, and a top cut size of less than 20 .mu.m.
摘要翻译：增强聚丙烯树脂组合物分别含有67〜82重量％，6〜12重量％和12〜21重量％的成分（A），（B）和（C）成分（A ）：乙烯含量为2〜4重量％，聚丙烯组分（Q = Mw / Mn）分子量至少为7，聚丙烯组分的全同立构度至少为98％的结晶乙烯 - 丙烯嵌段共聚物，内在的室温对二甲苯可溶物含量至少为6dl / g，熔体流动速率（MFR）为3〜15g / 10分钟的粘度（萘烷，135℃），室温下的弯曲弹性模量组分（B）：选自（a）氢化嵌段共聚物橡胶中的至少一种弹性体，各自包含由芳族乙烯基化合物共聚物和嵌段（I）组成的嵌段（I）（II），具有结合结构o f I-II或I-（II-I）n（其中n = 1或2），其中嵌段（I）的含量为共聚物重量的10〜40％，氢化量为10 mol％以下，嵌段（II）的含量为共聚物的60〜90重量％，氢化至少为90摩尔％以上。和（b）乙烯-α-烯烃共聚物橡胶，各自含有30至95重量％的乙烯。成分（C）：通过激光衍射法测定的平均粒径为3〜5μm的滑石，BET比表面积为5〜13m 2 / g，顶切尺寸小于20μm m。

2. 发明授权

US5286776A Reinforced polypropylene resin composition containing glass fiber, mica and copolymer additives 失效
标题翻译：含有玻璃纤维，云母和共聚物添加剂的增强聚丙烯树脂组合物
公开(公告)号：US5286776A
公开(公告)日：1994-02-15
申请号：US61428
申请日：1993-04-19
申请人： Shigeji Ichikawa , Katsunori Arai , Hideyo Morita , Kouhei Ueno , Tatsushi Akou
发明人： Shigeji Ichikawa , Katsunori Arai , Hideyo Morita , Kouhei Ueno , Tatsushi Akou
IPC分类号： C08L51/06 , C08J5/08 , C08K3/34 , C08L23/12
CPC分类号： C08L51/06
摘要： A reinforced polypropylene resin composition comprising the following components (a) to (e), the total amount of the components (b) and (c) being 2 to 14%:(a) 45 to 75% by weight of a polypropylene modified with an organosilane compound or an unsaturated acid, or a modified polypropylene containing an unmodified polypropylene;(b) 1 to 10% by weight of a noncrystalline ethylene-.alpha.-olefin copolymer;(c) 1 to 10% by weight of a styrenic hydrogenated block copolymer;(d) 2 to 12% by weight of a glass fiber having a mean fiber diameter of 4 to 15 .mu.m; and(e) 15 to 35% by weight of a hard mica having a tensile strength of 30 kg/mm.sup.2 or more, a mean particle diameter of 50 to 250 .mu.m and an aspect ratio of 15 to 80.
摘要翻译：包含以下组分（a）至（e）的增强聚丙烯树脂组合物，组分（b）和（c）的总量为2至14％：（a）45至75重量％有机硅烷化合物或不饱和酸，或含有未改性聚丙烯的改性聚丙烯; （b）1至10重量％的非结晶乙烯 - （α-） - 烯烃共聚物; （c）1〜10重量％的苯乙烯氢化嵌段共聚物; （d）2至12重量％的平均纤维直径为4至15（my）m的玻璃纤维; 和（e）15〜35重量％的拉伸强度为30kg / mm 2以上的平均粒径为50〜250（my）m，纵横比为15〜80的硬云母。

3. 发明申请

US20070102610A1 HOOK ATTACHING UNIT 有权
标题翻译：挂钩装置
公开(公告)号：US20070102610A1
公开(公告)日：2007-05-10
申请号：US11552569
申请日：2006-10-25
申请人： Katsuhisa KATOU , Katsunori Arai
发明人： Katsuhisa KATOU , Katsunori Arai
IPC分类号： F16B45/00
CPC分类号： F16B37/14 , B60R7/10 , B60R22/18 , F16B45/00
摘要： A hook attaching unit in accordance with the invention is constituted by a hook member in which a hook is rotatably attached to an end portion of a base plate, a bolt with flange inserted to a bolt insertion hole of the base plate, and a resin cover member in which a cover body is connected to an annular basement portion. Since the hook member, the cover member and the bolt are integrally assembled, it is not necessary to install the bolt point by point in a work field and install the cover member after attaching the hook, and a workability at a time of fastening is good. Further, since the cover member invisibly covers a bolt head portion, there can be obtained an effect that a safety and an improved outer appearance can be obtained. The hook attaching unit can be also utilized for attaching a seat belt anchor plate.
摘要翻译：根据本发明的钩附接单元由钩构件构成，其中钩可旋转地附接到基板的端部，具有插入到基板的螺栓插入孔中的凸缘的螺栓和树脂盖构件，其中盖体连接到环形基部。由于钩构件，盖构件和螺栓被整体组装，所以不需要在工作区域中逐点安装螺栓，并且在安装钩子之后安装盖构件，并且在紧固时的可加工性良好。此外，由于盖构件不可见地覆盖螺栓头部，因此可以获得可以获得安全性和改善的外观的效果。挂钩安装单元也可用于安装安全带固定板。

4. 发明申请

US20050142882A1 Semiconductor water manufacturing method and wafer 有权
标题翻译：半导体水处理方法及晶圆
公开(公告)号：US20050142882A1
公开(公告)日：2005-06-30
申请号：US10512637
申请日：2003-04-24
申请人： Takahiro Kida , Seiichi Miyazaki , Kazuhiko Nishimura , Nobuyuki Hayashi , Katsunori Arai
发明人： Takahiro Kida , Seiichi Miyazaki , Kazuhiko Nishimura , Nobuyuki Hayashi , Katsunori Arai
IPC分类号： B24B9/00 , B24B9/06 , B24B37/04 , H01L21/302 , H01L21/304 , H01L21/306 , H01L21/461
CPC分类号： H01L21/02008 , B24B9/065 , B24B37/042 , H01L21/02052 , H01L21/30604 , Y10S438/928
摘要： The present invention provides a method for manufacturing a semiconductor wafer capable of manufacturing a wafer without ring-like sag in an outer peripheral portion thereof when polishing an alkali etched wafer, and a wafer without the ring-like sag in an outer peripheral portion thereof. The present invention comprises: a back surface part polishing and edge polishing step for performing back surface part polishing and edge polishing such that mirror polishing is performed on a chamfered portion and an inner part extending inward from a boundary between the chamfered portion and a back surface of a starting wafer; and a front surface polishing step for mirror polishing a front surface of the wafer subjected to the back surface part polishing and edge polishing step holding the wafer by the back surface thereof.
摘要翻译：本发明提供了一种制造半导体晶片的方法，该半导体晶片在其外周部分研磨碱蚀刻晶片时，并且在其外周部分中没有环状凹陷的晶片，能够在其外周部分制造没有环状凹陷的晶片。本发明包括：背面部分抛光和边缘抛光步骤，用于进行背面部分抛光和边缘抛光，使得在倒角部分和从倒角部分和背面之间的边界向内延伸的内部部分进行镜面抛光的起始晶圆; 以及前表面抛光步骤，用于对经过后表面抛光的晶片的前表面进行镜面抛光和通过其后表面保持晶片的边缘抛光步骤。

5. 发明授权

US6015336A Grinding apparatus 失效
标题翻译：研磨机
公开(公告)号：US6015336A
公开(公告)日：2000-01-18
申请号：US197414
申请日：1998-11-23
申请人： Osamu Kubota , Katsunori Arai , Yuji Sato , Takayuki Yui , Toshihisa Kanakubo
发明人： Osamu Kubota , Katsunori Arai , Yuji Sato , Takayuki Yui , Toshihisa Kanakubo
IPC分类号： B24B19/08 , B24B19/12 , B24B55/02 , B24B1/00 , B24B49/00
CPC分类号： B24B19/08 , B24B19/12 , B24B55/02
摘要： A grinding apparatus according to the present invention grinds a work having a plurality of non-circular work faces to be worked with a grindstone driven by a motor. The work faces are disposed at intervals. Distances between a grindstone unit, bearings and a gear train which are adjacent to each other, are substantially equal to a distance between adjacent work faces of the work. The gear train and the bearings can be respectively positioned between the adjacent work faces of the work in grinding. Therefore, it is possible to prevent interference of the gear train and the bearings with the work faces other than the work face which is being ground by the grinding wheel by a simple structure.
摘要翻译：根据本发明的研磨装置研磨具有多个非电动工作面的工件，该工作面将由电动机驱动的磨石加工。工作面间隔配置。磨石单元，轴承和彼此相邻的齿轮系之间的距离基本上等于工件的相邻工作面之间的距离。齿轮系和轴承可以分别位于工件的相邻工作面之间的磨削中。因此，可以通过简单的结构来防止齿轮系和轴承与工作面之间的干扰，而不是由研磨轮研磨的工作面。

6. 发明授权

US07837316B2 Correction ink for micro defect of color pattern, color filter, method for correcting micro defect of color pattern, and process for producing ink 有权
标题翻译：用于彩色图案的微缺陷的校正油墨，滤色器，用于校正彩色图案的微缺陷的方法，以及用于生产油墨的方法
公开(公告)号：US07837316B2
公开(公告)日：2010-11-23
申请号：US12198235
申请日：2008-08-26
申请人： Seiji Tawaraya , Shunsuke Sega , Katsunori Arai , Tatsuya Kageyama
发明人： Seiji Tawaraya , Shunsuke Sega , Katsunori Arai , Tatsuya Kageyama
IPC分类号： B41J2/17
CPC分类号： C09D11/101
摘要： A correction ink of the present invention is used for correcting a micro defect in a color pattern, which includes a coloring agent, polymer, monomer having reactivity functional group and a solvent, wherein an amount of the solvent is from 25% by weight to 70% by weight of the whole ink, and a viscosity is from 40 to 300 mPa·sec.
摘要翻译：本发明的校正油墨用于校正彩色图案中的微缺陷，其包括着色剂，聚合物，具有反应性官能团的单体和溶剂，其中溶剂的量为25重量％至70重量％全部油墨的重量％，粘度为40〜300mPa·sec。

7. 发明授权

US07530682B2 Correction ink for micro defect of color pattern, color filter, method for correcting micro defect of color pattern, and process for producing ink 有权
标题翻译：用于彩色图案的微缺陷的校正油墨，滤色器，用于校正彩色图案的微缺陷的方法，以及用于生产油墨的方法
公开(公告)号：US07530682B2
公开(公告)日：2009-05-12
申请号：US10628791
申请日：2003-07-28
申请人： Seiji Tawaraya , Shunsuke Sega , Katsunori Arai , Tatsuya Kageyama
发明人： Seiji Tawaraya , Shunsuke Sega , Katsunori Arai , Tatsuya Kageyama
IPC分类号： B41J2/01
CPC分类号： C09D11/101
摘要： A correction ink of the present invention is used for correcting a micro defect in a color pattern, which includes a coloring agent, polymer, monomer having reactivity functional group and a solvent, wherein an amount of the solvent is from 25% by weight to 70% by weight of the whole ink, and a viscosity is from 40 to 300 mPa·sec.
摘要翻译：本发明的校正油墨用于校正彩色图案中的微缺陷，其包括着色剂，聚合物，具有反应性官能团的单体和溶剂，其中溶剂的量为25重量％至70重量％全部油墨的重量％，粘度为40〜300mPa.sec。

8. 发明授权

US07780384B2 Hook attaching unit 有权
标题翻译：挂钩单元
公开(公告)号：US07780384B2
公开(公告)日：2010-08-24
申请号：US11552569
申请日：2006-10-25
申请人： Katsuhisa Katou , Katsunori Arai
发明人： Katsuhisa Katou , Katsunori Arai
IPC分类号： B60P7/08
CPC分类号： F16B37/14 , B60R7/10 , B60R22/18 , F16B45/00
摘要： A hook attaching unit in accordance with the invention is constituted by a hook member which is rotatably attached to an end portion of a base plate, a bolt with a flange inserted to a bolt insertion hole of the base plate, and a resin cover member in which a cover body is connected to an annular basement portion. Since the hook member, the cover member and the bolt are integrally assembled, it is not necessary to install the bolt separately in the work field and then install the cover member after attaching the hook, and as such, the workability at the time of fastening is improved. Further, since the cover member invisibly covers the bolt head portion, improved safety and outer appearance is obtained. The hook attaching unit can be also utilized for attaching a seat belt anchor plate.
摘要翻译：根据本发明的钩附接单元由可旋转地附接到基板的端部的钩构件，具有插入到基板的螺栓插入孔中的凸缘的螺栓构成，以及树脂盖构件盖主体连接到环形基部。由于钩构件，盖构件和螺栓被整体组装，所以不需要将螺栓分开地安装在工作区域中，并且在安装钩子之后安装盖构件，并且因此在紧固时的加工性改进了此外，由于盖构件不可见地覆盖螺栓头部，因此获得了改进的安全性和外观。挂钩安装单元也可用于安装安全带固定板。

9. 发明授权

US07250368B2 Semiconductor wafer manufacturing method and wafer 有权
标题翻译：半导体晶圆制造方法和晶圆
公开(公告)号：US07250368B2
公开(公告)日：2007-07-31
申请号：US10512637
申请日：2003-04-24
申请人： Takahiro Kida , Seiichi Miyazaki , Kazuhiko Nishimura , Nobuyuki Hayashi , Katsunori Arai
发明人： Takahiro Kida , Seiichi Miyazaki , Kazuhiko Nishimura , Nobuyuki Hayashi , Katsunori Arai
IPC分类号： H01L21/304
CPC分类号： H01L21/02008 , B24B9/065 , B24B37/042 , H01L21/02052 , H01L21/30604 , Y10S438/928
摘要： The present invention provides a method for manufacturing a semiconductor wafer capable of manufacturing a wafer without ring-like sag in an outer peripheral portion thereof when polishing an alkali etched wafer, and a wafer without the ring-like sag in an outer peripheral portion thereof. The present invention comprises: a back surface part polishing and edge polishing step for performing back surface part polishing and edge polishing such that mirror polishing is performed on a chamfered portion and an inner part extending inward from a boundary between the chamfered portion and a back surface of a starting wafer; and a front surface polishing step for mirror polishing a front surface of the wafer subjected to the back surface part polishing and edge polishing step holding the wafer by the back surface thereof.
摘要翻译：本发明提供了一种制造半导体晶片的方法，该半导体晶片在其外周部分研磨碱蚀刻晶片时，并且在其外周部分中没有环状凹陷的晶片，能够在其外周部分制造没有环状凹陷的晶片。本发明包括：背面部分抛光和边缘抛光步骤，用于进行背面部分抛光和边缘抛光，使得在倒角部分和从倒角部分和背面之间的边界向内延伸的内部部分进行镜面抛光的起始晶圆; 以及前表面抛光步骤，用于对经过后表面抛光的晶片的前表面进行镜面抛光和通过其后表面保持晶片的边缘抛光步骤。

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