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    • 7. 发明申请
    • METHOD AND DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICES, SEMICONDUCTOR DEVICE AND TRANSFER MEMBER
    • 用于制造半导体器件,半导体器件和传输器件的方法和器件
    • US20120326255A1
    • 2012-12-27
    • US13578967
    • 2011-02-14
    • Hikaru Kobayashi
    • Hikaru Kobayashi
    • H01L31/0352B32B5/02H01L21/00
    • H01L31/0747H01L31/02363H01L31/182Y02E10/546Y02P70/521Y10T29/41Y10T442/10
    • Disclosed is a method for manufacturing semiconductor devices. Said method includes: a supply step in which a process liquid (19) that oxidizes and dissolves a target substrate (20) to be treated is supplied to the surface of said substrate (20) to be treated; a positioning step in which a mesh-like transferring member (10b) provided with a catalyst material is positioned near or in contact with the surface of the substrate (20) to be treated; and a concave or convex forming step in which a concave or convex is formed on the surface of the substrate (20) to be treated via the aforementioned supply and positioning steps. As opposed to existing manufacturing methods, which manufacture semiconductor devices provided with semiconductor substrates with highly arbitrary (i.e. not very reproducible) concaves or convexes, by forming an appropriate concave or convex or mesh at the transferring member step, the disclosed method can stably manufacture semiconductor devices provided with semiconductor substrates that have concaves or convexes of a fixed level.
    • 公开了半导体器件的制造方法。 所述方法包括:供给步骤,其中将待处理的目标基板(20)氧化和溶解的处理液体(19)供给到待处理的所述基板(20)的表面; 定位步骤,其中设置有催化剂材料的网状转印构件(10b)位于待处理的基板(20)的表面附近或与之接触; 以及通过上述供给和定位步骤在待处理的基板(20)的表面上形成凹或凸的凹凸形成步骤。 与现有制造方法相反,所述制造方法通过在转印构件步骤形成适当的凹或凸或网状物来制造具有高度任意(即不是非常可再现的)凹凸的半导体衬底的半导体器件,所公开的方法可以稳定地制造半导体 设置有具有固定水平的凹陷或凸起的半导体衬底的器件。
    • 8. 发明申请
    • Method for forming silicon dioxide film on silicon substrate, method for forming oxide film on semiconductor substrate, and method for producing semiconductor device
    • 在硅衬底上形成二氧化硅膜的方法,半导体衬底上形成氧化膜的方法以及半导体器件的制造方法
    • US20050215070A1
    • 2005-09-29
    • US10515501
    • 2003-05-21
    • Hikaru Kobayashi
    • Hikaru Kobayashi
    • H01L27/04H01L21/28H01L21/316H01L21/336H01L21/822H01L29/51H01L29/78H01L29/786H01L21/469
    • H01L21/28194H01L21/02238H01L21/02255H01L21/02337H01L21/28202H01L21/31662H01L29/511H01L29/518
    • After cleaning a surface of a silicon substrate (1), impurities and natural oxide film existing on the silicon substrate (1) are removed by soaking the silicon substrate (1) in a 0.5%-by-volume HF aqueous solution for 5 minutes. The silicon substrate (1) is rinsed (cleaned) with ultrapure water for five minutes. Then, the silicon substrate (1) is soaked for 30 minutes in azeotropic nitric acid heated to an azeotropic temperature of 120.7° C. In this way, an extremely thin chemical oxide film (5) is formed on the surface of the silicon substrate (1). Subsequently, a metal film (6) (aluminum-silicon alloy film) is deposited, followed by heating in a hydrogen-containing gas at 200° C. for 20 minutes. Through the heat processing in the hydrogen-containing gas, hydrogen reacts with interface states and defect states in the chemical oxide film (5), causing disappearance of the interface states and defect states. As a result, the quality of the film can be improved. Thus, it is possible to form a high quality (with low leak current density), extremely thin silicon dioxide film on the silicon substrate at a low temperature with excellent film-thickness controllability.
    • 在清洗硅衬底(1)的表面之后,通过将硅衬底(1)浸泡在0.5%体积的HF水溶液中5分钟来除去存在于硅衬底(1)上的杂质和自然氧化物膜。 将硅衬底(1)用超纯水冲洗(清洁)5分钟。 然后,将硅基板(1)在加热至共沸温度为120.7℃的共沸硝酸中浸泡30分钟。以这种方式,在硅基板的表面上形成极薄的化学氧化物膜(5) 1)。 随后,沉积金属膜(6)(铝 - 硅合金膜),然后在含氢气体中在200℃下加热20分钟。 通过含氢气体中的热处理,氢与化学氧化膜(5)中的界面态和缺陷状态发生反应,导致界面状态和缺陷状态的消失。 结果,可以提高胶片的质量。 因此,可以在低温下在硅衬底上形成高质量(低漏电流密度),极薄的二氧化硅膜,具有优异的膜厚可控性。