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1. 发明授权

US07039043B2 Voice data communication system 失效
公开(公告)号：US07039043B2
公开(公告)日：2006-05-02
申请号：US10043741
申请日：2002-01-09
申请人： Hideyuki Sugihashi , Mitsuru Tanida , Hideaki Shimizu , Osamu Shimada
发明人： Hideyuki Sugihashi , Mitsuru Tanida , Hideaki Shimizu , Osamu Shimada
IPC分类号： H04L12/66 , H04L12/28 , H04L12/56
CPC分类号： H04L12/2856 , H04L12/2898 , H04M7/128 , H04Q2213/13034 , H04Q2213/13389
摘要： In a voice data communication system comprising a switchboard for switching lines, a network, interworking units for interworking a protocol on the network with a protocol for a line switching, and IP extension terminals connected to the interworking units through the network, a switchboard notifies a communication between interworking units to the interworking units when recognizing the communication between the interworking units, which are provided corresponding to each of IP extension terminals, and establish a relay route to the interworking unit according to a notification from the switchboard and establish a voice data packet route to a route between the IP extension terminals through the network by using the relay route in response to a route establishment request from the IP extension terminals accommodated, or when the interworking unit is a single and the notification is received from the switchboard, establish a voice data packet route to a route between the IP extension terminals through the network according to a route establishment request from the IP extension terminal accommodated.

2. 发明申请

US20120281379A1 ELECTRONIC COMPONENT 有权
标题翻译：电子元件
公开(公告)号：US20120281379A1
公开(公告)日：2012-11-08
申请号：US13520980
申请日：2011-01-04
申请人： Osamu Shimada
发明人： Osamu Shimada
IPC分类号： H05K7/06
CPC分类号： H05K1/023 , H01L21/486 , H01L23/3121 , H01L23/49827 , H01L23/5383 , H01L23/5389 , H01L24/48 , H01L2224/04105 , H01L2224/24195 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01079 , H01L2924/14 , H01L2924/15313 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H05K1/0224 , H05K1/186 , H05K3/4069 , H05K3/4614 , H05K3/4647 , H05K2201/0355 , H05K2201/10636 , H05K2203/061 , H05K2203/063 , Y02P70/611 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： In an electronic component in which a semiconductor chip (semiconductor element) and a passive component are integrated on a multilayer wiring board and the semiconductor chip and the passive component constitute a feedback circuit, an input end and an output end of the semiconductor chip (semiconductor element) are electrically separated from each other. The electronic component includes the multilayer wiring board, the semiconductor chip disposed on the main surface of or inside the multilayer wiring board, and the passive component having a first terminal and a second terminal connected to the input end and the output end of the semiconductor chip respectively, and is configured such that a conductive member constituting the multilayer wiring board is located at a position where a distance from at least one of the first terminal and the second terminal is smaller than a distance between the first terminal and the second terminal.
摘要翻译：在其中将半导体芯片（半导体元件）和无源部件集成在多层布线板上并且半导体芯片和无源部件构成反馈电路的电子部件中，半导体芯片（半导体）的输入端和输出端元件）彼此电分离。电子部件包括多层布线基板，设置在多层布线基板的主表面或内侧的半导体芯片，无源部件具有与半导体芯片的输入端和输出端连接的第一端子和第二端子并且被构造为使得构成多层布线板的导电构件位于距离第一端子和第二端子中的至少一个的距离小于第一端子和第二端子之间的距离的位置处。

3. 发明授权

US08082156B2 Audio encoding device, audio encoding method, and audio encoding program for encoding a wide-band audio signal 有权
标题翻译：音频编码装置，音频编码方法和用于编码宽带音频信号的音频编码程序
公开(公告)号：US08082156B2
公开(公告)日：2011-12-20
申请号：US11794984
申请日：2006-01-06
申请人： Osamu Shimada
发明人： Osamu Shimada
IPC分类号： G01L19/00
CPC分类号： G10L19/20 , G10L19/0208 , G10L21/038
摘要： By using a high-range sub-band signal, a correction coefficient corresponding to importance of auditory sense is calculated to correct a noise level and generate additional signal information, thereby accurately reflecting the noise level of the sub-band important in the auditory sense. Thus, it is possible to calculate additional signal information reflecting the noise level of the sub-band important in the auditory sense according to importance with a small calculation amount. The calculation amount can further be reduced by using a correction coefficient based on the characteristic of an ordinary audio signal.
摘要翻译：通过使用高范围子带信号，计算与听觉的重要性相对应的校正系数，以校正噪声电平并生成附加信号信息，从而准确地反映听觉中重要的子带的噪声电平。因此，可以以小的计算量根据重要性计算反映听觉中重要的子带的噪声水平的附加信号信息。通过使用基于普通音频信号的特性的校正系数可以进一步减少计算量。

4. 发明申请

US20100198990A1 MULTI-POINT CONNECTION DEVICE, SIGNAL ANALYSIS AND DEVICE, METHOD, AND PROGRAM 有权
标题翻译：多点连接设备，信号分析和设备，方法和程序
公开(公告)号：US20100198990A1
公开(公告)日：2010-08-05
申请号：US12666827
申请日：2008-06-26
申请人： Osamu Shimada , Toshiyuki Nomura , Akihiko Sugiyama , Osamu Houshuyama
发明人： Osamu Shimada , Toshiyuki Nomura , Akihiko Sugiyama , Osamu Houshuyama
IPC分类号： G06F15/16
CPC分类号： H04N7/152 , G10L19/008 , H04M3/56
摘要： Provided is a multi-point connection device including: a first signal receiving unit which receives a first signal containing a plurality of constituent elements and first analysis information expressing the relationship between the constituent elements contained in the first signal; a second signal receiving unit which receives a second signal containing a plurality of constituent elements and second analysis information expressing the relationship between the constituent elements contained in the second signal; a signal mixing unit which mixes the first signal and the second signal; and an analysis information mixing unit which mixes the first analysis information and the second analysis information.
摘要翻译：提供一种多点连接装置，包括：第一信号接收单元，其接收包含多个构成要素的第一信号和表示包含在第一信号中的构成要素之间的关系的第一分析信息; 第二信号接收单元，其接收包含多个构成要素的第二信号和表示包含在第二信号中的构成要素之间的关系的第二分析信息; 混合第一信号和第二信号的信号混合单元; 以及混合第一分析信息和第二分析信息的分析信息混合单元。

5. 发明申请

US20100189280A1 SIGNAL ANALYSIS DEVICE, SIGNAL CONTROL DEVICE, ITS SYSTEM, METHOD, AND PROGRAM 有权
标题翻译：信号分析装置，信号控制装置，其系统，方法和程序
公开(公告)号：US20100189280A1
公开(公告)日：2010-07-29
申请号：US12666941
申请日：2008-06-26
申请人： Osamu Shimada , Toshiyuki Nomura , Akihiko Sugiyama , Osamu Houshuyama
发明人： Osamu Shimada , Toshiyuki Nomura , Akihiko Sugiyama , Osamu Houshuyama
IPC分类号： H04B15/00
CPC分类号： G10L21/0208 , H03G3/32 , H04S2400/13
摘要： A signal analysis device includes: a signal reception unit which receives an input signal containing a plurality of constituent elements; and a signal analysis unit which generates analysis information indicating the relationship between the constituent elements from the input signal.
摘要翻译：信号分析装置包括：信号接收单元，其接收包含多个构成要素的输入信号; 以及信号分析单元，其从输入信号生成表示构成要素之间的关系的分析信息。

6. 发明授权

US07644497B2 Component built-in wiring board and manufacturing method of component built-in wiring board 失效
标题翻译：组件内置线路板及组件内置线路板的制造方法
公开(公告)号：US07644497B2
公开(公告)日：2010-01-12
申请号：US12007924
申请日：2008-01-17
申请人： Tatsuro Imamura , Yuji Yamaguchi , Kazuhiro Shinozaki , Satoshi Shibazaki , Yoshitaka Fukuoka , Hiroyuki Hirai , Osamu Shimada , Kenji Sasaoka , Kenichi Matsumura
发明人： Tatsuro Imamura , Yuji Yamaguchi , Kazuhiro Shinozaki , Satoshi Shibazaki , Yoshitaka Fukuoka , Hiroyuki Hirai , Osamu Shimada , Kenji Sasaoka , Kenichi Matsumura
IPC分类号： H05K3/30 , H05K3/36
CPC分类号： H05K1/184 , H05K1/023 , H05K1/186 , H05K3/3442 , H05K3/4602 , H05K2201/10636 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165 , Y10T29/49789 , Y10T29/49798
摘要： To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.
摘要翻译：提供一种组件内置布线板及其制造方法，其能够进一步提高部件安装密度而不劣化可靠性。所述部件内置布线板包括：导电层（34,35），其在所述板的厚度方向上延伸并埋设在所述板中而不暴露于所述板的上表面和下表面; 一个电子/电子部件（33），具有一个终端并埋设在该电路板中，该端子面向该掩埋的导电层; 设置在掩埋电气/电子部件的端子与导电层之间的间隙中的电连接/机械连接端子和导电层的连接件（36,37）; 以及两个覆盖所述埋入的电气/电子部件的外表面的绝缘层（11,15），除了连接到所述连接构件的部分之外，所述外部表面与所述电气/电子部件的板厚方向上的顶部和底部紧密接触电气/电子部件。

7. 发明申请

US20090326963A1 AUDIO ENCODING DEVICE, AUDIO ENCODING METHOD, AND PROGRAM THEREOF 有权
标题翻译：音频编码设备，音频编码方法及其程序
公开(公告)号：US20090326963A1
公开(公告)日：2009-12-31
申请号：US12307897
申请日：2007-07-06
申请人： Osamu Shimada
发明人： Osamu Shimada
IPC分类号： G10L21/04
CPC分类号： G10L21/04 , G10L19/0208 , H04B1/665 , H04N21/2368
摘要： [Problems] To provide a high-quality audio signal encoding technique by controlling the number of time/frequency groups in a frame.[Means for Solving Problems] An audio encoding device includes: a time group boundary candidate position extraction unit (101) for analyzing a sub-band signal (2001) obtained by frequency-changing an input signal and calculating a candidate position of the time group boundary; a time group quantity generation unit (103) for outputting a maximum value of the time group quantity; a time group selection unit (102) for generating a time group quantity not greater than the maximum time group quantity by using the candidate position; and a frequency group generation unit (104) for generating a frequency group by using the generated time group information. The device generates a time/frequency group accurately reflecting a change of the input signal and performs operations while controlling the number of time/frequency groups in the frame.
摘要翻译： [问题]通过控制帧中的时间/频率组的数量来提供高质量的音频信号编码技术。解决问题的手段音频编码装置包括：时间组边界候补位置提取单元，用于分析通过对输入信号进行频率变换而获得的子带信号（2001），并计算时间组的候选位置边界; 时间组数量生成单元，用于输出时间组数量的最大值; 时间组选择单元，用于通过使用候选位置生成不大于最大时间组数量的时间组数量; 以及用于通过使用所生成的时间组信息来生成频率组的频率组生成单元（104）。该装置产生准确地反映输入信号的变化的时间/频率组，并且在控制帧中的时间/频率组的数量的同时进行操作。

8. 发明申请

US20050241988A1 Manufacturing method for electronic or electric products such as flat-panel display devices and band-shaped package therefor 有权
标题翻译：电子或电气产品的制造方法，如平板显示装置和带状包装
公开(公告)号：US20050241988A1
公开(公告)日：2005-11-03
申请号：US11096091
申请日：2005-04-01
申请人： Katsuyasu Hirata , Osamu Shimada , Kazuhiro Ohashi , Takayuki Iizuka , Hiroshi Shintani
发明人： Katsuyasu Hirata , Osamu Shimada , Kazuhiro Ohashi , Takayuki Iizuka , Hiroshi Shintani
IPC分类号： B65D85/68 , B65B9/06 , B65B9/13 , B65B15/04 , B65B69/00 , B65D73/00 , B65D73/02 , B65D75/42 , B65D85/86 , G02F1/13 , H05K3/00 , H05K13/00
CPC分类号： H05K13/0084
摘要： A method for manufacturing electronic or electric products such as flat-panel display devices, for coping with change or variations of dimensions of the products and for curbing damage or fracture on the products and reducing recovery cost for containers, according to one embodiment, comprising; sequentially placing first flat electronic or electric products as to be sandwiched by a resin-sheet band formed of one or pair of band-shaped flat resin sheet and as to be arrayed in a row; forming joined areas by bonding faces of the resin-sheet band as to form receptacles respectively for the first flat electronic or electric products; thus forming a band-shaped package; and then transporting or storing such array of the first flat electronic or electric products in the band-shaped package as to be used for producing second electronic or electric products.
摘要翻译：根据一个实施例，一种用于制造诸如平板显示装置的电子或电气产品的方法，用于应对产品的尺寸变化或尺寸的变化以及用于抑制产品上的损坏或断裂并降低容器的回收成本。顺序地将第一扁平电子产品或电气产品夹在由一个或一对带状扁平树脂片形成的树脂片带上并排列成一排; 通过粘合树脂片带的面来形成接合区域，以形成分别用于第一扁平电子产品或电气产品的插座; 从而形成带状包装; 然后将这种第一扁平电子产品或电气产品的阵列传送或存储在用于生产第二电子或电气产品的带状包装中。

9. 发明授权

US06353189B1 Wiring board, wiring board fabrication method, and semiconductor package 有权
标题翻译：接线板，接线板制造方法和半导体封装
公开(公告)号：US06353189B1
公开(公告)日：2002-03-05
申请号：US09403223
申请日：1999-10-15
申请人： Osamu Shimada , Yoshitaka Fukuoka , Akihiko Takagi , Kenji Sasaoka
发明人： Osamu Shimada , Yoshitaka Fukuoka , Akihiko Takagi , Kenji Sasaoka
IPC分类号： H05K103
CPC分类号： H01P3/087 , H01L21/563 , H01L23/3677 , H01L23/49822 , H01L23/49827 , H01L23/5383 , H01L23/552 , H01L23/66 , H01L24/73 , H01L2223/6627 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/16152 , H01L2924/16251 , H01L2924/1903 , H01L2924/19041 , H01L2924/19106 , H01L2924/3011 , H01L2924/3025 , H01P1/047 , H01P3/088 , H01P11/003 , H05K1/0206 , H05K1/0219 , H05K1/0222 , H05K1/113 , H05K3/4069 , H05K3/4614 , H05K3/4647 , H05K2201/09036 , H05K2201/09509 , H05K2201/09518 , H05K2201/096 , H05K2201/09618 , H05K2201/09845 , H05K2201/09981 , H05K2203/1189 , Y10T29/49126 , Y10T29/49165 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A wiring board provided with a line 1, a shield pattern 2 formed in parallel with the line 1, a conductor layer 4 formed so as to face the line 1 and the shield pattern 2 through an insulating layer 3, a conductor layer 6 formed so as to face the line 1 and the shield pattern 2 through an insulating layer 5, and conductive pillars 7a, 7b for connecting the conductor layer 4 to the conductor layer 6. The conductive pillars 7a, 7b are connected to each other through the shield pattern 2. In the above structure, by supplying the ground potential to the shield pattern 2, conductor layers 4, 6, and conductive pillars 7a, 7b, an electromagnetic field is blocked in the direction where the line 1 extends over 360° about the line 1.
摘要翻译：具有线1的线路板，与线1平行形成的屏蔽图案2，通过绝缘层3形成为与线1和屏蔽图案2相对形成的导体层4，导体层6形成为通过绝缘层5面对线1和屏蔽图案2，以及用于将导体层4连接到导体层6的导电柱7a，7b。导电柱7a，7b通过屏蔽图案相互连接在上述结构中，通过向屏蔽图案2，导体层4,6和导电柱7a，7b提供接地电位，电磁场在线1围绕线路360°延伸的方向上被阻挡 1。

10. 外观设计

USD386262S Medicinal herb treatment device 失效
公开(公告)号：USD386262S
公开(公告)日：1997-11-11
申请号：US34454
申请日：1995-02-06
申请人： Osamu Shimada
设计人： Osamu Shimada

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