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1. 发明申请

US20100102841A1 DEVICE, METHOD AND PROBE FOR INSPECTING SUBSTRATE 审中-公开
标题翻译：用于检查基板的装置，方法和探针
公开(公告)号：US20100102841A1
公开(公告)日：2010-04-29
申请号：US12605859
申请日：2009-10-26
申请人： Hideya Kawada , Koji Takahashi
发明人： Hideya Kawada , Koji Takahashi
IPC分类号： G01R31/02 , G01R1/06
CPC分类号： G01R1/06733 , G01R1/06722 , G01R1/07328 , G01R31/2805 , G01R31/2808
摘要： A device for inspecting a substrate, including a probe and a support member configured to hold the probe is disclosed. The probe comprises a compression spring and includes a conductive material to measure an electric property of a substrate under inspection.
摘要翻译：公开了一种用于检查包括探针和被配置为保持探针的支撑构件的基板的装置。探针包括压缩弹簧，并且包括用于测量被检查的基底的电特性的导电材料。

2. 发明授权

US07332014B2 Ceramic structure, method of manufacturing ceramic structure, and device for manufacturing ceramic structure 有权
标题翻译：陶瓷结构体，陶瓷结构体的制造方法以及陶瓷结构体的制造装置
公开(公告)号：US07332014B2
公开(公告)日：2008-02-19
申请号：US10986227
申请日：2004-11-12
申请人： Masaharu Ono , Koji Takahashi , Takafumi Hoshino , Hideya Kawada
发明人： Masaharu Ono , Koji Takahashi , Takafumi Hoshino , Hideya Kawada
IPC分类号： B01D46/00 , F01N3/022 , B29C65/70
CPC分类号： C04B35/806 , B01D39/2068 , B01J35/04 , B32B2315/02 , C04B35/565 , C04B35/6316 , C04B37/005 , C04B38/008 , C04B2111/00793 , C04B2235/3418 , C04B2235/5228 , C04B2235/767 , C04B2235/80 , C04B2235/96 , C04B2237/083 , C04B2237/365 , F01N3/0222 , F01N3/2828 , F01N13/18 , F01N2260/10 , F01N2310/06 , F01N2330/06 , F01N2330/48 , F01N2450/28 , Y02T10/20 , Y10S55/05 , Y10S55/10 , Y10S55/30 , Y10S264/48 , Y10T428/24149 , C04B35/00 , C04B38/0006
摘要： A ceramic structure includes a plurality of porous ceramic members each being warped, each of the plurality of porous ceramic members having a bonding portion and end portions at both ends of each of the plurality of porous ceramic members in a longitudinal direction of each of the plurality of porous ceramic members, and an adhesive provided only on the bonding portion between the plurality of porous ceramic members to connect the plurality of porous ceramic members except for the end portions of the plurality of ceramic members.
摘要翻译：陶瓷结构包括多个多孔陶瓷构件，每个多孔陶瓷构件各自翘曲，多个多孔陶瓷构件中的每一个在多个多孔陶瓷构件的每一个的长度方向上具有接合部分和两端的端部的多孔陶瓷构件，以及仅在多个多孔陶瓷构件之间的接合部分上设置的粘合剂，以连接多个陶瓷构件的除了多个陶瓷构件的端部之外的多个多孔陶瓷构件。

3. 发明申请

US20050178098A1 Ceramic structure, method of manufacturing ceramic structure, and device for manufacturing ceramic structure 有权
标题翻译：陶瓷结构体，陶瓷结构体的制造方法以及陶瓷结构体的制造装置
公开(公告)号：US20050178098A1
公开(公告)日：2005-08-18
申请号：US10986227
申请日：2004-11-12
申请人： Masaharu Ono , Koji Takahashi , Takafumi Hoshino , Hideya Kawada
发明人： Masaharu Ono , Koji Takahashi , Takafumi Hoshino , Hideya Kawada
IPC分类号： B01D39/20 , B01J35/04 , C04B35/565 , C04B35/63 , C04B35/80 , C04B37/00 , C04B38/00 , F01N3/022 , F01N3/28 , F01N13/18 , B01D46/00
CPC分类号： C04B35/806 , B01D39/2068 , B01J35/04 , B32B2315/02 , C04B35/565 , C04B35/6316 , C04B37/005 , C04B38/008 , C04B2111/00793 , C04B2235/3418 , C04B2235/5228 , C04B2235/767 , C04B2235/80 , C04B2235/96 , C04B2237/083 , C04B2237/365 , F01N3/0222 , F01N3/2828 , F01N13/18 , F01N2260/10 , F01N2310/06 , F01N2330/06 , F01N2330/48 , F01N2450/28 , Y02T10/20 , Y10S55/05 , Y10S55/10 , Y10S55/30 , Y10S264/48 , Y10T428/24149 , C04B35/00 , C04B38/0006
摘要： A ceramic structure includes a plurality of porous ceramic members each being warped, each of the plurality of porous ceramic members having a bonding portion and end portions at both ends of each of the plurality of porous ceramic members in a longitudinal direction of each of the plurality of porous ceramic members, and an adhesive provided only on the bonding portion between the plurality of porous ceramic members to connect the plurality of porous ceramic members except for the end portions of the plurality of ceramic members.
摘要翻译：陶瓷结构包括多个多孔陶瓷构件，每个多孔陶瓷构件各自翘曲，多个多孔陶瓷构件中的每一个在多个多孔陶瓷构件的每一个的长度方向上具有接合部分和两端的端部的多孔陶瓷构件，以及仅在多个多孔陶瓷构件之间的接合部分上设置的粘合剂，以连接多个陶瓷构件的除了多个陶瓷构件的端部之外的多个多孔陶瓷构件。

4. 发明申请

US20080223502A1 Manufacturing method of printed wiring board and a laminate Jointing apparatus 有权
标题翻译：印刷线路板和层压板的制造方法接合装置
公开(公告)号：US20080223502A1
公开(公告)日：2008-09-18
申请号：US11519885
申请日：2006-09-13
申请人： Hideya Kawada
发明人： Hideya Kawada
IPC分类号： B32B37/00 , B65H69/02
CPC分类号： H05K3/0097 , H05K3/328 , H05K3/4644 , H05K2201/10598 , H05K2203/0285 , H05K2203/1545 , Y10T156/17
摘要： This invention provides a manufacturing method of printed wiring board which enables a plate-like substrate to be carried and processed without any contact to its product surface. End portions of plate-like copper clad laminates are overlapped vertically and then joined linearly by rotating an ultrasonic horn along the end portions. Consequently, copper foils can be metal-joined and a joining strength necessary for transportation with a roller is obtained. Because belt-like copper clad laminate is obtained by joining the plate-like copper clad laminates and after that, processed, thus, the belt-like copper clad laminate can be carried without any contact to its product surface as it is carried with the roller, and then processed.
摘要翻译：本发明提供一种印刷电路板的制造方法，其能够使板状基板承载和加工而不与其产品表面接触。板状覆铜层压板的端部垂直重叠，然后沿着端部旋转超声波喇叭直线接合。因此，铜箔可以是金属接合的，并且获得与辊的输送所需的接合强度。因为带状覆铜层压板是通过接合板状覆铜层压板而获得的，因此加工后，带状覆铜层压板可随着辊子承载而与其产品表面无接触，然后处理。

5. 发明授权

US08220696B2 Manufacturing method of printed wiring board and a laminate jointing apparatus 有权
标题翻译：印刷电路板的制造方法以及层压接合装置
公开(公告)号：US08220696B2
公开(公告)日：2012-07-17
申请号：US11519885
申请日：2006-09-13
申请人： Hideya Kawada
发明人： Hideya Kawada
IPC分类号： B23K1/06
CPC分类号： H05K3/0097 , H05K3/328 , H05K3/4644 , H05K2201/10598 , H05K2203/0285 , H05K2203/1545 , Y10T156/17
摘要： This invention provides a manufacturing method of printed wiring board which enables a plate-like substrate to be carried and processed without any contact to its product surface. End portions of plate-like copper clad laminates are overlapped vertically and then joined linearly by rotating an ultrasonic horn along the end portions. Consequently, copper foils can be metal-joined and a joining strength necessary for transportation with a roller is obtained. Because belt-like copper clad laminate is obtained by joining the plate-like copper clad laminates and after that, processed, thus, the belt-like copper clad laminate can be carried without any contact to its product surface as it is carried with the roller, and then processed.
摘要翻译：本发明提供一种印刷电路板的制造方法，其能够使板状基板承载和加工而不与其产品表面接触。板状覆铜层压板的端部垂直重叠，然后沿着端部旋转超声波喇叭直线接合。因此，铜箔可以是金属接合的，并且获得与辊的输送所需的接合强度。因为带状覆铜层压板是通过接合板状覆铜层压板而获得的，因此加工后，带状覆铜层压板可随着辊子承载而与其产品表面无接触，然后处理。

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