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1. 发明授权

US08823063B2 SOI substrate, method for manufacturing the same, and semiconductor device 有权
标题翻译： SOI衬底，其制造方法和半导体器件
公开(公告)号：US08823063B2
公开(公告)日：2014-09-02
申请号：US13267024
申请日：2011-10-06
申请人： Hideto Ohnuma , Tetsuya Kakehata , Yoichi Iikubo
发明人： Hideto Ohnuma , Tetsuya Kakehata , Yoichi Iikubo
IPC分类号： H01L29/772 , H01L29/04
CPC分类号： H01L21/76254 , H01L21/84
摘要： An SOI substrate having an SOI layer that can be used in practical applications even when a substrate with low upper temperature limit, such as a glass substrate, is used, is provided. A semiconductor device using such an SOI substrate, is provided. In bonding a single-crystal semiconductor layer to a substrate having an insulating surface or an insulating substrate, a silicon oxide film formed using organic silane as a material on one or both surfaces that are to form a bond is used. According to the present invention, a substrate with an upper temperature limit of 700° C. or lower, such as a glass substrate, can be used, and an SOI layer that is strongly bonded to the substrate can be obtained. In other words, a single-crystal semiconductor layer can be formed over a large-area substrate that is longer than one meter on each side.
摘要翻译：提供了即使使用诸如玻璃基板的具有低的上限温度的基板也可以在实际应用中使用具有SOI层的SOI衬底。提供了使用这种SOI衬底的半导体器件。在将单晶半导体层接合到具有绝缘表面的基板或绝缘基板上时，使用在有一个或两个表面上形成键的有机硅烷作为材料形成的氧化硅膜。根据本发明，可以使用具有700℃以上的上限温度的基板，例如玻璃基板，并且可以获得与基板强结合的SOI层。换句话说，单晶半导体层可以形成在每侧长于1米的大面积基板上。

2. 发明授权

US08034694B2 SOI substrate, method for manufacturing the same, and semiconductor device 有权
标题翻译： SOI衬底，其制造方法和半导体器件
公开(公告)号：US08034694B2
公开(公告)日：2011-10-11
申请号：US12073741
申请日：2008-03-10
申请人： Hideto Ohnuma , Tetsuya Kakehata , Yoichi Iikubo
发明人： Hideto Ohnuma , Tetsuya Kakehata , Yoichi Iikubo
IPC分类号： H01L21/30 , H01L21/46 , H01L21/322
CPC分类号： H01L21/76254 , H01L21/84
摘要： An SOI substrate having an SOI layer that can be used in practical applications even when a substrate with low upper temperature limit, such as a glass substrate, is used, is provided. A semiconductor device using such an SOI substrate, is provided. In bonding a single-crystal semiconductor layer to a substrate having an insulating surface or an insulating substrate, a silicon oxide film formed using organic silane as a material on one or both surfaces that are to form a bond is used. According to the present invention, a substrate with an upper temperature limit of 700° C. or lower, such as a glass substrate, can be used, and an SOI layer that is strongly bonded to the substrate can be obtained. In other words, a single-crystal semiconductor layer can be formed over a large-area substrate that is longer than one meter on each side.
摘要翻译：提供了即使使用诸如玻璃基板的具有低的上限温度的基板也可以在实际应用中使用具有SOI层的SOI衬底。提供了使用这种SOI衬底的半导体器件。在将单晶半导体层接合到具有绝缘表面的基板或绝缘基板上时，使用在有一个或两个表面上形成键的有机硅烷作为材料形成的氧化硅膜。根据本发明，可以使用具有700℃以上的上限温度的基板，例如玻璃基板，并且可以获得与基板强结合的SOI层。换句话说，单晶半导体层可以形成在每侧长于1米的大面积基板上。

3. 发明申请

US20080246109A1 SOI substrate, method for manufacturing the same, and semiconductor device 有权
标题翻译： SOI衬底，其制造方法和半导体器件
公开(公告)号：US20080246109A1
公开(公告)日：2008-10-09
申请号：US12073741
申请日：2008-03-10
申请人： Hideto Ohnuma , Tetsuya Kakehata , Yoichi Iikubo
发明人： Hideto Ohnuma , Tetsuya Kakehata , Yoichi Iikubo
IPC分类号： H01L21/782 , H01L27/12
CPC分类号： H01L21/76254 , H01L21/84
摘要： An SOI substrate having an SOI layer that can be used in practical applications even when a substrate with low upper temperature limit, such as a glass substrate, is used, is provided. A semiconductor device using such an SOI substrate, is provided. In bonding a single-crystal semiconductor layer to a substrate having an insulating surface or an insulating substrate, a silicon oxide film formed using organic silane as a material on one or both surfaces that are to form a bond is used. According to the present invention, a substrate with an upper temperature limit of 700° C. or lower, such as a glass substrate, can be used, and an SOI layer that is strongly bonded to the substrate can be obtained. In other words, a single-crystal semiconductor layer can be formed over a large-area substrate that is longer than one meter on each side.
摘要翻译：提供了即使使用诸如玻璃基板的具有低的上限温度的基板也可以在实际应用中使用具有SOI层的SOI衬底。提供了使用这种SOI衬底的半导体器件。在将单晶半导体层结合到具有绝缘表面的基板或绝缘基板上时，使用在一个或两个表面上形成键的有机硅烷作为材料形成的氧化硅膜。根据本发明，可以使用具有700℃以上的上限温度的基板，例如玻璃基板，并且可以获得与基板强结合的SOI层。换句话说，单晶半导体层可以形成在每侧长于1米的大面积基板上。

4. 发明授权

US07767542B2 Manufacturing method of SOI substrate 有权
标题翻译： SOI衬底的制造方法
公开(公告)号：US07767542B2
公开(公告)日：2010-08-03
申请号：US12078091
申请日：2008-03-27
申请人： Hideto Ohnuma , Yoichi Iikubo , Takayoshi Sato
发明人： Hideto Ohnuma , Yoichi Iikubo , Takayoshi Sato
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： H01L27/1266 , H01L21/76259 , H01L27/1214 , H01L29/66772
摘要： There is provided a method of manufacturing an SOI substrate which is practicable even when a supporting substrate having a low allowable temperature limit is used. A separation layer is formed in a region at a certain depth from a surface of a semiconductor substrate, and a first heat treatment is conducted when a semiconductor layer on the separation layer is bonded to the supporting substrate and separated. A second heat treatment is conducted to the supporting substrate to which the semiconductor layer is bonded. The second heat treatment is conducted at a temperature which is equal to or higher than the temperature of the first heat treatment and does not exceed a strain point of the supporting substrate. When the first heat treatment and the second heat treatment are conducted at the same temperature, a treatment time of the second heat treatment may be set to be longer.
摘要翻译：提供了制造SOI衬底的方法，即使使用具有低允许温度极限的支撑衬底也是可行的。在与半导体衬底的表面一定深度的区域中形成分离层，并且当分离层上的半导体层结合到支撑衬底上并分离时，进行第一热处理。对与半导体层接合的支撑基板进行第二热处理。第二热处理在等于或高于第一热处理的温度的温度下进行，并且不超过支撑基板的应变点。当在相同温度下进行第一热处理和第二热处理时，可以将第二热处理的处理时间设定得更长。

5. 发明授权

US08198173B2 Method for manufacturing SOI substrate 有权
标题翻译：制造SOI衬底的方法
公开(公告)号：US08198173B2
公开(公告)日：2012-06-12
申请号：US12910320
申请日：2010-10-22
申请人： Hideto Ohnuma , Kenichiro Makino , Yoichi Iikubo , Masaharu Nagai , Aiko Shiga
发明人： Hideto Ohnuma , Kenichiro Makino , Yoichi Iikubo , Masaharu Nagai , Aiko Shiga
IPC分类号： H01L21/46
CPC分类号： H01L21/84 , H01L21/76254 , H01L29/66772 , H01L29/78621
摘要： To improve bonding strength and improve reliability of an SOI substrate in bonding a semiconductor substrate and a base substrate to each other even when an insulating film containing nitrogen is used as a bonding layer, an oxide film is provided on the semiconductor substrate side, a nitrogen-containing layer is provided on the base substrate side, and the oxide film formed on the semiconductor substrate and the nitrogen-containing layer formed over the base substrate are bonded to each other. Further, plasma treatment is performed on at least one of the oxide film and the nitrogen-containing layer before bonding the oxide film formed on the semiconductor substrate and the nitrogen-containing layer formed over the base substrate to each other. Plasma treatment can be performed in a state in which a bias voltage is applied.
摘要翻译：即使使用含有氮的绝缘膜作为接合层，为了提高接合强度并提高SOI基板的接合半导体基板和基板的可靠性，在半导体基板侧设置氧化膜，氮在基底基板侧设置含氧层，并且形成在半导体基板上的氧化膜和形成在基底基板上的含氮层彼此结合。此外，在将形成在半导体衬底上的氧化膜和形成在基底衬底上的含氮层彼此粘合之前，对氧化物膜和含氮层中的至少一种进行等离子体处理。可以在施加偏置电压的状态下进行等离子体处理。

6. 发明授权

US07727846B2 Method of manufacturing an SOI substrate and method of manufacturing a semiconductor device 失效
标题翻译：制造SOI衬底的方法和制造半导体器件的方法
公开(公告)号：US07727846B2
公开(公告)日：2010-06-01
申请号：US12213137
申请日：2008-06-16
申请人： Hideto Ohnuma , Ryota Imahayashi , Yoichi Iikubo , Kenichiro Makino , Sho Nagamatsu
发明人： Hideto Ohnuma , Ryota Imahayashi , Yoichi Iikubo , Kenichiro Makino , Sho Nagamatsu
IPC分类号： H01L21/331 , H01L21/8222
CPC分类号： H01L27/1266 , H01L21/76254 , H01L27/1214 , H01L29/78654
摘要： It is an object of the present invention is to provide a method of manufacturing an SOI substrate provided with a single-crystal semiconductor layer which can be practically used even when a substrate having a low heat-resistant temperature, such as a glass substrate or the like, is used, and further, to manufacture a semiconductor device with high reliability by using such an SOI substrate. A semiconductor layer which is separated from a semiconductor substrate and bonded to a supporting substrate having an insulating surface is irradiated with electromagnetic waves, and the surface of the semiconductor layer is subjected to polishing treatment. At least part of a region of the semiconductor layer is melted by irradiation with electromagnetic waves, and a crystal defect in the semiconductor layer can be reduced. Further, the surface of the semiconductor layer can be polished and planarized by polishing treatment.
摘要翻译：本发明的一个目的是提供一种制造具有单晶半导体层的SOI衬底的方法，即使当具有低耐热温度的衬底如玻璃衬底或并且进一步通过使用这种SOI衬底制造具有高可靠性的半导体器件。将与半导体基板分离并与具有绝缘面的支撑基板接合的半导体层用电磁波照射，对半导体层的表面进行抛光处理。半导体层的区域的至少一部分通过电磁波的照射而熔融，能够降低半导体层的晶体缺陷。此外，半导体层的表面可以通过抛光处理被抛光和平坦化。

7. 发明授权

US08361873B2 Method of manufacturing an SOI substrate and method of manufacturing a semiconductor device 有权
公开(公告)号：US08361873B2
公开(公告)日：2013-01-29
申请号：US12762600
申请日：2010-04-19
申请人： Hideto Ohnuma , Ryota Imahayashi , Yoichi Iikubo , Kenichiro Makino , Sho Nagamatsu
发明人： Hideto Ohnuma , Ryota Imahayashi , Yoichi Iikubo , Kenichiro Makino , Sho Nagamatsu
IPC分类号： H01L21/331 , H01L21/8222
CPC分类号： H01L27/1266 , H01L21/76254 , H01L27/1214 , H01L29/78654
摘要： It is an object of the present invention is to provide a method of manufacturing an SOI substrate provided with a single-crystal semiconductor layer which can be practically used even when a substrate having a low heat-resistant temperature, such as a glass substrate or the like, is used, and further, to manufacture a semiconductor device with high reliability by using such an SOI substrate. A semiconductor layer which is separated from a semiconductor substrate and bonded to a supporting substrate having an insulating surface is irradiated with electromagnetic waves, and the surface of the semiconductor layer is subjected to polishing treatment. At least part of a region of the semiconductor layer is melted by irradiation with electromagnetic waves, and a crystal defect in the semiconductor layer can be reduced. Further, the surface of the semiconductor layer can be polished and planarized by polishing treatment.

8. 发明授权

US07955949B2 Manufacturing method of SOI substrate 有权
标题翻译： SOI衬底的制造方法
公开(公告)号：US07955949B2
公开(公告)日：2011-06-07
申请号：US12829409
申请日：2010-07-02
申请人： Hideto Ohnuma , Yoichi Iikubo , Takayoshi Sato
发明人： Hideto Ohnuma , Yoichi Iikubo , Takayoshi Sato
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： H01L27/1266 , H01L21/76259 , H01L27/1214 , H01L29/66772
摘要： There is provided a method of manufacturing an SOI substrate which is practicable even when a supporting substrate having a low allowable temperature limit is used. A separation layer is formed in a region at a certain depth from a surface of a semiconductor substrate, and a first heat treatment is conducted when a semiconductor layer on the separation layer is bonded to the supporting substrate and separated. A second heat treatment is conducted to the supporting substrate to which the semiconductor layer is bonded. The second heat treatment is conducted at a temperature which is equal to or higher than the temperature of the first heat treatment and does not exceed a strain point of the supporting substrate. When the first heat treatment and the second heat treatment are conducted at the same temperature, a treatment time of the second heat treatment may be set to be longer.
摘要翻译：提供了制造SOI衬底的方法，即使使用具有低允许温度极限的支撑衬底也是可行的。在与半导体衬底的表面一定深度的区域中形成分离层，并且当分离层上的半导体层结合到支撑衬底上并分离时，进行第一热处理。对与半导体层接合的支撑基板进行第二热处理。第二热处理在等于或高于第一热处理的温度的温度下进行，并且不超过支撑基板的应变点。当在相同温度下进行第一热处理和第二热处理时，可以将第二热处理的处理时间设定得更长。

9. 发明授权

US08598013B2 Method for manufacturing SOI substrate and semiconductor device 有权
标题翻译：制造SOI衬底和半导体器件的方法
公开(公告)号：US08598013B2
公开(公告)日：2013-12-03
申请号：US12247470
申请日：2008-10-08
申请人： Shunpei Yamazaki , Hideto Ohnuma , Yoichi Iikubo , Yoshiaki Yamamoto , Kenichiro Makino
发明人： Shunpei Yamazaki , Hideto Ohnuma , Yoichi Iikubo , Yoshiaki Yamamoto , Kenichiro Makino
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： H01L27/1266 , H01L21/76254 , H01L27/1214 , H01L29/66772
摘要： To provide a method for manufacturing an SOI substrate provided with a semiconductor layer which can be used practically even when a substrate having a low heat-resistant temperature, such as a glass substrate or the like is used. The semiconductor layer is transferred to a supporting substrate by the steps of irradiating a semiconductor wafer with ions from one surface to form a damaged layer; forming an insulating layer over one surface of the semiconductor wafer; attaching one surface of the supporting substrate to the insulating layer formed over the semiconductor wafer and performing heat treatment to bond the supporting substrate to the semiconductor wafer; and performing separation at the damaged layer into the semiconductor wafer and the supporting substrate. The damaged layer remaining partially over the semiconductor layer is removed by wet etching and a surface of the semiconductor layer is irradiated with a laser beam.
摘要翻译：为了提供一种制造具有半导体层的SOI衬底的方法，即使使用诸如玻璃衬底等的耐热温度低的衬底也可以实际使用。通过以下步骤将半导体层转移到支撑衬底：从一个表面照射半导体晶片以形成损伤层; 在所述半导体晶片的一个表面上形成绝缘层; 将所述支撑基板的一个表面附接到形成在所述半导体晶片上的绝缘层，并进行热处理以将所述支撑基板接合到所述半导体晶片; 并且在所述损伤层处进行到所述半导体晶片和所述支撑基板的分离。通过湿蚀刻除去半导体层上部分残留的损伤层，并用激光束照射半导体层的表面。

10. 发明授权

US08101501B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08101501B2
公开(公告)日：2012-01-24
申请号：US12240186
申请日：2008-09-29
申请人： Hideto Ohnuma , Yoichi Iikubo , Shunpei Yamazaki
发明人： Hideto Ohnuma , Yoichi Iikubo , Shunpei Yamazaki
IPC分类号： H01L21/46
CPC分类号： H01L27/1266 , H01L21/76254 , H01L27/1214 , H01L29/66772
摘要： To provide a method of manufacturing a semiconductor device, which prevents impurities from entering an SOI substrate. A source gas including one or plural kinds selected from a hydrogen gas, a helium gas, or halogen gas are excited to generate ions, and the ions are added to a bonding substrate to thereby form a fragile layer in the bonding substrate. Then, a region of the bonding substrate that is on and near the surface thereof, i.e., a region ranging from a shallower position than the fragile layer to the surface is removed by etching, polishing, or the like. Next, after attaching the bonding substrate to a base substrate, the bonding substrate is separated at the fragile layer to thereby form a semiconductor film over the base substrate. After forming the semiconductor film over the base substrate, a semiconductor element is formed using the semiconductor film.
摘要翻译：提供一种防止杂质进入SOI衬底的半导体器件的制造方法。激发包括选自氢气，氦气或卤素气体中的一种或多种的源气体以产生离子，并将离子加入到接合衬底中，从而在接合衬底中形成脆性层。然后，通过蚀刻，抛光等除去在其表面上及其附近，即从比脆弱层更浅的位置到表面的区域的接合基板的区域。接下来，在将接合基板粘贴到基底基板上之后，在脆性层分离接合基板，从而在基底基板上形成半导体膜。在基底基板上形成半导体膜之后，使用半导体膜形成半导体元件。

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