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    • 10. 发明授权
    • Abrasive member, abrasive disc provided with same, and polishing process
    • 研磨部件,与其相同的研磨盘,以及抛光工序
    • US06361403B1
    • 2002-03-26
    • US09465264
    • 1999-12-17
    • Hideto KuramochiYoshitaka Kubota
    • Hideto KuramochiYoshitaka Kubota
    • B24B100
    • B24B37/11B24D3/28B24D13/14
    • An abrasive member made of a silica molding predominantly comprised of silica is described. The abrasive member has a bulk density of 0.2 to 1.5 g/cm3, a BET specific surface area of 10 to 400 m2/g, an average particle diameter of 0.001 to 0.5 &mgr;m, and a multiplicity of interconnecting minute pores which are open to the exterior. A solid soluble in a polishing liquid is made present within the minute pores of the silica molding. The abrasive member is fixed or fitted to a supporting auxiliary to be assembled into an abrasive disc. The abrasive disc is used for polishing a material to be polished, by rubbing the material to be polished therewith while at least one of the abrasive disc and the material to be polished is moved and while a polishing liquid is applied to the abrasive disc.
    • 描述了由主要由二氧化硅组成的二氧化硅模制件制成的磨料构件。 研磨部件的体积密度为0.2〜1.5g / cm 3,BET比表面积为10〜400m2 / g,平均粒径为0.001〜0.5μm,多个相互连接的细孔 外观。 在二氧化硅成型体的细孔中存在可溶于抛光液的固体。 研磨构件固定或装配到支撑辅助件上以组装成研磨盘。 研磨盘用于通过在研磨盘和待抛光材料中的至少一个移动并且抛光液体被施加到研磨盘的同时摩擦待抛光材料来抛光待抛光材料。