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    • 3. 发明授权
    • Shift array for pattern information processing device utilizing charge
coupled semiconductor device
    • 利用电荷耦合半导体器件的图形信息处理装置的移位阵列
    • US4041521A
    • 1977-08-09
    • US298569
    • 1972-10-18
    • Hideo SunamiYokichi ItohFumiyuki InoseYoshiaki Kamigaki
    • Hideo SunamiYokichi ItohFumiyuki InoseYoshiaki Kamigaki
    • G11C27/04H01L21/339H01L27/105H01L29/423H01L29/762H01L29/78
    • H01L27/1057H01L29/42396
    • A shift array for shifting carriers introduced into a semiconductor body toward the X-direction and Y-direction comprises an insulating layer disposed on the semiconductor body, first electrodes disposed on the insulating layer and arranged in a matrix on the X-Y plane, second electrodes disposed between adjacent first electrodes, conductors disposed adjacent to the first electrodes to be connected to the electrodes of each row when carriers are transferred toward the Y-direction, conductors disposed adjacent to the first electrodes to be connected to the electrodes of each column when carriers are transferred toward the X-direction. When carriers are transferred toward the X-direction, the second electrodes disposed between the adjacent first electrodes of each column are biased with a DC voltage whose electrical polarity is reversed relative to the DC voltage applied to the first electrodes for preventing the transit of carriers toward the Y-direction. When carriers are transferred toward the Y-direction, the second electrodes disposed between the adjacent first electrodes of each row are biased with a DC voltage whose polarity is reversed relative to the DC voltage applied to the first electrodes for preventing the transit of carriers toward the X-direction.
    • 用于将引入半导体本体的载流子移动到X方向和Y方向的移位阵列包括设置在半导体本体上的绝缘层,设置在绝缘层上并以矩阵形式布置在XY平面上的第一电极,第二电极设置 在相邻的第一电极之间,当载体朝着Y方向转移时,邻近第一电极设置的导体设置成与每行的电极连接,当载体为载体时,与第一电极邻近设置的导体连接到每列的电极 向X方向转移。 当载体向X方向转移时,设置在每列的相邻第一电极之间的第二电极被以直流电压偏置,该DC电压的电极性相对于施加到第一电极的DC电压反转,以防止载流子朝向 Y方向。 当载体朝向Y方向转移时,设置在每行的相邻第一电极之间的第二电极被以直流电压偏置,该直流电压的极性相对于施加到第一电极的直流电压而相反,以防止载流子朝向 X方向。
    • 10. 发明授权
    • Method of manufacturing a semiconductor integrated circuit device
    • 制造半导体集成电路器件的方法
    • US07064090B2
    • 2006-06-20
    • US10942860
    • 2004-09-17
    • Shinichi MinamiYoshiaki KamigakiHideki YasuokaFukuo Owada
    • Shinichi MinamiYoshiaki KamigakiHideki YasuokaFukuo Owada
    • H01L21/00
    • H01L27/11526H01L27/0629H01L27/105H01L27/1052H01L27/11521H01L27/11546Y10S438/983
    • A manufacturing technique for a zener diode which includes forming a first semiconductor region in a region such as a well region at a primary face of a semiconductor substrate and then forming a second semiconductor region of opposite conductivity type thereover. The second semiconductor region covers an area greater than the underlying first semiconductor region. The method further calls for forming an insulating film on the primary face of the substrate followed by the forming connection holes in the insulating film to expose an upper part of the second semiconductor region located outside the area covered by the junction affected between the first and second semiconductor regions. This is followed by the formation of a wire at the upper part of the insulating film in which an electrical connection is affected between the wire and the second semiconductor region through the plural connection holes which are distributively arranged.
    • 一种用于齐纳二极管的制造技术,其包括在半导体衬底的初级面的诸如阱区域的区域中形成第一半导体区域,然后在其上形成相反导电类型的第二半导体区域。 第二半导体区域覆盖大于下面的第一半导体区域的面积。 该方法还要求在衬底的主面上形成绝缘膜,然后在绝缘膜中形成连接孔,以暴露第二半导体区域的上部,该第二半导体区域的上部位于由第一和第二 半导体区域。 接着在绝缘膜的上部形成通过分布布置的多个连接孔在电线和第二半导体区域之间形成电连接的导线。