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1. 发明授权

US07259046B2 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US07259046B2
公开(公告)日：2007-08-21
申请号：US11075421
申请日：2005-03-09
申请人： Hideo Aoki , Yoshiaki Sugizaki , Naoko Yamaguchi , Chiaki Takubo
发明人： Hideo Aoki , Yoshiaki Sugizaki , Naoko Yamaguchi , Chiaki Takubo
IPC分类号： H01L21/00
CPC分类号： H01L23/49883 , H01L21/4867 , H01L21/563 , H01L22/14 , H01L22/20 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/98 , H01L25/0655 , H01L2224/0401 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05572 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/1146 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/14135 , H01L2224/14156 , H01L2224/16 , H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/45144 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/49171 , H01L2224/73204 , H01L2224/81026 , H01L2224/81097 , H01L2224/81191 , H01L2224/81193 , H01L2224/814 , H01L2224/81439 , H01L2224/81444 , H01L2224/818 , H01L2224/83886 , H01L2224/92125 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2224/05552 , H01L2224/05599
摘要： According to one aspect of the present invention, a semiconductor device, comprising a wiring board provided with wires and electrodes; a semiconductor element which is mounted on the wiring board and has plural connection electrodes formed on its surface; and a metal layer of fine metal particles aggregated and bonded which is interposed between the electrodes on the wiring board and the connection electrodes of the semiconductor element to connect between the electrodes and the connection electrodes, is provided.
摘要翻译：根据本发明的一个方面，提供了一种半导体器件，包括：布线板，其配有导线和电极; 半导体元件，其安装在所述布线板上，并且在其表面上形成有多个连接电极; 并且设置介于导线板上的电极和半导体元件的连接电极之间聚集和结合的金属微粒金属层，以连接电极和连接电极。

2. 发明申请

US20050199989A1 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050199989A1
公开(公告)日：2005-09-15
申请号：US11075421
申请日：2005-03-09
申请人： Hideo Aoki , Yoshiaki Sugizaki , Naoko Yamaguchi , Chiaki Takubo
发明人： Hideo Aoki , Yoshiaki Sugizaki , Naoko Yamaguchi , Chiaki Takubo
IPC分类号： H01L23/12 , H01L21/60 , H01L23/02 , H01L23/48 , H01L23/52 , H01L25/00
CPC分类号： H01L23/49883 , H01L21/4867 , H01L21/563 , H01L22/14 , H01L22/20 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/98 , H01L25/0655 , H01L2224/0401 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05572 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/1146 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/14135 , H01L2224/14156 , H01L2224/16 , H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/45144 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/49171 , H01L2224/73204 , H01L2224/81026 , H01L2224/81097 , H01L2224/81191 , H01L2224/81193 , H01L2224/814 , H01L2224/81439 , H01L2224/81444 , H01L2224/818 , H01L2224/83886 , H01L2224/92125 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2224/05552 , H01L2224/05599
摘要： According to one aspect of the present invention, a semiconductor device, comprising a wiring board provided with wires and electrodes; a semiconductor element which is mounted on the wiring board and has plural connection electrodes formed on its surface; and a metal layer of fine metal particles aggregated and bonded which is interposed between the electrodes on the wiring board and the connection electrodes of the semiconductor element to connect between the electrodes and the connection electrodes, is provided.
摘要翻译：根据本发明的一个方面，提供了一种半导体器件，包括：布线板，其配有导线和电极; 半导体元件，其安装在所述布线板上，并且在其表面上形成有多个连接电极; 并且设置介于导线板上的电极和半导体元件的连接电极之间聚集和结合的金属微粒金属层，以连接电极和连接电极。

3. 发明授权

US07939171B2 Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit 失效
标题翻译：含金属的树脂颗粒，含金属的树脂层，形成含金属的树脂层的方法和用于电子电路的基材
公开(公告)号：US07939171B2
公开(公告)日：2011-05-10
申请号：US11018473
申请日：2004-12-22
申请人： Hideo Aoki , Naoko Yamaguchi , Chiaki Takubo
发明人： Hideo Aoki , Naoko Yamaguchi , Chiaki Takubo
IPC分类号： B32B5/66
CPC分类号： H05K3/207 , H05K1/095 , H05K3/1266 , H05K2201/0212 , H05K2201/0215 , H05K2203/0517 , Y10T428/12535 , Y10T428/12556 , Y10T428/12569 , Y10T428/256 , Y10T428/2991 , Y10T428/2998
摘要： Provided is metal-containing resin particle for forming a conductor pattern in which the metal particles are dispersed in a resin matrix, and the content of the metal particles is 70 wt % or less.
摘要翻译：本发明提供用于形成金属颗粒分散在树脂基体中的金属的树脂颗粒，并且金属颗粒的含量为70重量％以下。

4. 发明授权

US07486921B2 Method of producing electronic circuit, and electronic circuit substrate 有权
标题翻译：电子电路的制造方法和电子电路基板
公开(公告)号：US07486921B2
公开(公告)日：2009-02-03
申请号：US11017922
申请日：2004-12-22
申请人： Naoko Yamaguchi , Hideo Aoki , Chiaki Takubo
发明人： Naoko Yamaguchi , Hideo Aoki , Chiaki Takubo
IPC分类号： G03G15/20
CPC分类号： H05K3/207 , G03G15/224 , G03G15/225 , G03G15/6585 , G03G15/6591 , H05K3/1266 , H05K3/246 , H05K3/4664 , H05K2201/0212 , H05K2201/0215 , H05K2201/0347 , H05K2203/0517
摘要： According to one mode of the present invention, a method of producing an electronic circuit, comprising forming an integrated resin layer having a prescribed thickness by repeating a resin layer forming process a number of times so that resin layers are layered to be integrated with all the resin layers on a substrate, wherein the resin forming process comprises charging the surface of a photoconductor; forming an electrostatic latent image having a prescribed pattern on the surface of the charged photoconductor; forming a visible image by electrostatically attaching charged particles composed of resin on the surface of the photoconductor on which the electrostatic latent image is formed; transferring the visible image formed on the surface of the photoconductor and composed of the charged particles onto the substrate; and fixing said visible image transferred onto said substrate on said substrate to form the resin layer on said substrate, is provided.
摘要翻译：根据本发明的一个方式，一种电子电路的制造方法，其特征在于，通过重复树脂层形成工序多次来形成具有规定厚度的一体化树脂层，使树脂层层叠成与所有的树脂层，其中所述树脂形成工艺包括对光电导体的表面进行充电; 在带电的感光体的表面上形成具有规定图案的静电潜像; 通过在其上形成有静电潜像的感光体的表面上静电附着由树脂构成的带电粒子来形成可见图像; 将形成在感光体的表面上的由带电粒子构成的可见图像转印到基板上; 并且将所述转印到所述基板上的所述可见图像固定在所述基板上，以在所述基板上形成树脂层。

5. 发明申请

US20050227161A1 Image forming apparatus and method of manufacturing electronic circuit using the same 有权
标题翻译：使用该电子电路的图像形成装置及其制造方法
公开(公告)号：US20050227161A1
公开(公告)日：2005-10-13
申请号：US11100388
申请日：2005-04-07
申请人： Hideo Aoki , Naoko Yamaguchi , Chiaki Takubo , Toshiaki Yamauchi , Koji Imamiya , Hiroshi Hashizume
发明人： Hideo Aoki , Naoko Yamaguchi , Chiaki Takubo , Toshiaki Yamauchi , Koji Imamiya , Hiroshi Hashizume
IPC分类号： G03G15/16 , G03G15/20 , H05K1/09 , H05K3/10 , H05K3/20 , H05K3/24
CPC分类号： H05K3/207 , G03G15/6591 , G03G2215/00523 , H05K1/095 , H05K3/1266 , H05K3/246 , H05K2201/0347 , H05K2201/09781 , H05K2203/0517 , H05K2203/105 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： An image forming apparatus comprises an exposure unit forming an electrostatic latent image on a photoconductor based on image information, a developing unit developing the electrostatic latent image by toner made of formation material of a circuitry layer, and an electrostatic transferring unit transferring a toner image on the photoconductor onto a substrate. The toner image is transferred so as to cover at least a part of a conductor layer formed on the substrate. At this time, excessive charges caused in the conductor layer accompanying the start of the transfer of the toner image are removed. Alternatively, charges of which polarity is reverse to that of the toner are added to the conductor layer. These allow the circuitry layer to be formed to have a desired pattern favorably and securely on the conductor layer.
摘要翻译：图像形成装置包括基于图像信息在感光体上形成静电潜像的曝光单元，通过电路层的形成材料制成的调色剂来显影静电潜像的显影单元和将调色剂图像转印到静电转印单元上光电导体到基板上。转印调色剂图像以覆盖形成在基板上的导体层的至少一部分。此时，伴随着调色剂图像的转印开始导致的导体层中引起的过多的电荷被去除。或者，将与该调色剂相反极性的电荷加到导体层中。这些允许电路层形成为在导体层上有利地并且牢固地具有期望的图案。

6. 发明授权

US08220147B2 Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit 有权
标题翻译：含金属的树脂颗粒，树脂颗粒，电子电路基板以及电子电路的制造方法
公开(公告)号：US08220147B2
公开(公告)日：2012-07-17
申请号：US12541568
申请日：2009-08-14
申请人： Naoko Yamaguchi , Hideo Aoki , Chiaki Takubo
发明人： Naoko Yamaguchi , Hideo Aoki , Chiaki Takubo
IPC分类号： H05K3/02 , H05K3/10 , H01K3/22 , H01K3/00
CPC分类号： H05K3/246 , G03G15/6585 , H01L23/49883 , H01L2924/0002 , H05K1/095 , H05K3/1266 , H05K3/4664 , H05K2201/0212 , H05K2201/0347 , H05K2203/0517 , Y10T29/49128 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T428/12097 , Y10T428/12104 , Y10T428/12111 , Y10T428/24917 , H01L2924/00
摘要： According to one mode of the present invention, metal-containing resin particles composed of a resin containing 50 wt % or more of a thermosetting resin and having a ratio of weight of absorbed moisture to weight of resin from 500 to 14500 ppm, and fine metal particles contained in said resin, is provided.
摘要翻译：根据本发明的一个方式，由含有50重量％以上的热固性树脂的树脂构成的含有氧化物的树脂粒子，其吸水重量与树脂重量比为500〜14500ppm，细金属提供了包含在所述树脂中的颗粒。

7. 发明授权

US07414417B2 Contact sheet for testing electronic parts, apparatus for testing electronic parts, method for testing electronic parts, method for manufacturing electronic parts and electronic parts 失效
标题翻译：电子部件检测用接触片，电子部件检测装置，电子部件检测方法，电子部件及电子部件的制造方法
公开(公告)号：US07414417B2
公开(公告)日：2008-08-19
申请号：US10885777
申请日：2004-07-08
申请人： Naoko Yamaguchi , Hideo Aoki , Chiaki Takubo , Toshiro Hiraoka , Yasuyuki Hotta , Shigeru Matake
发明人： Naoko Yamaguchi , Hideo Aoki , Chiaki Takubo , Toshiro Hiraoka , Yasuyuki Hotta , Shigeru Matake
IPC分类号： G01R31/02 , H01L21/66 , B23K31/02
CPC分类号： G01R1/0735
摘要： According to one aspect of the invention, a contact sheet for testing electronic parts, comprising an insulating porous layer; and a connection electrode which is disposed on the insulating porous layer and electrically connect the electrode or terminal of the electronic parts and the terminal of a test apparatus; wherein the connection electrode is embedded below at least one main surface of the insulating porous layer.
摘要翻译：根据本发明的一个方面，一种用于测试电子部件的接触片，包括绝缘多孔层; 以及连接电极，其设置在绝缘多孔层上并将电子部件的电极或端子与测试装置的端子电连接; 其中所述连接电极嵌入所述绝缘多孔层的至少一个主表面的下方。

8. 发明申请

US20070029107A1 Wiring board and production method of wiring board 有权
标题翻译：接线板接线板及接线板的生产方法
公开(公告)号：US20070029107A1
公开(公告)日：2007-02-08
申请号：US11580849
申请日：2006-10-16
申请人： Hideo Aoki , Chiaki Takubo , Naoko Yamaguchi
发明人： Hideo Aoki , Chiaki Takubo , Naoko Yamaguchi
IPC分类号： G03C3/00
CPC分类号： H05K3/246 , H05K1/095 , H05K3/102 , H05K3/4661 , H05K3/4664 , H05K2201/0212 , H05K2201/0221 , H05K2201/0347 , H05K2203/121 , Y10T29/49126 , Y10T29/49135 , Y10T29/49155 , Y10T29/49156 , Y10T428/24917
摘要： A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a conductive metal layer which is formed on the resin layer with the fine metal particles interposed between them.
摘要翻译：布线板包括基板; 树脂层，其被选择性地形成在基板的一个主表面上，并且具有包含或粘附到其表面的细金属颗粒; 以及形成在树脂层上的导电金属层，其间插入有金属微粒。

9. 发明申请

US20050279996A1 Organic semiconductor element and manufacturing method thereof 审中-公开
标题翻译：有机半导体元件及其制造方法
公开(公告)号：US20050279996A1
公开(公告)日：2005-12-22
申请号：US11152373
申请日：2005-06-15
申请人： Chiaki Takubo , Hideo Aoki , Naoko Yamaguchi
发明人： Chiaki Takubo , Hideo Aoki , Naoko Yamaguchi
IPC分类号： H01L29/04 , H01L29/08 , H01L29/10 , H01L31/036 , H01L35/24 , H01L51/00 , H01L51/05
CPC分类号： H01L51/0015 , H01L51/0003 , H01L51/0017 , H01L51/0541 , H01L51/0545
摘要： An organic semiconductor element comprises an organic semiconductor layer and an electrode supplying an electric current or an electric field to the organic semiconductor layer. The organic semiconductor layer includes a heat fusion layer of organic semiconductor particles. The heat fusion layer of the organic semiconductor particles is formed in such a manner that, for example, the organic semiconductor particles are made to adhere on a layer that is to be a base, by using an electrophotographic method, and thereafter, an adhesion layer of the organic semiconductor particles is heated to fusion bond the organic semiconductor particles. According to such an organic semiconductor element and a manufacturing method thereof, it is possible to enhance element manufacturing efficiency without an advantage of low cost and a miniaturization of an element structure.
摘要翻译：有机半导体元件包括有机半导体层和向有机半导体层提供电流或电场的电极。有机半导体层包括有机半导体颗粒的热熔融层。有机半导体粒子的热熔融层以这样的方式形成，即例如通过使用电子照相法使有机半导体颗粒粘附在作为基底的层上，然后将粘附层的有机半导体颗粒被加热以熔融结合有机半导体颗粒。根据这样的有机半导体元件及其制造方法，可以提高元件制造效率，而不需要元件结构的低成本和小型化的优点。

10. 发明申请

US20050224931A1 Method of producing electronic circuit and electronic circuit 有权
标题翻译：电子电路和电子电路的制造方法
公开(公告)号：US20050224931A1
公开(公告)日：2005-10-13
申请号：US11103464
申请日：2005-04-12
申请人： Hideo Aoki , Naoko Yamaguchi , Chiaki Takubo , Toshiaki Yamauchi , Koji Imamiya , Hiroshi Hashizume
发明人： Hideo Aoki , Naoko Yamaguchi , Chiaki Takubo , Toshiaki Yamauchi , Koji Imamiya , Hiroshi Hashizume
IPC分类号： H05K3/18 , H01L21/48 , H01L23/495 , H05K1/09 , H05K3/12 , H05K3/24
CPC分类号： H05K3/246 , G03G15/224 , G03G15/225 , G03G15/6585 , G03G15/6591 , H01L21/4846 , H01L2924/0002 , H05K1/095 , H05K3/1266 , H05K3/242 , H05K2201/0347 , H05K2203/0517 , Y10S438/951 , H01L2924/00
摘要： According to an embodiment of the present invention, a method of producing an electronic circuit comprises printing first metal-containing resin particles which consist of at least a thermosetting resin and fine metal particles and second metal-containing resin particles which consist of at least a thermoplastic resin and fine metal particles by electrophotography to form a first base pattern which consists of the first metal-containing resin particles and a second base pattern which consists of the second metal-containing resin particles on a substrate; forming a first metal conductor layer on the first and second base patterns; forming a second metal conductor layer on the first metal conductor layer by electrolytic plating by supplying electric current to the first metal conductor layer; and removing the second base pattern and the first and second metal conductor layers which are formed on the second base pattern.
摘要翻译：根据本发明的一个实施方案，电子电路的制造方法包括：将至少由热固性树脂和细金属颗粒组成的第一含金属树脂颗粒和第二含金属树脂颗粒打印，所述第二含金属树脂颗粒由至少热塑性塑料树脂和细金属颗粒，以形成由第一含金属的树脂颗粒和由基材上的第二含金属的树脂颗粒组成的第二基底图案的第一基底图案; 在所述第一和第二基底图案上形成第一金属导体层; 通过向第一金属导体层提供电流通过电解电镀在第一金属导体层上形成第二金属导体层; 以及去除形成在第二基底图案上的第二基底图案和第一和第二金属导体层。

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