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    • 6. 发明授权
    • Nonvolatile semiconductor storage device having buried electrode within shallow trench
    • 非易失性半导体存储器件,其具有在浅沟槽内的埋入电极
    • US06222769B1
    • 2001-04-24
    • US09503459
    • 2000-02-14
    • Tohru MaruyamaRiichiro Shirota
    • Tohru MaruyamaRiichiro Shirota
    • G11C1604
    • H01L27/11521G11C11/5621G11C16/0483H01L27/11524
    • In a NAND cell type of EEPROM memory which has an STI (Shallow Trench Isolation) structure and uses memory cells into which two- or more-value data can be rewritten through the use of floating channel writing techniques, a plurality of floating gate electrodes are formed above the surface of an Si substrate with a tunnel oxide interposed therebetween. Trenches are formed in portions of the surface of the Si substrate each of which is located between floating gate electrodes arranged in one direction. In each trench, a conductive material is buried to form a buried electrode which is externally impressed with a low voltage. This boots the channel potential of nonselected cells, preventing erroneous writing without increasing the cost per bit. In particular, in such a structure that the buried electrode is formed only along each of the sidewalls of the trench, the voltages that are applied to the word line at write time can be rendered as low as possible by applying a negative potential to the buried electrode.
    • 在具有STI(浅沟槽隔离)结构的NAND单元类型的EEPROM存储器中,并且使用通过使用浮动通道写入技术可以重写两个或多个值数据的存储单元,多个浮置栅极电极 形成在硅衬底的表面之上,其间插入隧道氧化物。 沟槽形成在Si衬底的表面中的每一个位于沿一个方向布置的浮置栅极之间的部分中。 在每个沟槽中,埋入导电材料以形成外部施加低电压的掩埋电极。 这会引导非选定单元的通道电位,从而防止写入错误而不增加每位的成本。 特别地,在这样的结构中,埋入电极仅沿着沟槽的每个侧壁形成,在写入时施加到字线的电压可以通过向掩埋层施加负电位而尽可能低 电极。
    • 10. 发明授权
    • Product disassembling and assembling system and a method of disassembling and assembling the product
    • 产品拆装组装系统及拆卸组装产品的方法
    • US07055232B2
    • 2006-06-06
    • US10784188
    • 2004-02-24
    • Tohru MaruyamaKenichi Shinozaki
    • Tohru MaruyamaKenichi Shinozaki
    • B23P19/00B23P21/00
    • B23P21/004B41J2/17503Y10T29/49Y10T29/49815Y10T29/49819Y10T29/53Y10T29/53004Y10T29/53022
    • A system and method for disassembling and assembling a product. The system includes a production facility for assembling a product, a processing facility for disassembling a used product and offering the unit or parts of the used product for assembling the product after the unit and parts are processed, and a commonly-used processing facility for practicing mutually reversible steps between the process of assembling the product and the process of disassembling the used product and offering the unit and parts for assembling the product and/or for practicing steps which are identical for the assembling and disassembling processes. The method includes the steps of performing an assembling process, performing a disassembling process, and performing in a commonly-used processing facility mutually reversible steps between the assembling and disassembling process and/or performing steps which are identical for the assembling and disassembling processes.
    • 一种用于拆卸和组装产品的系统和方法。 该系统包括用于组装产品的生产设备,用于拆卸已使用的产品的处理设备,并且在处理单元和部件之后提供用于组装产品的单元或部件,以及用于实践的常用处理设备 在组装产品的过程和拆卸使用的产品的过程之间相互可逆的步骤,并提供用于组装产品的单元和部件和/或用于组装和拆卸过程相同的练习步骤。 该方法包括以下步骤:执行组装过程,执行拆卸过程,以及在通用处理设备中执行组装和拆卸过程之间相互可逆的步骤和/或执行与组装和拆卸过程相同的步骤。