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    • 1. 发明授权
    • Process for producing aluminum alloy substrate for lithographic printing plate
    • 用于制造平版印刷版铝合金基板的方法
    • US06387198B1
    • 2002-05-14
    • US09245237
    • 1999-02-05
    • Hideki SuzukiYasuhisa NishikawaTomohide YamagishiKazumitsu MizushimaHirokazu SawadaHirokazu Sakaki
    • Hideki SuzukiYasuhisa NishikawaTomohide YamagishiKazumitsu MizushimaHirokazu SawadaHirokazu Sakaki
    • C22F104
    • C22C21/00B41N1/083C22F1/04
    • In order to produce an aluminum alloy substrate for a lithographic printing plate wherein grain structure refining and homogenizing are promoted, and the uniformity of the appearance of the grained surface is particularly improved, the process of the present invention comprises the steps of: homogenizing an aluminum alloy ingot comprising 0.10 to 0.40 wt % of Fe, 0.03 to 0.30 wt % of Si, 0.004 to 0.050 wt % of Cu, 0.01 to 0.05 wt % of Ti, 0.0001 to 0.02 wt % of B and the balance of Al and unavoidable impurities, at temperatures of 350 to 480° C., successively hot-rolling the ingot with a plurality of passes in such a manner that the aluminum alloy is not recrystallized prior to the hot rolling of the final pass and recrystallized at least in the surface layer of the hot-rolled plate by only the hot rolling thereof to form a recrystallized structure having an average recrystallized grain size of less than 50 &mgr;m in a direction normal to the rolling direction, and cold-rolling the hot-rolled plate. The reduction of the plate in the hot rolling of the final pass is desirably at least 55%.
    • 为了生产促进晶粒细化和均质化的平版印刷版的铝合金基板,并且特别提高了晶粒表面的外观的均匀性,本发明的方法包括以下步骤:使铝均匀化 含有0.10〜0.40重量%的Fe,0.03〜0.30重量%的Si,0.004〜0.050重量%的Cu,0.01〜0.05重量%的Ti,0.0001〜0.02重量%的B,余量的Al和不可避免的杂质 ,在350〜480℃的温度下,以多次通过依次热轧锭,使铝合金在最后通过热轧之前不再结晶,至少在表面层中再结晶 的热轧板,在与轧制方向正交的方向上形成平均再结晶晶粒尺寸小于50μm的再结晶组织,并将该热轧板 ed板 最终通过的热轧中的板的还原期望为至少55%。