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    • 3. 发明授权
    • Electronic device and manufacturing method thereof
    • 电子装置及其制造方法
    • US6071800A
    • 2000-06-06
    • US183211
    • 1998-10-30
    • Hiroya ShigemotoYukio Ono
    • Hiroya ShigemotoYukio Ono
    • H01F41/04H01F17/00H01F27/29H01G4/232H01G4/30H05K3/34H01L21/44H01G4/228H01L23/48
    • H01G4/232H05K3/3442
    • An electronic device has an element assembly, in which electronic parts elements are disposed, and external electrodes of metal film which are formed on surfaces of the element assembly of the electronic device so as to extend and connect to the electronic parts elements, respectively. Further, in this electronic device, the external electrode is made up of an anchor layer adhered on the surface of the element assembly of the electronic device, a solder-resist layer formed to cover the anchor layer, and a solder-wettable layer formed to cover a surface of the solder-resistant layer and showing a superior wettability with respect to molten solder, in which the external electrode further comprises an intermediate layer provided between the solder-resistant layer and the solder-wettable layer and made of an alloy containing both metal materials forming the solder-resistant layer and the solder-wettable layer.
    • 电子设备具有其中设置有电子部件元件的元件组件和形成在电子设备的元件组件的表面上的金属膜的外部电极,以分别延伸并连接到电子元件元件。 此外,在该电子设备中,外部电极由附着在电子器件的元件组件的表面上的固定层,形成为覆盖锚定层的阻焊层和可焊接润湿层构成, 覆盖耐焊层的表面,并且相对于熔融焊料显示出优异的润湿性,其中外部电极还包括设置在耐焊料层和可焊性可润湿层之间的中间层,并由含有两者的合金 形成耐焊层和可焊接润湿层的金属材料。
    • 4. 发明授权
    • Laminated electronic part having internal conducting region connected to an external contact and manufacturing method thereof
    • 具有连接到外部接点的内部导电区域的层叠电子部件及其制造方法
    • US06621682B1
    • 2003-09-16
    • US09624770
    • 2000-07-25
    • Satoshi TakakuwaHiroya ShigemotoYukio Ono
    • Satoshi TakakuwaHiroya ShigemotoYukio Ono
    • H01G4228
    • H01G4/228H01G4/12H01G4/232
    • An electronic part is made from a laminated object including stacked abutting ceramic green sheets each carrying an electrically conductive paste having a contact portion in proximity to an edge of the sheet. The laminated object is fired to form a laminated body including ceramic insulator layers abutting electrically conductive internal electrode layers including contact segments in proximity to a side of the object. The body is then processed so the contact segments are exposed on the side of the object. Then an external electrode is formed on the polished body where the contact segment is exposed by using a dry process so the external electrode and the contact segment abut to establish an electric contact between the external electrode and the contact segments. The firing step causes the paste to move relative to the edges of the sheets so the contact segments are displaced relative to the edges of the sheets. The processing step results in a reduction of the displacement of the contact segments relative to the edges of the sheets so the contact segments are displaced relative to the edges of the sheets by a distance to provide an anchoring effect for the external electrode when it is formed by the dry process.
    • 电子部件由层叠体构成,该层叠体包括层叠的邻接的陶瓷生片,每个载体具有靠近片的边缘的接触部分的导电膏。 对层叠体进行烧成,形成层叠体,该层叠体具有与导电性内部电极层邻接的陶瓷绝缘体层,该内部电极层包括靠近物体一侧的接触部。 然后处理身体,使得接触段暴露在物体的侧面。 然后,通过使用干法将外部电极形成在暴露接触段的抛光体上,使得外部电极和接触部分邻接以在外部电极和接触段之间建立电接触。 烧制步骤使糊料相对于片材的边缘移动,使得接触片段相对于片材的边缘移位。 处理步骤导致接触片段相对于片材边缘的位移减小,使得接触片段相对于片材的边缘移位一定距离,以在其形成时为外部电极提供锚固效果 通过干燥过程。
    • 5. 发明授权
    • Electronic device
    • 电子设备
    • US6151204A
    • 2000-11-21
    • US298706
    • 1999-04-23
    • Hiroya ShigemotoYukio Ono
    • Hiroya ShigemotoYukio Ono
    • H01F41/04H01F17/00H01F27/29H01G4/232H01G4/30H05K3/34H01G4/008H01G2/20
    • H01G4/232H05K3/3442
    • An electronic device has an element assembly, in which electronic parts elements are disposed, and external electrodes of metal film which are formed on surfaces of the element assembly of the electronic device so as to extend and connect to the electronic parts elements, respectively. Further, in this electronic device, the external electrode is made up of an anchor layer adhered on the surface of the element assembly of the electronic device, a solder-resist layer formed to cover the anchor layer, and a solder-wettable layer formed to cover a surface of the solder-resistant layer and showing a superior wettability with respect to molten solder, in which the external electrode further includes an intermediate layer provided between the solder-resistant layer and the solder-wettable layer and made of an alloy containing both metal materials forming the solder-resistant layer and the solder-wettable layer.
    • 电子设备具有其中设置有电子部件元件的元件组件和形成在电子设备的元件组件的表面上的金属膜的外部电极,以分别延伸并连接到电子元件元件。 此外,在该电子设备中,外部电极由附着在电子器件的元件组件的表面上的固定层,形成为覆盖锚定层的阻焊层和可焊接润湿层构成, 覆盖耐焊层的表面并且相对于熔融焊料显示出优异的润湿性,其中外部电极还包括设置在耐焊层和可焊性润湿层之间的中间层,并且由含有两者的合金制成 形成耐焊层和可焊接润湿层的金属材料。