专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20090151875A1 SHEET CUTTING TABLE 有权
标题翻译：表切割表
公开(公告)号：US20090151875A1
公开(公告)日：2009-06-18
申请号：US12067280
申请日：2006-10-05
申请人： Hideaki Nonaka , Kenji Kobayashi , Yoshiaki Sugishita
发明人： Hideaki Nonaka , Kenji Kobayashi , Yoshiaki Sugishita
IPC分类号： B32B38/10
CPC分类号： B26D3/10 , B26F1/3846 , H01L21/67132 , Y10T83/7684 , Y10T83/7688 , Y10T83/7693 , Y10T83/7697 , Y10T83/7701 , Y10T83/7705 , Y10T83/7709 , Y10T83/7713 , Y10T83/7718 , Y10T83/7722 , Y10T83/7726 , Y10T83/773 , Y10T156/1052 , Y10T156/12
摘要： A sheet cutting table 13, after sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet S1 with a cutting device 15. The table 13 includes an inner table 52 which supports the semiconductor wafer W, and an outer table 51 corresponding to the unnecessary adhesive sheet S1 outside the semiconductor wafer W. The upper surface of the outer table 51 is provided with a non-adherable treatment surface 51A, and an adherable member formed with a ring member 53 or a plate member 63 for sticking the adhesive sheet S thereto.
摘要翻译：在将切割装置15作为不需要的粘合片S1切断半导体晶片W外侧的区域之后，将粘合片S粘贴到半导体晶片W之后的片材切割台13.台13包括内台52，半导体晶片W和与半导体晶片W外侧的不需要的粘合片S1对应的外台51.外台51的上表面设置有不可粘接的处理面51A，形成有环状部件 53或用于将粘合片S粘贴的板构件63。

2. 发明申请

US20090127145A1 STOCK DEVICE FOR CUTTER BLADE 审中-公开
标题翻译：切割刀片的装置
公开(公告)号：US20090127145A1
公开(公告)日：2009-05-21
申请号：US11995452
申请日：2006-07-21
申请人： Hideaki Nonaka , Kan Nakata , Yoshiaki Sugishita , Kenji Kobayashi
发明人： Hideaki Nonaka , Kan Nakata , Yoshiaki Sugishita , Kenji Kobayashi
IPC分类号： A45C11/00
CPC分类号： B26D7/00 , B25J11/0055 , B25J15/0491 , B26D7/088 , B26D7/2614 , B26D2007/0025 , Y10T83/242 , Y10T83/293
摘要： A stock device 11 for storing cutter blades 21 for a cutting device 10, which includes a case body 40 provided with a receiving section 41 for the cutter blades 21. Within the case body 40, engagement surfaces 43A are provided so as, when the cutter blades 21 are stored in the receiving section 41, to ensure the orientation of the cutter blades 21 to a constant direction when a cutter blade 21 is mounted onto the cutting device 10. Also, the case body 40 stores organic solvent L therein for washing the cutter blades 21, and is arranged so as to be able to dissolve and remove adhesive and the like adhered to a blade 21B with the organic solvent L.
摘要翻译：用于存储用于切割装置10的切割刀片21的储存装置11，其包括设置有用于切割刀片21的接收部分41的壳体40.在壳体40内，设置接合表面43A，当切割器叶片21被存储在接收部分41中，以便当切割刀片21安装到切割装置10上时确保切割刀片21朝向恒定方向。此外，壳体40将有机溶剂L存储在其中用于洗涤刀片21，并且被布置成能够用有机溶剂L溶解并除去粘附到刀片21B上的粘合剂等。

3. 发明授权

US07954533B2 Sheet cutting table 有权
标题翻译：片材切割台
公开(公告)号：US07954533B2
公开(公告)日：2011-06-07
申请号：US12067280
申请日：2006-10-05
申请人： Hideaki Nonaka , Kenji Kobayashi , Yoshiaki Sugishita
发明人： Hideaki Nonaka , Kenji Kobayashi , Yoshiaki Sugishita
IPC分类号： B29C65/00 , B29C65/10 , B32B37/00 , B32B38/04 , B32B38/10 , B32B41/00 , B31F5/00 , G03D15/04 , B26D5/00 , B26D1/14 , B26D1/18 , B65C9/40 , G05G15/00 , B23D33/02 , B27B5/00 , B27B5/18 , B27B27/06 , B27B5/34 , B27B3/28 , B27B27/04 , A47G29/00 , F16M11/00
CPC分类号： B26D3/10 , B26F1/3846 , H01L21/67132 , Y10T83/7684 , Y10T83/7688 , Y10T83/7693 , Y10T83/7697 , Y10T83/7701 , Y10T83/7705 , Y10T83/7709 , Y10T83/7713 , Y10T83/7718 , Y10T83/7722 , Y10T83/7726 , Y10T83/773 , Y10T156/1052 , Y10T156/12
摘要： A sheet cutting table 13, after sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet S1 with a cutting device 15. The table 13 includes an inner table 52 which supports the semiconductor wafer W, and an outer table 51 corresponding to the unnecessary adhesive sheet S1 outside the semiconductor wafer W. The upper surface of the outer table 51 is provided with a non-adherable treatment surface 51A, and an adherable member formed with a ring member 53 or a plate member 63 for sticking the adhesive sheet S thereto.
摘要翻译：在将切割装置15作为不需要的粘合片S1切断半导体晶片W外侧的区域之后，将粘合片S粘贴到半导体晶片W之后的片材切割台13.台13包括内台52，半导体晶片W和与半导体晶片W外侧的不需要的粘合片S1对应的外台51.外台51的上表面设置有不可粘接的处理面51A，形成有环状部件 53或用于将粘合片S粘贴的板构件63。

4. 发明授权

US08186254B2 Sheet cutting device and cutting method 有权
标题翻译：切纸装置和切割方法
公开(公告)号：US08186254B2
公开(公告)日：2012-05-29
申请号：US12636576
申请日：2009-12-11
申请人： Hideaki Nonaka , Kan Nakata , Yoshiaki Sugishita , Kenji Kobayashi
发明人： Hideaki Nonaka , Kan Nakata , Yoshiaki Sugishita , Kenji Kobayashi
IPC分类号： B26D7/26
CPC分类号： H01L21/67132 , B25J11/0055 , B25J15/04 , B26D1/1535 , B26D3/10 , B26D7/015 , B26D7/22 , B26D7/2614 , B26F1/3846 , H01L21/67092 , Y10T83/0393 , Y10T83/0467 , Y10T83/0543 , Y10T83/8798 , Y10T83/8821 , Y10T83/9457 , Y10T156/12
摘要： A cutting device that, after a sheet is stuck on a wafer on a sticking table, cuts the sheet along the outer edge of the wafer. The cutting device includes a robot body disposed besides the sticking table and a cutter blade supported by a tool holding chuck positioned at the front end of the robot body. The cutter blade is detachably attached to the tool holding chuck so as to be replaceable and is arranged so as to cut the sheet in a state that the posture thereof is adjusted along a preset movement track.
摘要翻译：一种切割装置，在片材粘贴在粘贴台上的晶片上之后，沿着晶片的外边缘切割片材。切割装置包括设置在粘贴台之外的机器人主体和由位于机器人主体的前端的工具夹持卡盘支撑的切割刀片。切割刀片可拆卸地附接到工具夹持卡盘，以便可更换，并且布置成在沿着预设的移动轨道调节其姿势的状态下切割片材。

5. 发明申请

US20100089216A1 SHEET CUTTING DEVICE AND CUTTING METHOD 有权
标题翻译：切割装置和切割方法
公开(公告)号：US20100089216A1
公开(公告)日：2010-04-15
申请号：US12636576
申请日：2009-12-11
申请人： Hideaki NONAKA , Kan Nakata , Yoshiaki Sugishita , Kenji Kobayashi
发明人： Hideaki NONAKA , Kan Nakata , Yoshiaki Sugishita , Kenji Kobayashi
IPC分类号： B26D5/08
CPC分类号： H01L21/67132 , B25J11/0055 , B25J15/04 , B26D1/1535 , B26D3/10 , B26D7/015 , B26D7/22 , B26D7/2614 , B26F1/3846 , H01L21/67092 , Y10T83/0393 , Y10T83/0467 , Y10T83/0543 , Y10T83/8798 , Y10T83/8821 , Y10T83/9457 , Y10T156/12
摘要： A cutting device 15 that, after a sheet S is stuck on a wafer W on a sticking table 13, cuts the sheet S along the outer edge of the wafer. The cutting device 15 comprises a robot body 62 disposed beside the sticking table 13 and a cutter blade 63 supported by a tool holding chuck 69 positioned at the front end of the robot body 62. The cutter blade 63 is detachably attached to the tool holding chuck 69 so as to be replaceable and is arranged so as to cut the sheet S in a state that the posture thereof is adjusted along a preset movement track.
摘要翻译：切割装置15，在片材S粘贴在粘贴台13上的晶片W上之后，沿着晶片的外边缘切割片材S. 切割装置15包括设置在贴装台13旁边的机器人主体62和由位于机器人主体62的前端的工具夹持卡盘69支撑的切割刀片63.刀片63可拆卸地安装在工具夹持卡盘 69，以便可更换并且被布置为在沿着预设的移动轨道调节其姿势的状态下切割片材S.

6. 发明申请

US20090126542A1 SHEET CUTTING DEVICE AND CUTTING METHOD 审中-公开
标题翻译：切割装置和切割方法
公开(公告)号：US20090126542A1
公开(公告)日：2009-05-21
申请号：US11996060
申请日：2006-07-21
申请人： Hideaki Nonaka , Kan Nakata , Yoshiaki Sugishita , Kenji Kobayashi
发明人： Hideaki Nonaka , Kan Nakata , Yoshiaki Sugishita , Kenji Kobayashi
IPC分类号： B26D3/00 , B26D5/08
CPC分类号： H01L21/67132 , B25J11/0055 , B25J15/04 , B26D1/1535 , B26D3/10 , B26D7/015 , B26D7/22 , B26D7/2614 , B26F1/3846 , H01L21/67092 , Y10T83/0393 , Y10T83/0467 , Y10T83/0543 , Y10T83/8798 , Y10T83/8821 , Y10T83/9457 , Y10T156/12
摘要： A cutting device 15 that, after a sheet S is stuck on a wafer W on a sticking table 13, cuts the sheet S along the outer edge of the wafer. The cutting device 15 comprises a robot body 62 disposed beside the sticking table 13 and a cutter blade 63 supported by a tool holding chuck 69 positioned at the front end of the robot body 62. The cutter blade 63 is detachably attached to the tool holding chuck so as to be replaceable and is arranged so as to cut the sheet S in a state that the posture thereof is adjusted along a preset movement track.
摘要翻译：切割装置15，在片材S粘贴在粘贴台13上的晶片W上之后，沿着晶片的外边缘切割片材S. 切割装置15包括设置在贴装台13旁边的机器人主体62和由位于机器人主体62的前端的工具夹持卡盘69支撑的切割刀片63.刀片63可拆卸地安装在工具夹持卡盘以便可更换并且被布置成在沿着预设的移动轨道调节其姿势的状态下切割片材S.

7. 发明申请

US20080029221A1 Label Making Apparatus 有权
标题翻译：标签制作设备
公开(公告)号：US20080029221A1
公开(公告)日：2008-02-07
申请号：US11632712
申请日：2005-07-20
申请人： Akira Dangami , Kenji Kobayashi , Yoshiaki Sugishita
发明人： Akira Dangami , Kenji Kobayashi , Yoshiaki Sugishita
IPC分类号： B32B37/00
CPC分类号： B31D1/021 , Y10T156/1195 , Y10T156/1994
摘要： The label making apparatus of the invention comprises a guide plate 17 for guiding a raw sheet M in a predetermined feeding direction, an inspecting device 15 for inspecting a label L on a release liner S constituting the raw sheet M, a transfer device 25 for partially bypassing the feeding direction of the release liner to peel off a label from the release liner and temporarily sticking the non-defective label at a position on the release liner advanced toward the downstream side in the feeding direction by a predetermined distance, and a collecting device 22 for collecting a defective when a defective label is detected. The transfer device 25 adjusts the bypass length of the release liner so that a certain interval is kept between the non-defective label after a defective label is detected with respect to the preceding non-defective label.
摘要翻译：本发明的标签制造装置包括用于沿预定的进给方向引导原料片M的引导板17，用于检查构成原纸M的剥离衬垫S上的标签L的检查装置15，部分地绕过剥离衬垫的进给方向，从剥离衬垫上剥离标签，并将非缺陷标签临时粘贴在释放衬垫上的位置，使其沿着进给方向向下游侧前进预定距离，并且收集装置 22，用于在检测到有缺陷的标签时收集缺陷。传送装置25调整剥离衬垫的旁路长度，使得在相对于先前的无缺陷标签检测到有缺陷的标签之后，在无缺陷标签之间保持一定间隔。

8. 发明授权

US07753097B2 Label making apparatus 有权
标题翻译：标签制作机
公开(公告)号：US07753097B2
公开(公告)日：2010-07-13
申请号：US11632712
申请日：2005-07-20
申请人： Akira Dangami , Kenji Kobayashi , Yoshiaki Sugishita
发明人： Akira Dangami , Kenji Kobayashi , Yoshiaki Sugishita
IPC分类号： B32B41/00
CPC分类号： B31D1/021 , Y10T156/1195 , Y10T156/1994
摘要： The label making apparatus of the invention comprises a guide plate 17 for guiding a raw sheet M in a predetermined feeding direction, an inspecting device 15 for inspecting a label L on a release liner S constituting the raw sheet M, a transfer device 25 for partially bypassing the feeding direction of the release liner to peel off a label from the release liner and temporarily sticking the non-defective label at a position on the release liner advanced toward the downstream side in the feeding direction by a predetermined distance, and a collecting device 22 for collecting a defective when a defective label is detected. The transfer device 25 adjusts the bypass length of the release liner so that a certain interval is kept between the non-defective label after a defective label is detected with respect to the preceding non-defective label.
摘要翻译：本发明的标签制造装置包括用于沿预定的进给方向引导原料片M的引导板17，用于检查构成原纸M的剥离衬垫S上的标签L的检查装置15，部分地绕过剥离衬垫的进给方向，从剥离衬垫上剥离标签，并将非缺陷标签临时粘贴在释放衬垫上的位置，使其沿着进给方向向下游侧前进预定距离，并且收集装置 22，用于在检测到有缺陷的标签时收集缺陷。传送装置25调整剥离衬垫的旁路长度，使得在相对于先前的无缺陷标签检测到有缺陷的标签之后，在无缺陷标签之间保持一定间隔。

9. 发明申请

US20090229735A1 SHEET STICKING APPARATUS AND STICKING METHOD 有权
标题翻译：薄板贴纸和贴纸方法
公开(公告)号：US20090229735A1
公开(公告)日：2009-09-17
申请号：US12090202
申请日：2006-10-25
申请人： Hideaki Nonaka , Kenji Kobayashi
发明人： Hideaki Nonaka , Kenji Kobayashi
IPC分类号： B32B37/10
CPC分类号： H01L21/67132
摘要： A sheet sticking apparatus 10 comprises a sheet feed-out unit 12 that feeds out an adhesive sheet S to a position facing a surface of a semiconductor wafer W and a press roller 14 that presses the adhesive sheet S to stick the adhesive sheet S onto the wafer W. The sheet feed-out unit 12 includes a tension measuring means 35 for measuring a tension of the adhesive sheet S between the sheet feed-out unit 12 and the press roller 14 and a sticking angle maintaining means 37 provided with a feed-out head 49 for maintaining a sticking angle θ. After measuring and adjusting the tension immediately before sticking the adhesive sheet S, the feed-out head 49 is lowered in proportion to the movement amount of the press roller 14, thereby the sticking angle θ is maintained, and thus the tension is maintained at a constant level.
摘要翻译：片材贴附装置10包括将粘合片S送出到面向半导体晶片W的表面的位置的片材供给单元12以及按压粘合片S以将粘合片S粘贴到其上的压辊14 片材送出单元12包括用于测量片材送出单元12和加压辊14之间的粘合片S的张力的张力测量装置35和设置有馈送单元12的粘贴角度保持装置37。输出头49用于保持粘着角度θ。在粘贴片S之前立即测量和调节张力之后，送出头49与按压辊14的移动量成比例地下降，从而保持粘着角θ，因此张力保持在恒定水平。

10. 发明申请

US20090223638A1 SHEET STICKING APPARATUS 有权
标题翻译：表面贴装
公开(公告)号：US20090223638A1
公开(公告)日：2009-09-10
申请号：US11916788
申请日：2006-06-26
申请人： Hideaki Nonaka , Kenji Kobayashi
发明人： Hideaki Nonaka , Kenji Kobayashi
IPC分类号： H01L21/683
CPC分类号： H01L21/67132 , Y10T156/1343 , Y10T156/17 , Y10T156/1705
摘要： A sheet sticking apparatus comprises a sheet feed-out unit 12 including a peel plate 22 for peeling off an adhesive sheet S from a release liner PS; and a press roller 14 for pressing the adhesive sheet S onto a wafer W supported by a table 13 to stick the sheet thereto, wherein the peel plate 22 is supported movably forward and backward by a cylinder 50. The peel plate 22 is arranged so that the initial position of the front end is adjusted forward/backward corresponding to the size of the wafer W or the size of the table 13 supporting the same.
摘要翻译：片材粘贴装置包括片材送出单元12，其包括用于从剥离衬垫PS剥离粘合片S的剥离板22; 以及用于将粘合片S按压到由桌子13支撑的晶片W上以将片材粘贴在其上的压辊14，其中剥离板22由圆柱体50可向前和向后可移动。剥离板22被布置成使得前端的初始位置根据晶片W的大小或支撑该晶片W的台13的大小进行前后调整。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式