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1. 发明申请

US20110149493A1 STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AND/OR SYSTEMS EMPLOYING THE SAME 有权
标题翻译：堆叠式半导体封装，其制造方法和/或使用其的系统
公开(公告)号：US20110149493A1
公开(公告)日：2011-06-23
申请号：US12910415
申请日：2010-10-22
申请人： Heung-Kyu Kwon , Min-Ok Na , Sung-Woo Park , Ji-Hyun Park , Su-Min Park
发明人： Heung-Kyu Kwon , Min-Ok Na , Sung-Woo Park , Ji-Hyun Park , Su-Min Park
IPC分类号： G06F1/16 , H05K1/18
CPC分类号： H01L25/0657 , H01L21/561 , H01L21/565 , H01L21/566 , H01L21/568 , H01L23/3128 , H01L23/3142 , H01L23/481 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/105 , H01L25/18 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/13099 , H01L2224/14181 , H01L2224/16112 , H01L2224/16145 , H01L2224/16225 , H01L2224/1703 , H01L2224/17051 , H01L2224/17181 , H01L2224/48091 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/49 , H01L2224/73257 , H01L2224/73265 , H01L2224/81192 , H01L2224/97 , H01L2225/06506 , H01L2225/06513 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01064 , H01L2924/01077 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3025 , H01L2924/3511 , H01L2224/81 , H01L2224/85 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.
摘要翻译：一种装置包括具有第一焊盘的第一衬底和具有第二焊盘的第二衬底。第一模塑料置于第一基材和第二基材之间。第一半导体芯片设置在第一基板上并与第一模制部分接触。第一连接器接触第一焊盘，第二连接器接触第二焊盘。第二连接器设置在第一连接器上。第二连接器的体积大于第一连接器的体积。露出第一半导体芯片的表面。第一模塑料与第二连接器相接触，第二连接器的至少一部分由第一模塑料包围。

2. 发明授权

US09042115B2 Stacked semiconductor packages 有权
标题翻译：堆叠半导体封装
公开(公告)号：US09042115B2
公开(公告)日：2015-05-26
申请号：US13934942
申请日：2013-07-03
申请人： Heung-Kyu Kwon , Min-Ok Na , Sung-Woo Park , Ji-Hyun Park , Su-Min Park
发明人： Heung-Kyu Kwon , Min-Ok Na , Sung-Woo Park , Ji-Hyun Park , Su-Min Park
IPC分类号： H01R12/16 , H01L23/498 , H01L21/56 , H01L23/31 , H01L23/552 , H01L23/00 , H01L25/10 , H01L25/18 , H01L23/48
CPC分类号： H01L25/0657 , H01L21/561 , H01L21/565 , H01L21/566 , H01L21/568 , H01L23/3128 , H01L23/3142 , H01L23/481 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/105 , H01L25/18 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/13099 , H01L2224/14181 , H01L2224/16112 , H01L2224/16145 , H01L2224/16225 , H01L2224/1703 , H01L2224/17051 , H01L2224/17181 , H01L2224/48091 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/49 , H01L2224/73257 , H01L2224/73265 , H01L2224/81192 , H01L2224/97 , H01L2225/06506 , H01L2225/06513 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01064 , H01L2924/01077 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3025 , H01L2924/3511 , H01L2224/81 , H01L2224/85 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.
摘要翻译：一种装置包括具有第一焊盘的第一衬底和具有第二焊盘的第二衬底。第一模塑料置于第一基材和第二基材之间。第一半导体芯片设置在第一基板上并与第一模制部分接触。第一连接器接触第一焊盘，第二连接器接触第二焊盘。第二连接器设置在第一连接器上。第二连接器的体积大于第一连接器的体积。露出第一半导体芯片的表面。第一模塑料与第二连接器相接触，第二连接器的至少一部分由第一模塑料包围。

3. 发明授权

US08508954B2 Systems employing a stacked semiconductor package 有权
标题翻译：采用堆叠半导体封装的系统
公开(公告)号：US08508954B2
公开(公告)日：2013-08-13
申请号：US12910415
申请日：2010-10-22
申请人： Heung-Kyu Kwon , Min-Ok Na , Sung-Woo Park , Ji-Hyun Park , Su-Min Park
发明人： Heung-Kyu Kwon , Min-Ok Na , Sung-Woo Park , Ji-Hyun Park , Su-Min Park
IPC分类号： H01R12/16
CPC分类号： H01L25/0657 , H01L21/561 , H01L21/565 , H01L21/566 , H01L21/568 , H01L23/3128 , H01L23/3142 , H01L23/481 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/105 , H01L25/18 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/13099 , H01L2224/14181 , H01L2224/16112 , H01L2224/16145 , H01L2224/16225 , H01L2224/1703 , H01L2224/17051 , H01L2224/17181 , H01L2224/48091 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/49 , H01L2224/73257 , H01L2224/73265 , H01L2224/81192 , H01L2224/97 , H01L2225/06506 , H01L2225/06513 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01064 , H01L2924/01077 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3025 , H01L2924/3511 , H01L2224/81 , H01L2224/85 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.
摘要翻译：一种装置包括具有第一焊盘的第一衬底和具有第二焊盘的第二衬底。第一模塑料置于第一基材和第二基材之间。第一半导体芯片设置在第一基板上并与第一模制部分接触。第一连接器接触第一焊盘，第二连接器接触第二焊盘。第二连接器设置在第一连接器上。第二连接器的体积大于第一连接器的体积。露出第一半导体芯片的表面。第一模塑料与第二连接器相接触，第二连接器的至少一部分由第一模塑料包围。

4. 发明授权

US08077627B2 Receiving apparatus and method in broadband wireless access system 失效
标题翻译：宽带无线接入系统的接收装置和方法
公开(公告)号：US08077627B2
公开(公告)日：2011-12-13
申请号：US11846295
申请日：2007-08-28
申请人： Chung-Ryul Chang , Keun-Chul Hwang , June Moon , Sung-Ho Lee , In-Seok Hwang , Sung-Woo Park , Jang-Hoon Yang
发明人： Chung-Ryul Chang , Keun-Chul Hwang , June Moon , Sung-Ho Lee , In-Seok Hwang , Sung-Woo Park , Jang-Hoon Yang
IPC分类号： H04B7/02
CPC分类号： H04L5/0048 , H04B1/109 , H04L5/0007 , H04L25/0226 , H04L25/0232 , H04L25/0242 , H04L27/0008 , H04L2025/03426
摘要： Provided is an apparatus and method for enhancing a demodulation performance of a receiver in a Broadband Wireless Access (BWA) system. A receiving apparatus in a broadband wireless communication system includes an estimator, a first calculator, and a second calculator. The estimator estimates a desired signal. The first calculator calculates a correlation matrix of a signal obtained by eliminating the estimated desired signal from a Received (RX) signal. The second calculator performs an interference elimination using the correlation matrix.
摘要翻译：提供了一种用于增强宽带无线接入（BWA）系统中的接收机的解调性能的装置和方法。宽带无线通信系统中的接收装置包括估计器，第一计算器和第二计算器。估计器估计一个期望的信号。第一计算器计算通过从接收（RX）信号中消除估计的期望信号而获得的信号的相关矩阵。第二计算器使用相关矩阵来执行干扰消除。

5. 发明申请

US20110188599A1 METHOD AND APPARATUS FOR PRE-SCHEDULING IN CLOSED-LOOP MU-MIMO ANTENNA SYSTEM 有权
标题翻译：用于在闭环MU-MIMO天线系统中预调度的方法和装置
公开(公告)号：US20110188599A1
公开(公告)日：2011-08-04
申请号：US13019366
申请日：2011-02-02
申请人： Seung-Won Kang , Sung-Woo Park , Soon-Young Yoon , Keun-Chul Hwang
发明人： Seung-Won Kang , Sung-Woo Park , Soon-Young Yoon , Keun-Chul Hwang
IPC分类号： H04B7/02
CPC分类号： H04B7/02
摘要： A method and an apparatus for pre-scheduling in a closed-loop multiple user multiple input multiple output (MU-MIMO) antenna system. A base station receives channel information representing a downlink channel condition of each mobile station from mobile stations in a cell, and determines a candidate user group for each of frequency bands included in an entire frequency band, based on the channel information, the candidate user group including mobile stations to which resources can be simultaneously allocated. The base station also instructs a mobile station included in each candidate user group to transmit a sounding signal through a corresponding frequency band. If the sounding signal is received through the corresponding frequency band, the base station performs a scheduling with regard to the mobile station included in each candidate user group.
摘要翻译：一种用于在闭环多用户多输入多输出（MU-MIMO）天线系统中进行预调度的方法和装置。基站从小区中的移动台接收表示各移动站的下行链路信道状态的信道信息，并根据信道信息确定候选用户组，该候选用户组中包含在整个频带中的频带中的每个频带，候选用户组包括可以同时分配资源的移动台。基站还指示包括在每个候选用户组中的移动台通过对应的频带发送探测信号。如果通过相应的频带接收到探测信号，则基站对每个候选用户组中包括的移动台进行调度。

6. 发明申请

US20080051095A1 RECEIVING APPARATUS AND METHOD IN BROADBAND WIRELESS ACCESS SYSTEM 失效
标题翻译：宽带无线接入系统接收装置及方法
公开(公告)号：US20080051095A1
公开(公告)日：2008-02-28
申请号：US11846295
申请日：2007-08-28
申请人： Chung-Ryul CHANG , Keun-Chui Hwang , June Moon , Sung-Ho Lee , In-Seok Hwang , Sung-Woo Park , Jang-Hoon Yang
发明人： Chung-Ryul CHANG , Keun-Chui Hwang , June Moon , Sung-Ho Lee , In-Seok Hwang , Sung-Woo Park , Jang-Hoon Yang
IPC分类号： H04Q7/20
CPC分类号： H04L5/0048 , H04B1/109 , H04L5/0007 , H04L25/0226 , H04L25/0232 , H04L25/0242 , H04L27/0008 , H04L2025/03426
摘要： Provided is an apparatus and method for enhancing a demodulation performance of a receiver in a Broadband Wireless Access (BWA) system. A receiving apparatus in a broadband wireless communication system includes an estimator, a first calculator, and a second calculator. The estimator estimates a desired signal. The first calculator calculates a correlation matrix of a signal obtained by eliminating the estimated desired signal from a Received (RX) signal. The second calculator performs an interference elimination using the correlation matrix.
摘要翻译：提供了一种用于增强宽带无线接入（BWA）系统中的接收机的解调性能的装置和方法。宽带无线通信系统中的接收装置包括估计器，第一计算器和第二计算器。估计器估计一个期望的信号。第一计算器计算通过从接收（RX）信号中消除估计的期望信号而获得的信号的相关矩阵。第二计算器使用相关矩阵来执行干扰消除。

7. 发明申请

US20070291882A1 APPARATUS AND METHOD FOR DETECTING SIGNAL IN MULTI-INPUT MULTI-OUTPUT SYSTEM 审中-公开
标题翻译：用于在多输入多输出系统中检测信号的装置和方法
公开(公告)号：US20070291882A1
公开(公告)日：2007-12-20
申请号：US11762265
申请日：2007-06-13
申请人： Sung-Woo Park , Joo-Hyun Lee , Kyung-Joo Suh , Young-Hoon Kwon , Sung-Soo Hwang , Jong-In Kim , Joon-Hyuk Kang , Jong-Sub Cha
发明人： Sung-Woo Park , Joo-Hyun Lee , Kyung-Joo Suh , Young-Hoon Kwon , Sung-Soo Hwang , Jong-In Kim , Joon-Hyuk Kang , Jong-Sub Cha
IPC分类号： H04L1/02 , H03D1/00
CPC分类号： H04L25/03006 , H04L2025/03426 , H04L2025/03605
摘要： A signal detection apparatus and method using a modified stack algorithm in a Multi-Input Multi-Output (MIMO) system are provided. The signal detection method includes sorting signals received via antennas and channel coefficients for respective users in descending order, decomposing a channel matrix composed of the sorted channel coefficients into a unitary matrix and an upper-triangular matrix, determining the number of candidate symbol-sequences using the decomposed upper-triangular matrix, obtaining a signal vector for the antennas by using the sorted signals received via respective antennas and the unitary matrix, wherein the signal vector is proportional to the upper-triangular matrix, and detecting the determined number of candidate symbol-sequences by using a modified stack algorithm while expanding a stack structure for the obtained signal vector.
摘要翻译：提供了一种在多输入多输出（MIMO）系统中使用修改堆栈算法的信号检测装置和方法。信号检测方法包括按照降序对各个用户的经由天线和信道系数接收的信号进行分类，将由排序的信道系数组成的信道矩阵分解成酉矩阵和上三角矩阵，使用分解的上三角矩阵，通过使用经由各个天线接收的分类信号和单位矩阵获得天线的信号矢量，其中信号向量与上三角矩阵成比例，并且检测确定的候选符号 - 通过使用修改的堆栈算法同时扩展获得的信号向量的堆叠结构来扩展序列。

8. 发明申请

US20070150797A1 Partial iterative detection and decoding apparatus and method in MIMO system 有权
标题翻译： MIMO系统中的部分迭代检测和解码设备和方法
公开(公告)号：US20070150797A1
公开(公告)日：2007-06-28
申请号：US11638785
申请日：2006-12-14
申请人： Keun-Chul Hwang , Sung-Woo Park , Soon-Young Yoon , Young-Hoon Kwon , June Moon
发明人： Keun-Chul Hwang , Sung-Woo Park , Soon-Young Yoon , Young-Hoon Kwon , June Moon
IPC分类号： H03M13/00
CPC分类号： H04L1/005 , H04B7/0417 , H04B7/0848 , H04L1/0052 , H04L1/06
摘要： A partial iterative detection and decoding apparatus in a Multiple Input Multiple Output (MIMO) system includes a detector for detecting signals received through at least one receive antenna to generate a first soft decision value, a decoder for decoding the first soft decision value to generate a second soft decision value, and a reliability determiner for determining a signal to be iteratively detected and decoded by using the second soft decision value. Accordingly, the complexity of the receiver is reduced and the number of iterations limited due to the complexity is increased, thereby improving the performance of the receiver.
摘要翻译：多输入多输出（MIMO）系统中的部分迭代检测和解码装置包括用于检测通过至少一个接收天线接收的信号以产生第一软判决值的检测器，用于解码第一软判决值以产生第二软判决值，以及用于通过使用第二软判决值来确定要迭代检测和解码的信号的可靠性确定器。因此，接收机的复杂度降低，并且由于复杂性而限制的迭代次数增加，从而提高了接收机的性能。

9. 发明申请

US20060270156A1 Non-volatile memory devices and methods of forming the same 失效
标题翻译：非易失性存储器件及其形成方法
公开(公告)号：US20060270156A1
公开(公告)日：2006-11-30
申请号：US11246454
申请日：2005-10-07
申请人： Seong-Gyun Kim , Ji-Hoon Park , Sang-Woo Kang , Sung-Woo Park
发明人： Seong-Gyun Kim , Ji-Hoon Park , Sang-Woo Kang , Sung-Woo Park
IPC分类号： H01L21/336 , H01L29/788
CPC分类号： H01L21/28273 , H01L27/11524 , H01L29/42324 , H01L29/66825 , H01L29/7881
摘要： A non-volatile memory device includes an upwardly protruding fin disposed on a substrate and a control gate electrode crossing the fin. A floating gate is interposed between the control gate electrode and the fin and includes a first storage gate and a second storage gate. The first storage gate is disposed on a sidewall of the fin, and the second storage gate is disposed on a top surface of the fin and is connected to the first storage gate. A first insulation layer is interposed between the first storage gate and the sidewall of the fin, and a second insulation layer is interposed between the second storage gate and the top surface of the fin. The second insulation layer is thinner than the first insulation layer. A blocking insulation pattern is interposed between the control gate electrode and the floating gate.
摘要翻译：非易失性存储器件包括设置在衬底上的向上突出的翅片和跨过鳍片的控制栅电极。浮栅位于控制栅极和鳍之间，并包括第一存储栅和第二存储栅。第一存储门设置在翅片的侧壁上，第二存储栅极设置在鳍的顶表面上，并连接到第一存储门。第一绝缘层插入在第一存储栅极和鳍片的侧壁之间，第二绝缘层插入在第二存储栅极和鳍的顶表面之间。第二绝缘层比第一绝缘层薄。在控制栅电极和浮栅之间插入阻挡绝缘图案。

10. 发明申请

US20050106897A1 Method of manufacturing a thin dielectric layer using a heat treatment and a semiconductor device formed using the method 有权
标题翻译：使用热处理制造薄介电层的方法和使用该方法形成的半导体器件
公开(公告)号：US20050106897A1
公开(公告)日：2005-05-19
申请号：US10832952
申请日：2004-04-27
申请人： Sung-Taeg Kang , Jeong-Uk Han , Sung-Woo Park , Seung-Beom Yoon , Ji-Hoon Park , Bo-Young Seo
发明人： Sung-Taeg Kang , Jeong-Uk Han , Sung-Woo Park , Seung-Beom Yoon , Ji-Hoon Park , Bo-Young Seo
IPC分类号： H01L27/115 , H01L21/28 , H01L21/314 , H01L21/8234 , H01L21/44 , H01L21/31 , H01L21/469
CPC分类号： H01L21/0214 , H01L21/02249 , H01L21/02252 , H01L21/28273 , H01L21/3144
摘要： In a method for forming a semiconductor device and a semiconductor device formed in accordance with the method, a thin dielectric layer is provided between a lower conductive layer and an upper conductive layer. In one embodiment, the thin dielectric layer comprises an inter-gate dielectric layer, the lower conductive layer comprises a floating gate and the upper dielectric layer comprises a control gate of a transistor, for example, a non-volatile memory cell transistor. The thin dielectric layer is formed using a heat treating process that results in reduction of surface roughness of the underlying floating gate, and results in a thin silicon oxy-nitride layer being formed on the floating gate. In this manner, the thin dielectric layer provides for increased capacitive coupling between the lower floating gate and the upper control gate. This also leads to a lowered programming voltage, erasing voltage and read voltage for the transistor, while maintaining the threshold voltage in a desired range. In addition, the size of the transistor and resulting storage cell can be minimized and the need for a high-voltage region in the circuit is mitigated, since, assuming a lowered programming voltage, pumping circuitry is not required.
摘要翻译：在根据该方法形成的半导体器件和半导体器件的形成方法中，在下导电层和上导电层之间设置有薄的电介质层。在一个实施例中，薄介电层包括栅极间电介质层，下导电层包括浮动栅极，上介电层包括晶体管的控制栅极，例如非易失性存储单元晶体管。使用导致下面的浮置栅极的表面粗糙度降低的热处理工艺形成薄介电层，并且导致在浮动栅极上形成薄的氧氮化硅层。以这种方式，薄介电层提供在下浮动栅极和上控制栅极之间增加的电容耦合。这也导致降低的编程电压，擦除晶体管的电压和读取电压，同时将阈值电压保持在期望的范围内。此外，晶体管和所得到的存储单元的尺寸可以被最小化，并且减轻了对电路中的高电压区域的需要，因为假设降低的编程电压，不需要泵浦电路。

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