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1. 发明授权

US06005669A Non contact measuring method for three dimensional micro pattern in measuring object 失效
标题翻译：测量对象中三维微图案的非接触式测量方法
公开(公告)号：US06005669A
公开(公告)日：1999-12-21
申请号：US65493
申请日：1998-04-24
申请人： Heui Jae Pahk , Sung Wook Cho , Woo Jung Ahn
发明人： Heui Jae Pahk , Sung Wook Cho , Woo Jung Ahn
IPC分类号： G01B11/30 , G01B11/02 , G01B11/06 , G01B11/24 , G01B11/00
CPC分类号： G01B11/0608 , G01B11/02
摘要： A non-contacting measuring method for three dimensional micro pattern in a measuring object is disclosed. Three dimensional micro pattern of the surface of the measuring object is measured using blur of light. For measurement, a mechanism of an optical window with a slit is inserted between light source and the measuring object. The blurred image is captured by charge coupled device sensor based image frame grabber, and is analyzed in personal computers. All the values of the relative height differences are obtained in overall scanning measurement area of the measuring object. The relative height differences are the distances from the reference position to the other positions. The reference position is selected when its image is sharp in focus on the screen. At this time, images of the other positions except the reference position are blurred out of focus on the screen. Also, from the law of geometric optics and the geometric similarity of triangles, the relation equation between the height difference and the ratio of blurred image size to sharp image size can be constructed. When the size of the image of the reference position and the sizes of the images with the blurred image of the other positions are measured, all the height differences between the reference position and the other position can be calculated if the coefficients of the relation equation are evaluated.
摘要翻译：公开了一种用于测量对象中的三维微图案的非接触测量方法。使用模糊的光来测量测量对象的表面的三维微图案。为了测量，在光源和测量对象之间插入具有狭缝的光学窗口的机构。模糊图像通过基于电荷耦合器件传感器的图像帧获取器捕获，并在个人计算机中进行分析。在测量对象的整个扫描测量区域中获得相对高差的所有值。相对高度差是从参考位置到其他位置的距离。当其图像在屏幕上焦点清晰时，选择参考点。此时，除了参考位置之外的其他位置的图像在屏幕上失焦。另外，从几何光学定律和三角形的几何相似度可以看出，高差与模糊图像尺寸与图像大小之间的关系方程可以被构建。当测量参考位置的图像的大小和具有其他位置的模糊图像的图像的尺寸时，如果关系式的系数为评估。

2. 发明申请

US20110188048A1 Method for Measuring Thickness or Surface Profile 有权
标题翻译：测量厚度或表面轮廓的方法
公开(公告)号：US20110188048A1
公开(公告)日：2011-08-04
申请号：US12993301
申请日：2009-01-16
申请人： Heui Jae Pahk , Woo Jung Ahn , Seong Ryong Kim , Jun Hyeok Lee
发明人： Heui Jae Pahk , Woo Jung Ahn , Seong Ryong Kim , Jun Hyeok Lee
IPC分类号： G01B11/06
CPC分类号： G01B11/0675
摘要： Disclosed is a method of measuring thickness or a surface profile of a thin film layer formed on a base layer through a white light scanning interferometry, the method including: preparing simulation interference signals corresponding to thicknesses by assuming a plurality of sample thin film layers different in thickness from one another and simulating interference signals with respect to the respective sample thin film layers; acquiring a real interference signal with respect to an optical-axis direction of entering the thin film layer by illuminating the thin film layer with white light; preparing a plurality of estimated thicknesses that the thin film layer may have on the basis of the real interference signal; comparing whether the simulation interference signal having thickness corresponding to the estimated thickness is substantially matched with the real interference signal; and determining the thickness of the simulation interference signal substantially matched with the real interference signal as the thickness of the thin film layer.
摘要翻译：公开了一种通过白光扫描干涉测量法测量在基底层上形成的薄膜层的厚度或表面轮廓的方法，该方法包括：通过假设多个不同的样品薄膜层来制备与厚度对应的模拟干涉信号相对于各个样品薄膜层模拟干涉信号; 通过用白光照射薄膜层来获取相对于进入薄膜层的光轴方向的实际干涉信号; 基于实际干扰信号准备薄膜层可能具有的多个估计厚度; 比较具有与估计厚度相对应的厚度的模拟干扰信号是否与实际干扰信号基本匹配; 并且确定与实干扰信号基本匹配的模拟干扰信号的厚度作为薄膜层的厚度。

3. 发明授权

US08947673B2 Estimating thickness based on number of peaks between two peaks in scanning white light interferometry 有权
标题翻译：基于扫描白光干涉测量中两个峰值之间的峰值估计厚度
公开(公告)号：US08947673B2
公开(公告)日：2015-02-03
申请号：US12993301
申请日：2009-01-16
申请人： Heui Jae Pahk , Woo Jung Ahn , Seong Ryong Kim , Jun Hyeok Lee
发明人： Heui Jae Pahk , Woo Jung Ahn , Seong Ryong Kim , Jun Hyeok Lee
IPC分类号： G01B11/02 , G01B11/06
CPC分类号： G01B11/0675
摘要： Disclosed is a method of measuring thickness or a surface profile of a thin film layer formed on a base layer through a white light scanning interferometry, the method including: preparing simulation interference signals corresponding to thicknesses by assuming a plurality of sample thin film layers different in thickness from one another and simulating interference signals with respect to the respective sample thin film layers; acquiring a real interference signal with respect to an optical-axis direction of entering the thin film layer by illuminating the thin film layer with white light; preparing a plurality of estimated thicknesses that the thin film layer may have on the basis of the real interference signal; comparing whether the simulation interference signal having thickness corresponding to the estimated thickness is substantially matched with the real interference signal; and determining the thickness of the simulation interference signal substantially matched with the real interference signal as the thickness of the thin film layer.
摘要翻译：公开了一种通过白光扫描干涉测量法测量在基底层上形成的薄膜层的厚度或表面轮廓的方法，该方法包括：通过假设多个不同的样品薄膜层来制备与厚度对应的模拟干涉信号相对于各个样品薄膜层模拟干涉信号; 通过用白光照射薄膜层来获取相对于进入薄膜层的光轴方向的实际干涉信号; 基于实际干扰信号准备薄膜层可能具有的多个估计厚度; 比较具有与估计厚度相对应的厚度的模拟干扰信号是否与实际干扰信号基本匹配; 并且确定与实干扰信号基本匹配的模拟干扰信号的厚度作为薄膜层的厚度。

4. 发明授权

US5841668A Method of assessing three dimensional volumetric errors in multiaxis machine tools 失效
标题翻译：评估多轴机床三维体积误差的方法
公开(公告)号：US5841668A
公开(公告)日：1998-11-24
申请号：US866050
申请日：1997-05-30
申请人： Heui Jae Pahk , Joon Hee Moon , Chong Nam Chu
发明人： Heui Jae Pahk , Joon Hee Moon , Chong Nam Chu
IPC分类号： G06T17/00 , G05B19/404 , B23Q15/18
CPC分类号： G05B19/404 , G05B2219/34025 , G05B2219/37619 , G05B2219/41077
摘要： A method of assessing three-dimensional volumetric errors of multiaxis machine tools in three-dimensional working space is disclosed. Each three-dimensional volumetric error component can be systematically measured and analyzed on the modeling of polynominal functions in accordance with the volumetric errors and the kinematic chain in accordence with the corresponding machine tool. The method inputs the measured radial data performed on the three orthogonal planes, analyzing the parametric errors such as positional, straightness, angular, squareness, and backlash errors. The positional error components along each of three orthogonal axes are modeled as a dimensionless polynominal function with corresponding positional error coefficients. The method also can assess dynamic performance of the machine tools such errors due to the servo gain mismatch. The method employs the kinematic ball bar to assess the volumetric errors.
摘要翻译：公开了一种在三维工作空间中评估多轴机床三维体积误差的方法。可以根据体积误差和运动链根据相应的机床对多项式函数的建模进行系统测量和分析每个三维体积误差分量。该方法输入在三个正交平面上执行的测量的径向数据，分析参数误差，如位置，直线度，角度，平方度和齿隙误差。沿着三个正交轴中的每一个的位置误差分量被建模为具有相应位置误差系数的无量纲多项式函数。该方法还可以评估机床的动态性能，由于伺服增益不匹配导致的这种误差。该方法使用运动球棒来评估体积误差。

5. 发明授权

US06167634A Measurement and compensation system for thermal errors in machine tools 有权
标题翻译：机床热误差测量补偿系统
公开(公告)号：US06167634A
公开(公告)日：2001-01-02
申请号：US09280049
申请日：1999-03-29
申请人： Heui Jae Pahk , Suk Won Lee
发明人： Heui Jae Pahk , Suk Won Lee
IPC分类号： G01B712
CPC分类号： B23Q11/0007 , B23Q17/2495 , G01B5/0014 , G05B19/404 , G05B2219/37267 , G05B2219/49206
摘要： A measurement and compensation system for thermal errors in a machine tool is disclosed. A module is provided to compensate thermal errors of the machine tool. The module comprises an operating part, a data bank, an analog to digital converter, a counter and a digital input/output part. The data bank stores in all the coefficients applied to a thermal error modeling equation which governs a relation between temperatures and thermal errors at various operating conditions. The operating part determines all the coefficients of the thermal error modeling equation which are stored in the data bank and calculates the thermal errors corresponding to the temperatures of a plurality of the thermocouples by the temperatures of a plurality of thermocouples inputted from the A/D converter and the positional coordinates of the bed inputted from the counter. Then, digital data of the calculated thermal errors are inputted into the digital input/output part and the digital input/output part converts the digital data to digital signal to input the digital signals into the controller. A controller orders the machine tool to compensate the thermal errors at the positional coordinates of the bed and the feed of the spindle. Accordingly, since the machine tool compensates the thermal errors in advance, the machine tool processes precisely workpieces in spite of the occurrence of the thermal errors.
摘要翻译：公开了一种用于机床热误差的测量和补偿系统。提供了一个模块来补偿机床的热误差。模块包括操作部分，数据库，模数转换器，计数器和数字输入/输出部分。数据库存储应用于热误差建模方程的所有系数，其控制各种操作条件下的温度和热误差之间的关系。操作部分确定存储在数据库中的热误差建模方程的所有系数，并且通过从A / D转换器输入的多个热电偶的温度来计算与多个热电偶的温度相对应的热误差以及从计数器输入的床的位置坐标。然后，计算的热误差的数字数据被输入到数字输入/输出部分，数字输入/输出部分将数字数据转换为数字信号，以将数字信号输入到控制器中。控制器命令机床来补偿床的位置坐标和主轴进给的热误差。因此，由于机床预先补偿热误差，所以机床精密地处理工件，尽管发生了热误差。

6. 发明授权

US08873067B2 Interferometer for TSV measurement and measurement method using same 有权
标题翻译：用于TSV测量和测量方法的干涉仪使用它
公开(公告)号：US08873067B2
公开(公告)日：2014-10-28
申请号：US14111197
申请日：2012-04-13
申请人： Ki Hun Lee , Heung Hyun Shin , Heui Jae Pahk
发明人： Ki Hun Lee , Heung Hyun Shin , Heui Jae Pahk
IPC分类号： G01B9/02 , G01J3/45 , G01B9/021 , G01B11/02 , H01L21/66 , G01B11/24
CPC分类号： G01B11/24 , G01B2210/56 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Provided herein is a TSV measuring interferometer that uses a variable field stop that adjusts such that a light is focused at an inlet and at a bottom surface of a TSV when measuring a diameter and depth of the TSV, thereby reducing a measurement time and result data, the interferometer also using a telecentric lens that adjusts the light injected into the TSV to be a straight line, so as to obtain a sufficient amount of light reaching the bottom surface to improve the accuracy of measurement even in a TSV having a large aspect ratio.
摘要翻译：本文提供了一种TSV测量干涉仪，其在测量TSV的直径和深度时使用可变场停止器来调节TSV的入口和底表面处的聚焦，从而减少了测量时间和结果数据，干涉仪还使用将注入TSV的光调整为直线的远心透镜，以便即使在具有大的纵横比的TSV中也能获得足够的光到达底面以提高测量的精度。

7. 发明申请

US20140036273A1 Interferometer for TSV Measurement and Measurement Method Using Same 有权
标题翻译：用于TSV测量和测量方法的干涉仪使用相同
公开(公告)号：US20140036273A1
公开(公告)日：2014-02-06
申请号：US14111197
申请日：2012-04-13
申请人： Ki Hun Lee , Heung Hyun Shin , Heui Jae Pahk
发明人： Ki Hun Lee , Heung Hyun Shin , Heui Jae Pahk
IPC分类号： G01B11/24
CPC分类号： G01B11/24 , G01B2210/56 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Provided herein is a TSV measuring interferometer that uses a variable field stop that adjusts such that a light is focused at an inlet and at a bottom surface of a TSV when measuring a diameter and depth of the TSV, thereby reducing a measurement time and result data, the interferometer also using a telecentric lens that adjusts the light injected into the TSV to be a straight line, so as to obtain a sufficient amount of light reaching the bottom surface to improve the accuracy of measurement even in a TSV having a large aspect ratio.
摘要翻译：本文提供了一种TSV测量干涉仪，其在测量TSV的直径和深度时使用可变场停止器来调节TSV的入口和底表面处的聚焦，从而减少了测量时间和结果数据，干涉仪还使用将注入TSV的光调整为直线的远心透镜，以便即使在具有大的纵横比的TSV中也能获得足够的光到达底面以提高测量的精度。

8. 发明申请

US20100006549A1 DEVICE FOR PROCESSING MATERIALS BY LASER BEAM 审中-公开
标题翻译：激光加工材料的装置
公开(公告)号：US20100006549A1
公开(公告)日：2010-01-14
申请号：US12448642
申请日：2007-06-15
申请人： Heui Jae Pahk , Tai Wook Kim , Heung Hyun Shin
发明人： Heui Jae Pahk , Tai Wook Kim , Heung Hyun Shin
IPC分类号： B23K26/00
CPC分类号： B23K26/067
摘要： Disclosed is a laser processing device for processing a surface of an object with laser beams. The laser processing device includes: a laser beam generating unit for projecting laser beams; and a micromirror device having a plurality of micromirrors, the micromirrors being configured to reflect and transfer at least a part of laser beams projected from the laser beam generating unit to the surface of the object in a pattern for processing the surface of the object in a desired shape. The micromirrors of the micromirror device are capable of selectively switching the light path of the laser beams projected from the laser beam generating unit. According to the present invention, a surface of an object can be either two-dimensionally or three-dimensionally processed in a desired shape with laser beams.
摘要翻译：公开了一种用激光束处理物体表面的激光加工装置。激光加工装置包括：激光束产生单元，用于投射激光束; 以及具有多个微镜的微反射镜装置，所述微镜被配置为以一种图案反射并将从所述激光束产生单元投影的至少一部分激光束传送到所述物体的表面，以在所述图案中处理所述物体的表面所需形状。微镜器件的微镜能够选择性地切换从激光束产生单元投影的激光束的光路。根据本发明，物体的表面可以用激光束二维或三维地加工成所需的形状。

9. 发明授权

US06269544B1 Apparatus for measuring three-dimensional volumetric errors in multiaxis machine tool 有权
标题翻译：用于测量多轴机床三维体积误差的装置
公开(公告)号：US06269544B1
公开(公告)日：2001-08-07
申请号：US09479903
申请日：2000-01-10
申请人： Heui Jae Pahk , Young Sam Kim
发明人： Heui Jae Pahk , Young Sam Kim
IPC分类号： G01C2500
CPC分类号： G01B21/04
摘要： An apparatus for measuring three-dimensional volumetric errors in a multiaxis machine tool is disclosed. The apparatus comprises a kinematic ball bar provided with two balls at both ends thereof as a basic construction. A U-shaped bar with two extension arms is integrated with the ball bar. A vertical post is positioned relative to the U-shaped bar and is integrated with one of the two balls. A sleeve is fitted over the post and two guide bars is fixedly and longitudinally assembled with an external surface of the sleeve at opposite positions. Each of the guide bars is provided with a slot at a lower portion thereof for movably receiving an operating pin.
摘要翻译：公开了一种用于测量多轴机床中的三维体积误差的装置。该装置包括在其两端设置有两个球作为基本结构的运动球杆。具有两个延伸臂的U形杆与球棒一体化。垂直柱相对于U形杆定位并且与两个球中的一个一体化。一个套筒安装在柱上，两个导杆与相对位置的套筒的外表面固定地和纵向组装。每个导杆在其下部设置有用于可移动地接收操作销的槽。

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