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1. 发明授权

US5040047A Enhanced fluorescence polymers and interconnect structures using them 失效
标题翻译：增强荧光聚合物和使用它们的互连结构
公开(公告)号：US5040047A
公开(公告)日：1991-08-13
申请号：US457127
申请日：1989-12-26
申请人： Herbert S. Cole , Renato Guida , Yung S. Liu , Theodore R. Haller
发明人： Herbert S. Cole , Renato Guida , Yung S. Liu , Theodore R. Haller
IPC分类号： C08K9/04 , C08K5/00 , C08K5/1535 , C08L101/00 , C09K11/06 , H01B3/18 , H01L21/312 , H01L23/538
CPC分类号： C08K5/0041 , C09K11/06 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24137 , H01L2224/24225 , H01L2224/24227 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01074 , H01L2924/12042 , H01L2924/14
摘要： The fluorescent characteristics of a polymer material are modified by the addition of a fluorescent dye which is fluorescent in response to light in a particular portion of the spectrum to render it fluorescent in response to light in that particular portion of the spectrum.

2. 发明授权

US4988412A Selective electrolytic desposition on conductive and non-conductive substrates 失效
标题翻译：导电和非导电基底上的选择性电解沉积
公开(公告)号：US4988412A
公开(公告)日：1991-01-29
申请号：US289944
申请日：1988-12-27
申请人： Yung S. Liu , Herbert S. Cole , Renato Guida , James W. Rose
发明人： Yung S. Liu , Herbert S. Cole , Renato Guida , James W. Rose
IPC分类号： C25D5/02 , H01L21/288 , H01L23/538 , H05K3/24
CPC分类号： H01L23/5389 , C25D5/022 , H01L21/2885 , H05K3/243 , H01L2924/0002 , H01L2924/09701 , H05K2201/2081 , H05K3/241
摘要： Selective electrolytic deposition is provided on a body having a conductive surface comprised of two different conductive materials in which one of the conductive materials forms a surface layer upon exposure to a particular ambient environment and wherein that surface layer prevents electroplating on that material in the particular electroplating environment utilized for the electroplating of the desired pattern on the other conductive material.
摘要翻译：选择性电解沉积被提供在具有由两种不同导电材料组成的导电表面的主体上，其中一种导电材料在暴露于特定环境环境时形成表面层，并且其中该表面层防止在特定电镀中的该材料上的电镀用于在另一导电材料上电镀所需图案的环境。

3. 发明授权

US4960613A Laser interconnect process 失效
标题翻译：激光互连工艺
公开(公告)号：US4960613A
公开(公告)日：1990-10-02
申请号：US253020
申请日：1988-10-04
申请人： Herbert S. Cole , Yung S. Liu
发明人： Herbert S. Cole , Yung S. Liu
IPC分类号： H01L21/3205 , H01L21/48 , H01L21/60 , H01L23/538 , H05K3/10 , H05K3/18 , H05K3/46
CPC分类号： H01L21/76897 , H01L21/32051 , H01L21/4846 , H01L23/5389 , H05K3/185 , H01L2924/0002 , H05K3/108 , H05K3/4644
摘要： The uniformity of a catalyst layer produced by laser decomposition of a catalyst source compound is substantially improved for patterned substrates whose characteristics vary along the path of a conductor line by providing a buffer layer of a metal such as Ti, Cr or Ni over the substrate prior to the laser induced decomposition of the catalyst source compound.
摘要翻译：通过催化剂源化合物的激光分解产生的催化剂层的均匀性对于其特性沿着导体线的路径变化的图案化衬底而言基本上得到改善，通过在衬底上提供诸如Ti，Cr或Ni的金属的缓冲层，对激光诱导的催化剂源化合物的分解。

4. 发明授权

US5554305A Processing low dielectric constant materials for high speed electronics 失效
公开(公告)号：US5554305A
公开(公告)日：1996-09-10
申请号：US411178
申请日：1995-03-27
申请人： Robert J. Wojnarowski , Herbert S. Cole , Theresa A. Sitnik-Nieters , Wolfgang Daum
发明人： Robert J. Wojnarowski , Herbert S. Cole , Theresa A. Sitnik-Nieters , Wolfgang Daum
IPC分类号： B32B7/02 , B32B18/00 , H01L21/48 , H01L21/60 , H01L23/498 , H01L23/538 , H05K1/02 , H05K1/03 , H05K3/00 , H05K3/38 , H01L21/3105
CPC分类号： H05K1/0313 , H01L21/481 , H01L23/49894 , H01L23/5389 , H01L24/24 , H01L24/82 , H05K1/024 , H05K1/0373 , H05K3/0032 , H01L2224/2402 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01052 , H01L2924/01074 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/3011 , H05K2201/0116 , H05K2201/015 , H05K2201/0158 , H05K2203/083 , H05K2203/122 , H05K3/386 , Y10S521/918 , Y10T29/49124 , Y10T29/49155
摘要： A method for processing a low dielectric constant material includes dispersing an additive material in a porous low dielectric constant layer, fabricating a desired electronic structure, and then removing the additive material from the pores of the low dielectric constant layer. The removal of the additive material from the pores can be accomplished by sublimation, evaporation, and diffusion. Applications for the low dielectric constant layer include the use as an overlay layer for interconnecting a circuit chip supported by a substrate and the use as printed circuit board material.

5. 发明授权

US5449427A Processing low dielectric constant materials for high speed electronics 失效
标题翻译：加工用于高速电子的低介电常数材料
公开(公告)号：US5449427A
公开(公告)日：1995-09-12
申请号：US247820
申请日：1994-05-23
申请人： Robert J. Wojnarowski , Herbert S. Cole , Theresa A. Sitnik-Nieters , Wolfgang Daum
发明人： Robert J. Wojnarowski , Herbert S. Cole , Theresa A. Sitnik-Nieters , Wolfgang Daum
IPC分类号： B32B7/02 , B32B18/00 , H01L21/48 , H01L21/60 , H01L23/498 , H01L23/538 , H05K1/02 , H05K1/03 , H05K3/00 , H05K3/38 , B32B31/12 , B32B31/14
CPC分类号： H05K1/0313 , H01L21/481 , H01L23/49894 , H01L23/5389 , H01L24/24 , H01L24/82 , H05K1/024 , H05K1/0373 , H05K3/0032 , H01L2224/2402 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01052 , H01L2924/01074 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/3011 , H05K2201/0116 , H05K2201/015 , H05K2201/0158 , H05K2203/083 , H05K2203/122 , H05K3/386 , Y10S521/918 , Y10T29/49124 , Y10T29/49155
摘要： A method for processing a low dielectric constant material includes dispersing an additive material in a porous low dielectric constant layer, fabricating a desired electronic structure, and then removing the additive material from the pores of the low dielectric constant layer. The removal of the additive material from the pores can be accomplished by sublimation, evaporation, and diffusion. Applications for the low dielectric constant layer include the use as an overlay layer for interconnecting a circuit chip supported by a substrate and the use as printed circuit board material.
摘要翻译：用于处理低介电常数材料的方法包括将添加剂材料分散在多孔低介电常数层中，制造所需的电子结构，然后从低介电常数层的孔中除去添加剂材料。从孔中去除添加剂材料可以通过升华，蒸发和扩散来实现。用于低介电常数层的应用包括用作互连由衬底支撑的电路芯片和用作印刷电路板材料的覆盖层的用途。

6. 发明授权

US5169678A Laser ablatable polymer dielectrics and methods 失效
标题翻译：激光可聚合聚合物电介质和方法
公开(公告)号：US5169678A
公开(公告)日：1992-12-08
申请号：US456421
申请日：1989-12-26
申请人： Herbert S. Cole , Robert J. Wojnarowski
发明人： Herbert S. Cole , Robert J. Wojnarowski
IPC分类号： C08K5/00 , B23K26/00 , B23K26/18 , B23K26/40 , C08J7/00 , C08J7/04 , C08K5/22 , C08L101/00 , C09D201/00 , G03F7/039 , G03F7/20 , H01L21/027 , H01L21/30 , H01L21/311 , H01L23/12 , H01L23/538 , H01L25/04 , H01L25/18
CPC分类号： G03F7/039 , G03F7/2053 , H01L21/31127 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/01074 , H01L2924/12042 , H01L2924/14 , Y10S430/146
摘要： The ultraviolet absorption characteristics of a polymer material are modified by the addition of an ultraviolet absorbing dye to render it laser ablatable at a frequency at which the unmodified material is substantially non-laser ablatable.

7. 发明授权

US4308164A Novel yellow azo dyes and dichroic liquid crystal composition made therewith 失效
标题翻译：新的黄色偶氮染料和二色液晶组合物
公开(公告)号：US4308164A
公开(公告)日：1981-12-29
申请号：US175002
申请日：1980-08-04
申请人： Siegfried Aftergut , Herbert S. Cole
发明人： Siegfried Aftergut , Herbert S. Cole
IPC分类号： C09B35/04 , C09B43/20 , C09K19/60 , C09K3/34 , G02F1/13
CPC分类号： C09B35/04 , C09B43/20 , C09K19/601 , Y10S534/01
摘要： Novel yellow azo dye compositions and a liquid crystal composition containing the yellow azo dye composition are disclosed. The yellow azo dye composition, having terminal ester groups has the general formula: ##STR1## wherein R and R' are acyl groups having the formula: ##STR2## and R.sub.2 is an alkyl or substituted alkyl wherein the alkyl has at least 4 carbon atoms, or R.sub.2 is an aryl, arylalkyl, substituted aryl or substituted arylalkyl. When the yellow azo dichroic dyes are used as a guest in a host liquid crystal material, they form a novel liquid crystal composition for use in liquid crystal displays. The disclosure also embraces a method of improving the black color of dichroic dyes for use in black liquid crystal displays, wherein a dye composition having a mixture of dichroic dyes of various colors and containing at least one yellow azo dichroic dye as described above is added to a host liquid crystal material. The mixture of dichroic dyes of various colors must be one which absorbs radiation in the spectral range of about 400-700 nm to produce the substantially black color for use in black liquid crystal displays.
摘要翻译：公开了新的黄色偶氮染料组合物和含有黄色偶氮染料组合物的液晶组合物。具有末端酯基的黄色偶氮染料组合物具有以下通式：其中R和R'是具有下式的酰基：其中R 2是烷基或取代的烷基，其中烷基具有至少4个碳原子，或R 2为芳基，芳基烷基，取代的芳基或取代的芳基烷基。当黄色偶氮二色性染料用作主体液晶材料中的客体时，它们形成用于液晶显示器的新型液晶组合物。本公开还包括改进用于黑色液晶显示器中的二色性染料的黑色的方法，其中将具有各种颜色的二色性染料和至少一种如上所述的黄色偶氮二色性染料的混合物的染料组合物加入到主体液晶材料。各种颜色的二色性染料的混合物必须是在约400-700nm的光谱范围内吸收辐射的混合物，以产生用于黑色液晶显示器的基本黑色。

8. 发明申请

US20080201937A1 Methods for Making Data Storage Media and the Resultant Media 审中-公开
标题翻译：制作数据存储介质和结果介质的方法
公开(公告)号：US20080201937A1
公开(公告)日：2008-08-28
申请号：US11873782
申请日：2007-10-17
申请人： Thomas P. Feist , Wit C. Bushko , Herbert S. Cole , John E. Davis , Thomas B. Gorczyca , Joseph T. Woods
发明人： Thomas P. Feist , Wit C. Bushko , Herbert S. Cole , John E. Davis , Thomas B. Gorczyca , Joseph T. Woods
IPC分类号： H01F7/06
CPC分类号： B82Y30/00 , B29C43/021 , B29C2043/025 , B29D17/005 , B29L2017/005 , B82Y10/00 , G11B5/72 , G11B5/73 , G11B5/7315 , G11B5/84 , G11B5/8404 , G11B5/855 , G11B7/24038 , G11B7/24047 , G11B7/24056 , G11B7/253 , G11B7/2531 , G11B7/2532 , G11B7/2533 , G11B7/2534 , G11B7/2536 , G11B7/2542 , G11B7/2548 , G11B7/2578 , G11B7/258 , G11B7/259 , G11B7/26 , G11B7/263 , G11B11/10582 , G11B11/10584 , G11B11/10586 , G11B2007/25708 , G11B2007/25713 , G11C13/02 , G11C13/025 , Y10T29/49002 , Y10T29/4902 , Y10T29/4903 , Y10T29/49043 , Y10T29/49069 , Y10T29/49158 , Y10T29/49172 , Y10T29/49176 , Y10T156/1002 , Y10T428/24355 , Y10T428/24479 , Y10T428/24967 , Y10T428/265 , Y10T428/266 , Y10T428/31 , Y10T428/3154
摘要： Methods for forming data storage media and the media formed thereby are disclosed herein. In one embodiment, the method for forming a data storage media, comprises: injection molding a substrate comprising surface features, wherein said surface features have greater than about 90% of a surface feature replication of an original master; and disposing a data layer over at least one surface of said substrate; wherein said data storage media has an axial displacement peak of less than about 500μ under shock or vibration excitation when excited by a 1 G sinusoidal loading.
摘要翻译：本文公开了形成数据存储介质和由此形成的介质的方法。在一个实施例中，用于形成数据存储介质的方法包括：注射成型包含表面特征的基底，其中所述表面特征具有大于原始主体的表面特征复制的大约90％以及在所述衬底的至少一个表面上设置数据层; 其中所述数据存储介质在由G G正弦负载激励时，在冲击或振动激励下具有小于约500mu的轴向位移峰。

9. 发明授权

US5401687A Process for high density interconnection of substrates and integrated circuit chips containing sensitive structures 失效
标题翻译：包含敏感结构的基板和集成电路芯片的高密度互连工艺
公开(公告)号：US5401687A
公开(公告)日：1995-03-28
申请号：US46299
申请日：1993-04-15
申请人： Herbert S. Cole , Theresa A. Sitnik-Nieters , Bernard Gorowitz
发明人： Herbert S. Cole , Theresa A. Sitnik-Nieters , Bernard Gorowitz
IPC分类号： H01L21/768 , H01L23/482 , H01L23/538 , H01L21/28 , H01L21/56 , H01L21/58 , H01L21/60
CPC分类号： H01L24/82 , H01L23/4821 , H01L23/5381 , H01L24/24 , H01L2224/24227 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787
摘要： In a method for preserving an air bridge structure on an integrated circuit chip used in an overlay process, a patternable protective layer is applied for providing mechanical strength to prevent deformation during subsequent processing. A polymeric film layer is applied over the chip and protective layer, and interconnections are fabricated through the polymeric film layer. The polymeric film layer is removed from the area over the air bridge structure. The patternable protective layer is then removed, leaving the resultant structure with an undamaged air bridge which is free of residue.
摘要翻译：在用于在覆盖工艺中使用的集成电路芯片上保留空气桥结构的方法中，施加可图案化的保护层以提供机械强度以防止后续处理期间的变形。将聚合物膜层施加在芯片和保护层上，并且通过聚合物膜层制造互连。从空气桥结构上的区域去除聚合物膜层。然后去除可图案化的保护层，使得所得结构具有没有残留物的未损坏的空气桥。

10. 发明授权

US5353498A Method for fabricating an integrated circuit module 失效
标题翻译：集成电路模块的制造方法
公开(公告)号：US5353498A
公开(公告)日：1994-10-11
申请号：US87434
申请日：1993-07-09
申请人： Raymond A. Fillion , Robert J. Wojnarowski , Michael Gdula , Herbert S. Cole , Eric J. Wildi , Wolfgang Daum
发明人： Raymond A. Fillion , Robert J. Wojnarowski , Michael Gdula , Herbert S. Cole , Eric J. Wildi , Wolfgang Daum
IPC分类号： H01L23/52 , H01L21/56 , H01L21/58 , H01L21/68 , H01L23/29 , H01L23/433 , H01L23/538 , H01L25/04 , H01L25/065 , H01L25/18 , H05K3/34
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/293 , H01L23/295 , H01L23/4334 , H01L23/538 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/82 , H01L24/83 , H01L24/96 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/04105 , H01L2224/2402 , H01L2224/24137 , H01L2224/24195 , H01L2224/2518 , H01L2224/2919 , H01L2224/82039 , H01L2224/83192 , H01L2224/8385 , H01L2225/06517 , H01L2225/0652 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2225/06589 , H01L2225/1035 , H01L2225/1058 , H01L2225/1064 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/49144
摘要： Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate molding material is added within the mold form, and the substrate molding material is then hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and the faces of the chips. A thermal plug may be affixed to the backside of a chip before substrate molding material is added. A connector frame may be placed on the adhesive layer before substrate molding material is added. A dielectric layer may be placed over the backsides of the chips before the substrate molding material is added to enhance repairability. A portion of the chips and substrate molding material may be removed after the substrate molding material is hardened.
摘要翻译：基板材料直接模制到半导体芯片和其他用于集成电路模块制造的电气部件。具有接触垫的芯片面朝下放置在由基底支撑的粘合剂层上。模具周围位于芯片周围。在模具形式中加入基材成型材料，然后将基材成型材料硬化。具有与预定接触焊盘对准的通孔并具有延伸通过通孔的电导体的通孔的电介质层位于硬化的基底成型材料和芯片的表面上。在添加基板模制材料之前，可以将热塞固定到芯片的背面。在添加基材模塑材料之前，连接器框架可以放置在粘合剂层上。在添加基底成型材料之前，可以将电介质层放置在芯片的背面上以增强可修复性。芯片和基材成型材料的一部分可以在基材模塑材料硬化之后被去除。

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