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1. 发明专利

JP2009027130A Electronic component package and method of manufacturing the same 有权
标题翻译：电子元件封装及其制造方法
公开(公告)号：JP2009027130A
公开(公告)日：2009-02-05
申请号：JP2008035762
申请日：2008-02-18
申请人： Headway Technologies Inc , Shinka Jitsugyo Kk , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , SHIMIZU TATSUJI
IPC分类号： H01L23/52 , H01L25/04 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L25/50 , H01L23/147 , H01L23/498 , H01L23/49805 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/97 , H01L25/0652 , H01L25/16 , H01L2224/24137 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2224/82 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To enable mass-production of an electronic component package which enables high integration at low cost and in a short time, and to enable to respond to specification change of the electronic component package flexibly and with rapidity. SOLUTION: An electronic component package 1 includes a base body 10, having an upper surface and a side surface, and a plurality of layers 20, 30 and 40, which are laminated on the upper surface of the base body 10 and each of which includes at least one electronic component chip 3. The base body 10 includes a plurality of exterior connecting terminals 11, and a holder 12 for holding the plurality of exterior connecting terminals 11. Each exterior connecting terminal 11 has an end surface arranged on the side surface of the base body 10. At least one of the plurality of electronic component chips 3, included in the plurality of layers 20, 30 and 40, is electrically connected with at least one exterior connecting terminal 11. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了能够批量生产能够以低成本和短时间进行高集成的电子部件封装，并且能够灵活地且快速地响应于电子部件封装的规格变化。解决方案：电子部件封装1包括具有上表面和侧表面的基体10和层叠在基体10的上表面上的多个层20,30和40，并且每个其包括至少一个电子部件芯片3.基体10包括多个外部连接端子11和用于保持多个外部连接端子11的保持器12.每个外部连接端子11具有布置在包括在多个层20,30和40中的多个电子部件芯片3中的至少一个与至少一个外部连接端子11电连接。版权：（ C）2009年，JPO＆INPIT

2. 发明专利

JP2008300817A Production process of electronic component package, production process of wafer for the electronic component package, and production process of basic structure for the electronic component package 有权
标题翻译：电子元件封装的生产流程，电子元器件封装的生产工艺流程以及电子元器件封装的基本结构的生产过程
公开(公告)号：JP2008300817A
公开(公告)日：2008-12-11
申请号：JP2007322711
申请日：2007-12-14
申请人： Headway Technologies Inc , Shinka Jitsugyo Kk , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , SHIMIZU TATSUJI
IPC分类号： H01L21/60 , H01L23/12 , H01L25/04 , H01L25/18
CPC分类号： H01L23/5389 , H01L23/13 , H01L23/147 , H01L23/498 , H01L23/49805 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2224/24137 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/15798 , H01L2924/181 , Y10T29/49128 , Y10T29/49135 , Y10T29/49146 , Y10T29/49149 , H01L2224/82 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To mass-produce electronic components at low cost, in a short time. SOLUTION: In a production process of the electronic component package, two or more sets of external connection terminals 11 corresponding to two or more electronic packages are formed, on a substrate 10 in a plating method so that a wafer 1 is formed. In the wafer 1, two or more base scheduled portions 2, which become each base of the electronic package through mutual separation are included. Then, at least one electronic part chip 3 is jointed to each base schedule portion 2 in the wafer 1. The electrode of the electronic part chip 3 is connected to the external connection terminal 11, and the electronic component chip 3 is sealed. Then, the wafer 1 is cut so that each base schedule portion 2 is separated from each other, to form two or more bases. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：在短时间内以低成本批量生产电子元件。解决方案：在电子部件封装的生产过程中，以电镀方法在基板10上形成对应于两个或更多个电子封装的两组或多组外部连接端子11，从而形成晶片1。在晶片1中，包括通过相互分离成为电子封装的每个基底的两个或更多个基本调度部分2。然后，将至少一个电子部件芯片3连接到晶片1中的每个基准程序部分2.电子部件芯片3的电极连接到外部连接端子11，并且电子部件芯片3被密封。然后，切割晶片1，使得每个基本计划部分2彼此分离，以形成两个或更多个基座。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2008034077A Magnetic head for vertical magnetic recording, and its manufacturing method 有权
标题翻译：用于垂直磁记录的磁头及其制造方法
公开(公告)号：JP2008034077A
公开(公告)日：2008-02-14
申请号：JP2007038797
申请日：2007-02-20
申请人： Headway Technologies Inc , Shinka Jitsugyo Kk , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , SHIMIZU TATSUJI , SHIMIZU TATSUYA
IPC分类号： G11B5/31
CPC分类号： G11B5/3146 , G11B5/11 , G11B5/1278 , G11B5/1871 , G11B5/3116 , G11B5/315
摘要： PROBLEM TO BE SOLVED: To determine a throat height correctly, to suppress the protrusion of an edge on a medium facing surface of a shield due to heat produced by a coil, and to suppress the occurrence of a wide area adjacent track erasure. SOLUTION: The shield 13 has a first layer 13A1, a second layer 13A2, a third layer 13B, a first connecting section 13C and a second connecting section 13D. The first layer 13A1 has a first surface that is arranged on the front side in a travelling direction of a recording medium with respect to an edge of a magnetic pole layer 12 on the medium facing surface, a second surface that faces the magnetic pole layer 12, and a third surface that is on the opposite side of the second surface. The second layer 13A2 is in contact with the third surface. The third layer 13B is arranged so that the magnetic pole layer 12 is sandwiched by the first layer 13A1 and the third layer 13B. The first connecting section 13C connects the first layer 13A1 and the third layer 13B without contact with the magnetic pole layer 12. The second connecting section 13D connects the magnetic pole layer 12 and the third layer 13B at the position farther from the medium facing surface than the first connecting section 13C. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了正确地确定喉部高度，为了抑制由于线圈产生的热量而导致的屏蔽物的面向介质的表面上的边缘的突出，并且抑制相邻轨道擦除的广泛区域的发生。解决方案：屏蔽13具有第一层13A1，第二层13A2，第三层13B，第一连接部13C和第二连接部13D。第一层13A1具有相对于介质对向表面上的磁极层12的边缘沿着记录介质的行进方向的前侧布置的第一表面，面对磁极层12的第二表面，以及位于第二表面的相反侧的第三表面。第二层13A2与第三表面接触。第三层13B被布置成使得磁极层12被第一层13A1和第三层13B夹在中间。第一连接部分13C连接第一层13A1和第三层13B，而不与磁极层12接触。第二连接部分13D将磁极层12和第三层13B连接在比介质面向表面更远的位置处，比第一连接部13C。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2007287313A Thin film magnetic head, its manufacturing method, and head gimbal assembly, and hard disk drive 审中-公开
标题翻译：薄膜磁头，其制造方法和头盖组件和硬盘驱动器
公开(公告)号：JP2007287313A
公开(公告)日：2007-11-01
申请号：JP2007102149
申请日：2007-04-09
申请人： Headway Technologies Inc , Shinka Jitsugyo Kk , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , HORINAKA TAKEHIRO , KAMIKAMA TAKEHIRO , SHIMIZU TATSUJI
IPC分类号： G11B5/31
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/3123 , G11B5/3163 , Y10T29/49032 , Y10T29/49043 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： PROBLEM TO BE SOLVED: To form a main magnetic pole layer with a uniform dimension without variation and to improve a yield. SOLUTION: The thin film magnetic head is manufactured in the following manner: first, a base insulating layer having a recessed part for magnetic pole formation recessed to a shape corresponding to the main magnetic pole layer is formed and the stop film for polishing by CMP is so formed as to embed the recessed part for magnetic pole formation and thereafter, a magnetic layer is formed on the stop film. Next, a groove part for separation roughly surrounding the recessed part for magnetic pole formation is formed on the outer side of the recessed part for magnetic pole formation, and thereby the cover insulating film capable of separating the magnetic layer and covering the entire surface on the upper side is formed on the separated magnetic layer. Also, the surface on which the stop film appears is polished by CMP and the portion left on the inner side of the recessed part for magnetic pole formation of the magnetic layer is used as the main magnetic pole layer. Furthermore, a record gap layer, a light shield layer and a thin film coil are formed respectively. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：形成均匀尺寸的主磁极层而不变化并提高产量。
解决方案：薄膜磁头的制造方法如下：首先，形成具有凹陷到与主磁极层相对应的形状的磁极形成用凹部的基底绝缘层，并且形成抛光用止挡膜通过CMP形成为嵌入用于磁极形成的凹部，此后在止挡膜上形成磁性层。接下来，在用于磁极形成用凹部的外侧形成用于大致围绕用于磁极形成用凹部的用于分离的槽部，由此能够分离磁性层并覆盖整个表面的覆盖绝缘膜上侧形成在分离的磁性层上。此外，通过CMP抛光停止膜出现的表面，并且将用于磁性层的磁极形成的凹部的内侧剩余的部分用作主磁极层。此外，分别形成记录间隙层，遮光层和薄膜线圈。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2009065111A Method of manufacturing electronic component package 有权
标题翻译：制造电子元件封装的方法
公开(公告)号：JP2009065111A
公开(公告)日：2009-03-26
申请号：JP2008058325
申请日：2008-03-07
申请人： Headway Technologies Inc , Shinka Jitsugyo Kk , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , SHIMIZU TATSUJI
IPC分类号： H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L23/5389 , H01L23/3121 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2224/24137 , H01L2224/24145 , H01L2224/24227 , H01L2224/73267 , H01L2224/92244 , H01L2225/1023 , H01L2225/1064 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , Y10T29/49002 , Y10T29/49117 , Y10T29/49121 , Y10T29/49126 , Y10T29/49169 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To mass produce laminated type electronic component packages capable of high integration with accuracy and with ease. SOLUTION: An electronic component package 1 has: a main body including a plurality of laminated layer parts each of which has a side surface, and having a side surface including the side surfaces of the plurality of layer parts; and a wiring 3 arranged on the side surface of the main body. Each layer part has at least one electronic component chip, and a plurality of electrodes arranged on the side surface of the layer part. This method of manufacturing the electronic component package 1 includes the steps of fabricating a main body aggregate 160 including a plurality of planned main body parts each of which is to become the main body later, the planned main body parts being arranged in one direction orthogonal to a direction of lamination of the plurality of layer parts; forming the wiring 3 for each of the planned main body parts 2P of the main body aggregate 160; and cutting the main body aggregate 160 after the formation of the wiring 3 so as to separate the plurality of planned main body parts 2P from each other so that each of them becomes the main body to form a plurality of electronic component packages. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：大量生产具有精度和容易度高集成度的层叠型电子部件封装。解决方案：电子部件封装1具有：主体，其包括多个层叠层部分，每个层叠层部分具有侧表面，并且具有包括多个层部分的侧表面的侧表面; 以及布置在主体的侧表面上的布线3。每个层部分具有至少一个电子部件芯片和布置在层部分的侧表面上的多个电极。制造电子部件封装1的方法包括以下步骤：制造主体集合体160，该主体集合体160包括稍后将成为主体的多个计划的主体部分，计划的主体部分沿与所述多个层部分的层叠方向; 为主体集合体160的计划主体部分2P形成布线3; 并且在形成布线3之后切割主体集合体160，以便将多个预定的主体部分2P彼此分离，使得它们成为主体以形成多个电子部件包装。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2009010371A Capacitor and method of manufacturing the same, and capacitor unit 有权
标题翻译：电容器及其制造方法和电容器单元
公开(公告)号：JP2009010371A
公开(公告)日：2009-01-15
申请号：JP2008155932
申请日：2008-06-13
申请人： Headway Technologies Inc , Shinka Jitsugyo Kk , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , SHIMIZU TATSUJI , HORINAKA TAKEHIRO , ISHIZAKI KAZUO , TANEMURA SHIGEKI
IPC分类号： H01G4/33 , H01G4/38 , H01G4/40
CPC分类号： H01G4/005 , H01G4/38 , Y10T29/435
摘要： PROBLEM TO BE SOLVED: To provide: a capacitor which easily secures desired electrostatic capacity; a method of manufacturing the same; and a capacitor unit. SOLUTION: The present invention has a configuration which can manufacture a capacitor 1A comprising a first electrode layer 9, conductive first convex sections 14a layered on a surface of the first electrode layer 9, a first dielectric layer 6 formed on a surface of the first convex sections 14a and a surface of the first electrode layer 9, and a second electrode layer 7 formed so as to be superimposed on the first convex sections 14a and the first electrode layer 9 via the first dielectric layer 6. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供：容易确保期望的静电电容的电容器; 其制造方法; 和电容器单元。解决方案：本发明具有可以制造电容器1A的结构，该电容器1A包括第一电极层9，层叠在第一电极层9的表面上的导电的第一凸部14a，形成在第一电极层9的表面上的第一电介质层6 第一凸部14a和第一电极层9的表面，以及通过第一电介质层6叠置在第一凸部14a和第一电极层9上的第二电极层7。（C）2009，JPO＆INPIT

7. 发明专利

JP2009002948A Sensing unit and method of making the same 有权
标题翻译：感测单元及其制造方法
公开(公告)号：JP2009002948A
公开(公告)日：2009-01-08
申请号：JP2008155935
申请日：2008-06-13
申请人： Headway Technologies Inc , Shinka Jitsugyo Kk , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , SHIMIZU TATSUJI , HORINAKA TAKEHIRO , ISHIZAKI KAZUO , TANEMURA SHIGEKI
IPC分类号： G01P15/105
CPC分类号： G01P15/0802 , G01P15/12 , G01P15/123 , Y10T29/49002
摘要： PROBLEM TO BE SOLVED: To provide a sensing unit being high in degree of freedom in terms of measurement direction, and a method of making the same. SOLUTION: In a sensing unit 10, a movable portion 34 of a spring portion 30 is supported floatably above a recessed portion 22 formed in a substrate 20. Thus, the movable portion 34 is capable of oscillating in any direction parallel to the substrate surface. Moreover, the movable portion 34 is capable of oscillating in the thickness direction of the substrate such that the amplitude of a center side end portion thereof reaches the maximum. A sensor portion 40 is provided on the movable portion 34. As a result, the sensing unit 10 being higher in degree of freedom in terms of the measurement direction than a conventional sensing unit that oscillates in only one direction. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种在测量方向方面具有高自由度的感测单元及其制造方法。解决方案：在感测单元10中，弹簧部分30的可移动部分34可浮动地支撑在形成在基板20中的凹部22的上方。因此，可动部分34能够在平行于基板20的任何方向上振荡衬底表面。此外，可移动部分34能够在基板的厚度方向上振动，使得其中心侧端部的振幅达到最大。传感器部分40设置在可移动部分34上。结果，感测单元10在测量方向上的自由度要高于仅在一个方向上振荡的常规感测单元。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2009002947A Sensing unit and method of making the same 有权
标题翻译：感测单元及其制造方法
公开(公告)号：JP2009002947A
公开(公告)日：2009-01-08
申请号：JP2008155928
申请日：2008-06-13
申请人： Headway Technologies Inc , Shinka Jitsugyo Kk , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , SHIMIZU TATSUJI , HORINAKA TAKEHIRO , ISHIZAKI KAZUO , TANEMURA SHIGEKI
IPC分类号： G01P15/105 , G01P15/18
CPC分类号： G01P15/105 , G01P15/08 , G01P15/0802 , Y10T29/49002 , Y10T29/49007 , Y10T29/4913 , Y10T29/49146 , Y10T29/49171 , Y10T29/49176 , Y10T29/4922
摘要： PROBLEM TO BE SOLVED: To provide a sensing unit having a simple constitution, and a method of making the same. SOLUTION: In the sensing unit 10, a spring portion 30 having a support portion 32 and a movable portion 34 is conductive. A signal of a sensor portion 40 provided on the movable portion of the spring portion 30 is transmitted via the spring portion 30. Hence, the sensing unit 10 has the simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion 40. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供具有简单结构的感测单元及其制造方法。解决方案：在感测单元10中，具有支撑部分32和可移动部分34的弹簧部分30是导电的。设置在弹簧部分30的可动部分上的传感器部分40的信号通过弹簧部分30传递。因此，感测单元10具有简单的结构，具有少量的部件，并且电线不一定必须为每个传感器部分40提供。结果，实现了制造成本的降低，制造过程的简化等。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2008192276A Method of manufacturing magnetic head, and magnetic head substructure 有权
标题翻译：制造磁头和磁头基底的方法
公开(公告)号：JP2008192276A
公开(公告)日：2008-08-21
申请号：JP2007216731
申请日：2007-08-23
申请人： Headway Technologies Inc , Shinka Jitsugyo Kk , ヘッドウェイテクノロジーズインコーポレイテッド , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , ITO HIROYUKI , ISHIZAKI KAZUO , FUJII TAKASHI , SHIMIZU TATSUJI
IPC分类号： G11B5/31 , G11B5/39
CPC分类号： G11B5/3166 , G11B5/1278 , G11B5/3116 , G11B5/3169 , G11B5/3173 , G11B5/3967 , Y10T29/49034 , Y10T29/49037 , Y10T29/49041 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： PROBLEM TO BE SOLVED: To allow a medium facing surface formed by grinding a surface becoming the medium facing surface to be accurately formed at a desired position. SOLUTION: A magnetic head substructure where a plurality of pre-head portions 101 are arranged in a plurality of rows is manufactured by forming components of a plurality of magnetic heads, for a substrate, the magnetic head substructure is cut and the plurality of pre-head portions 101 are separated from each other to make a plurality of magnetic heads. The surface formed by cutting the substructure is ground to form a ground surface. This ground surface is ground so as to reach a target position of a medium facing surface. The magnetic head substructure includes first to fourth resistor elements 6, 42a, 60, and 52a each of which detects the position of the ground surface. The third and fourth detection elements 60 and 52a are located at positions shifted from the first and second resistor elements in a direction perpendicular to the medium facing surface. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过研磨成为中等面向表面的表面形成的介质面对表面能够精确地形成在期望的位置。解决方案：通过形成多个磁头的部件来形成多个预磁头部分101以多行布置的磁头子结构，对于基板，磁头子结构被切割，并且多个的前头部分101彼此分离以形成多个磁头。通过切割子结构形成的表面被研磨以形成地面。该地表面被研磨以达到面向介质的表面的目标位置。磁头子结构包括第一至第四电阻元件6,42,60和52a，每个电阻元件检测地面的位置。第三和第四检测元件60和52a位于与第一和第二电阻器元件沿与介质相对表面垂直的方向上移位的位置。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2008107323A Magnetic film sensor and method of manufacturing the same 有权
标题翻译：磁性膜传感器及其制造方法
公开(公告)号：JP2008107323A
公开(公告)日：2008-05-08
申请号：JP2007230674
申请日：2007-09-05
申请人： Headway Technologies Inc , Koji Shimazawa , Shinka Jitsugyo Kk , ヘッドウェイテクノロジーズインコーポレイテッド , 幸司島沢 , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SASAKI YOSHITAKA , SHIMAZAWA KOJI , SHIMIZU TATSUJI
IPC分类号： G01L1/12 , G01R33/09 , H01L43/08
CPC分类号： G01R33/18 , Y10T29/4902
摘要： PROBLEM TO BE SOLVED: To provide a new high-sensitive sensor applying MEMS (micro electro mechanical system) technology, based on operation principle which is separate from those of conventional sensors, and to provide its manufacturing method. SOLUTION: A magnetic film sensor comprises a magnetic film that generates magnetostriction, and a magnetostrictive structure that generates magnetostriction in the magnetic film. The magnetostrictive structure is constituted so as to generate magnetostriction by making the magnetic film curve, for example. The magnetostrictive structure is obtained, for example, by providing a depressed insulating layer where a surface is formed so as to stride the depression and to form the magnetic film. COPYRIGHT: (C)2008,JPO&INPIT

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