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1. 发明授权

US09387608B2 Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition 有权
标题翻译：用于光反射的热固性树脂组合物，用于制造树脂组合物的方法和光学半导体元件安装基板以及使用该树脂组合物的光学半导体装置
公开(公告)号：US09387608B2
公开(公告)日：2016-07-12
申请号：US12515182
申请日：2007-11-14
申请人： Hayato Kotani , Naoyuki Urasaki , Kanako Yuasa , Akira Nagai , Mitsuyoshi Hamada
发明人： Hayato Kotani , Naoyuki Urasaki , Kanako Yuasa , Akira Nagai , Mitsuyoshi Hamada
IPC分类号： C08K3/22 , C08K7/24 , C08K7/28 , C08L63/02 , C08L63/06 , B29C45/02 , C08K3/00 , C08L63/00 , B29C45/00 , C08G59/40 , C08G59/42 , B29L11/00 , H01L33/48 , H01L33/60
CPC分类号： H01L33/60 , B29C45/0001 , B29C45/02 , B29L2011/00 , C08G59/4014 , C08G59/4215 , C08K3/013 , C08K3/2279 , C08K7/24 , C08K7/28 , C08K2003/222 , C08K2003/2227 , C08K2003/2241 , C08K2003/2244 , C08L63/00 , C08L63/06 , H01L33/486 , H01L33/507 , H01L33/56 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： This invention provides a heat curable resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature 100° C. to 200° C., molding pressure not more than 20 MPa, and molding time 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device.
摘要翻译：本发明提供了一种用于光反射的热固性树脂组合物，其在固化后可在可见光到近紫外光的范围内实现高反射率，具有优异的耐热劣化性和片剂成型性，并且在转印期间不太可能引起毛刺成型，以及树脂组合物的制造方法以及使用该树脂组合物的光半导体元件安装基板和光半导体装置。用于光反射的热固化树脂组合物包括热固化组分和白色颜料，其特征在于在成型温度为100℃至200℃的条件下在传递模塑时引起的毛刺长度，成型压力不大于 20MPa，成型时间60〜120秒不大于5mm，并且在350nm至800nm的波长下热固化后的光反射率不小于80％。该树脂组合物可用于构造光学半导体元件安装基板和光学半导体器件。

2. 发明申请

US20100140638A1 THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, METHOD FOR MANUFACTURING THE RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND OPTICAL SEMICONDUCTOR DEVICE USING THE RESIN COMPOSITION 有权
标题翻译：用于光反射的热固性树脂组合物，用于制造树脂组合物的方法和使用树脂组合物的光学半导体元件安装基板和光学半导体器件
公开(公告)号：US20100140638A1
公开(公告)日：2010-06-10
申请号：US12515182
申请日：2007-11-14
申请人： Hayato Kotani , Naoyuki Urasaki , Kanako Yuasa , Akira Nagai , Mitsuyoshi Hamada
发明人： Hayato Kotani , Naoyuki Urasaki , Kanako Yuasa , Akira Nagai , Mitsuyoshi Hamada
IPC分类号： H01L33/00 , C08L63/00 , C08K3/36 , C08K3/22 , C08K3/26
CPC分类号： H01L33/60 , B29C45/0001 , B29C45/02 , B29L2011/00 , C08G59/4014 , C08G59/4215 , C08K3/013 , C08K3/2279 , C08K7/24 , C08K7/28 , C08K2003/222 , C08K2003/2227 , C08K2003/2241 , C08K2003/2244 , C08L63/00 , C08L63/06 , H01L33/486 , H01L33/507 , H01L33/56 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： This invention provides a heat curable resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature 100° C. to 200° C., molding pressure not more than 20 MPa, and molding time 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device.
摘要翻译：本发明提供了一种用于光反射的热固性树脂组合物，其在固化后可在可见光到近紫外光的范围内实现高反射率，具有优异的耐热劣化性和片剂成型性，并且在转印期间不太可能引起毛刺成型，以及树脂组合物的制造方法以及使用该树脂组合物的光半导体元件安装基板和光半导体装置。用于光反射的热固化树脂组合物包括热固化组分和白色颜料，其特征在于在成型温度为100℃至200℃的条件下在传递模塑时引起的毛刺长度，成型压力不大于 20MPa，成型时间60〜120秒不大于5mm，并且在350nm至800nm的波长下热固化后的光反射率不小于80％。该树脂组合物可用于构造光学半导体元件安装基板和光学半导体器件。

3. 发明申请

US20090326100A1 EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE 失效
标题翻译：用于密封和电子元件设备的环氧树脂模塑材料
公开(公告)号：US20090326100A1
公开(公告)日：2009-12-31
申请号：US12444026
申请日：2007-09-25
申请人： Mitsuyoshi Hamada , Akira Nagai , Hiroaki Ikeba , Ken Nanaumi , Kouhei Yasuzawa
发明人： Mitsuyoshi Hamada , Akira Nagai , Hiroaki Ikeba , Ken Nanaumi , Kouhei Yasuzawa
IPC分类号： C09J163/00
CPC分类号： H01L23/295 , C08G77/14 , C08G77/18 , C08K3/013 , C08K5/54 , C08L83/00 , C09J163/00 , H01L23/296 , H01L2924/0002 , Y10T428/31511 , Y10T428/31663 , H01L2924/00
摘要： The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.
摘要翻译：本发明提供一种密封环氧树脂成型材料，其流畅性和耐回焊性优异，而不降低其固化性，以及电子部件装置设置有用该材料密封的元件。用于密封的环氧树脂成型材料包括（A）环氧树脂，（B）固化剂，（C）固化促进剂，（D）无机填料和（E）烷氧基硅烷聚合物，其中烷氧基硅烷聚合物（E）是通过使特定烷氧基硅烷化合物的烷氧基甲硅烷基部分聚合而得到的聚合物。

4. 发明授权

US08084130B2 Epoxy resin molding material for sealing and electronic component device 失效
标题翻译：环氧树脂成型材料用于密封和电子部件装置
公开(公告)号：US08084130B2
公开(公告)日：2011-12-27
申请号：US12444026
申请日：2007-09-25
申请人： Mitsuyoshi Hamada , Akira Nagai , Hiroaki Ikeba , Ken Nanaumi , Kouhei Yasuzawa
发明人： Mitsuyoshi Hamada , Akira Nagai , Hiroaki Ikeba , Ken Nanaumi , Kouhei Yasuzawa
IPC分类号： B32B27/04 , B32B27/18 , B32B27/38 , C08L63/00 , C08L83/04 , H01L23/29
CPC分类号： H01L23/295 , C08G77/14 , C08G77/18 , C08K3/013 , C08K5/54 , C08L83/00 , C09J163/00 , H01L23/296 , H01L2924/0002 , Y10T428/31511 , Y10T428/31663 , H01L2924/00
摘要： The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.
摘要翻译：本发明提供一种密封环氧树脂成型材料，其流畅性和耐回焊性优异，而不降低其固化性，以及电子部件装置设置有用该材料密封的元件。用于密封的环氧树脂成型材料包括（A）环氧树脂，（B）固化剂，（C）固化促进剂，（D）无机填料和（E）烷氧基硅烷聚合物，其中烷氧基硅烷聚合物（E）是通过使特定烷氧基硅烷化合物的烷氧基甲硅烷基部分聚合而得到的聚合物。

5. 发明申请

US20090012233A1 Epoxy Resin Molding Material for Sealing and Electronic Component Device 审中-公开
标题翻译：用于密封和电子元件装置的环氧树脂成型材料
公开(公告)号：US20090012233A1
公开(公告)日：2009-01-08
申请号：US12161839
申请日：2007-01-23
申请人： Mitsuyoshi Hamada , Akira Nagai
发明人： Mitsuyoshi Hamada , Akira Nagai
IPC分类号： C08L63/10 , C08L63/00
CPC分类号： H01L23/296 , C08F220/18 , C08F230/08 , C08G59/621 , C08L43/04 , C08L63/00 , H01L2924/0002 , C08L2666/22 , C08L2666/04 , H01L2924/00
摘要： The present invention relates to an epoxy resin molding material for sealing, comprising an epoxy resin (A), a curing agent (B) and an acrylic compound (C), wherein the acrylic compound (C) is an acrylic compound obtained by polymerizing compounds represented respectively by the following general formulae (I) and (II) in a (I)/(II) mass ratio of from 0 to 10. The present invention provides an epoxy resin molding material for sealing, which is excellent in fluidity and reflow soldering resistance without reducing curability, as well as an electronic component device comprising an element sealed therewith. wherein R1 represents a hydrogen atom or a methyl group, and R2 represents a silicon atom-free monovalent organic group, R3 represents a hydrogen atom or a methyl group, R6 represents a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms, R7 represents a hydrocarbon group having 1 to 6 carbon atoms, and p is an integer of 1 to 3.
摘要翻译：本发明涉及包含环氧树脂（A），固化剂（B）和丙烯酸类化合物（C））的密封用环氧树脂成型材料，其中丙烯酸类化合物（C）是通过使化合物在（I）/（II）质量比为0〜10的范围内分别由以下通式（I）和（II）表示。本发明提供一种密封性优异的环氧树脂成型材料，其流动性和回流性优异耐焊接性而不降低固化性，以及包括用其密封的元件的电子部件装置。其中R1表示氢原子或甲基，R2表示无硅原子的一价有机基团，R3表示氢原子或甲基，R6表示氢原子或碳原子数1〜6的烃基，R7 表示碳原子数1〜6的烃基，p表示1〜3的整数。

6. 发明申请

US20090247670A1 Epoxy Resin Molding Material for Sealing, and Electronic Component Device 审中-公开
标题翻译：用于密封的环氧树脂成型材料和电子部件装置
公开(公告)号：US20090247670A1
公开(公告)日：2009-10-01
申请号：US12094532
申请日：2006-11-16
申请人： Mitsuyoshi Hamada , Akira Nagai , Mitsuo Katayose , Kazuyoshi Tendou
发明人： Mitsuyoshi Hamada , Akira Nagai , Mitsuo Katayose , Kazuyoshi Tendou
IPC分类号： C08L63/00 , C08L95/00
CPC分类号： H01L23/293 , C08G59/621 , C08J3/226 , C08J2363/00 , C08J2463/00 , C08K3/22 , C08K5/0041 , C08L63/00 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to an epoxy resin molding material for sealing, comprising an epoxy resin (A), a curing agent (B), and a colorant resin mixture (C) wherein a resin (C1) and a colorant (D) having an electric resistivity of 1×105Ω·cm or more are beforehand mixed with each other. This can provide an epoxy resin molding material for sealing which is good in moldabilities such as fluidity and curability, and colorability, and which does not cause a short circuit failure based on an electroconductive material even when the material is used in a package wherein the distance between pads or wires is small; and an electronic component device equipped with an element sealed therewith.
摘要翻译：本发明涉及一种用于密封的环氧树脂模制材料，其包括环氧树脂（A），固化剂（B）和着色剂树脂混合物（C），其中树脂（C1）和着色剂（D）具有电预先混合1×10 5Ω·cm以上的电阻率。这可以提供一种密封性优异的环氧树脂成型材料，其流动性，固化性，着色性等成型性良好，即使将该材料用于包装中也不会导致基于导电性材料的短路故障，焊盘或电线之间的距离小; 以及配备有与其密封的元件的电子部件装置。

7. 发明授权

US07838671B2 Nitrogen-containing organosilicon compound method of manufacture, and method of treating surfaces 有权
标题翻译：含氮有机硅化合物的制造方法和表面处理方法
公开(公告)号：US07838671B2
公开(公告)日：2010-11-23
申请号：US11953559
申请日：2007-12-10
申请人： Makoto Iwai , Mitsuyoshi Hamada
发明人： Makoto Iwai , Mitsuyoshi Hamada
IPC分类号： C07D417/00
CPC分类号： C07F7/1804
摘要： A new nitrogen-containing organosilicon compound contains tertiary amine groups and carbonyl groups wherein the tertiary amine groups are selected from R1R2N— (where R1 and R2 are the same or different univalent hydrocarbon groups of 1-15 carbon atoms), alicyclic amino groups, or heterocyclic amino groups containing in their rings one or more tertiary amine groups.
摘要翻译：新的含氮有机硅化合物含有叔胺基团和羰基，其中叔胺基团选自R1R2N-（其中R1和R2是相同或不同的1-15个碳原子的一价烃基），脂环族氨基或在其环中含有一个或多个叔胺基团的杂环氨基。

8. 发明申请

US20080177065A1 Nitrogen-Containing Organosilicon Compound Method Of Manufacture, And Method Of Treating Surfaces 有权
标题翻译：含氮有机硅化合物的制造方法及处理方法
公开(公告)号：US20080177065A1
公开(公告)日：2008-07-24
申请号：US11953559
申请日：2007-12-10
申请人： Makoto Iwai , Mitsuyoshi Hamada
发明人： Makoto Iwai , Mitsuyoshi Hamada
IPC分类号： C07F7/10
CPC分类号： C07F7/1804
摘要： A new nitrogen-containing organosilicon compound contains tertiary amine groups and carbonyl groups wherein the tertiary amine groups are selected from R1R2N— (where R1 and R2 are the same or different univalent hydrocarbon groups of 1-15 carbon atoms), alicyclic amino groups, or heterocyclic amino groups containing in their rings one or more tertiary amine groups.
摘要翻译：新的含氮有机硅化合物含有叔胺基和羰基，其中叔胺基选自R 1，R 2，N - （其中R 1， R 2和R 2是相同或不同的1-15个碳原子的一价烃基），脂环族氨基或在其环中含有一个或多个叔胺基团的杂环氨基。

9. 发明授权

US07326800B2 Nitrogen-containing organosilicon compound, method of manufacture, and method of treating surfaces 失效
标题翻译：含氮有机硅化合物，制造方法和表面处理方法
公开(公告)号：US07326800B2
公开(公告)日：2008-02-05
申请号：US10551528
申请日：2004-03-30
申请人： Makoto Iwai , Mitsuyoshi Hamada
发明人： Makoto Iwai , Mitsuyoshi Hamada
IPC分类号： C07F7/04
CPC分类号： C07F7/1804
摘要： A new nitrogen-containing organosilicon compound contains tertiary amine groups and carbonyl groups wherein the tertiary amine groups are selected from R1R2N— (where R1 and R2 are the same or different univalent hydrocarbon groups of 1-15 carbon atoms), alicyclic amino groups, or heterocyclic amino groups containing in their rings one or more tertiary amine groups.
摘要翻译：新的含氮有机硅化合物含有叔胺基团和羰基，其中叔胺基团选自R1R2N-（其中R1和R2是相同或不同的1-15个碳原子的一价烃基），脂环族氨基或在其环中含有一个或多个叔胺基团的杂环氨基。

10. 发明申请

US20140128505A1 EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE 审中-公开
标题翻译：用于密封和电子元件设备的环氧树脂模塑材料
公开(公告)号：US20140128505A1
公开(公告)日：2014-05-08
申请号：US14116979
申请日：2012-05-10
申请人： Mitsuyoshi Hamada , Fumio Furusawa , Ryoichi Ikezawa , Keizo Takemiya , Toru Baba
发明人： Mitsuyoshi Hamada , Fumio Furusawa , Ryoichi Ikezawa , Keizo Takemiya , Toru Baba
IPC分类号： C09K3/10
CPC分类号： C08K7/18 , C08G59/063 , C08G59/08 , C08G59/621 , C08G59/688 , C08K3/36 , C08K2201/005 , C08K2201/006 , C08L63/00 , C09K3/1006 , C09K2003/1078 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要： An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.
摘要翻译：用于密封的环氧树脂成型材料包括（A）环氧树脂，（B）固化剂，（C）固化促进剂，（D）无机填料，（E1）含芳基氨基的烷氧基硅烷化合物和（E2 ）含环氧基的烷氧基硅烷化合物。

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