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1. 发明授权

US5134962A Spin coating apparatus 失效
标题翻译：旋涂机
公开(公告)号：US5134962A
公开(公告)日：1992-08-04
申请号：US524378
申请日：1990-05-16
申请人： Haruo Amada , Akihiro Kojima , Hiroshi Kagohashi , Atsuyuki Sakai , Katsumasa Shimura , Hisamitsu Maekawa
发明人： Haruo Amada , Akihiro Kojima , Hiroshi Kagohashi , Atsuyuki Sakai , Katsumasa Shimura , Hisamitsu Maekawa
IPC分类号： G03F7/16 , B05C5/00 , B05C11/08 , B05C11/10 , G11B5/842 , H01L21/00 , H01L21/027 , H01L21/30
CPC分类号： H01L21/6715 , B05C11/08
摘要： The present invention relates to a spin coating apparatus for feeding a clean liquid at a fixed rate. In any of the feeding apparatus in the prior art, no constituent other than a filter has the function of eliminating foreign matter, and the operation of feeding a liquid under precise control is not attained. This results in the problem of the mixing of the foreign matter (and air bubbles) in the feed liquid, and the problem of nonuniformity in a feed speed as well as a feed amount. As expedients for solving these problems, the present invention provides the functions of automatically sensing and excluding factors for the appearances of the foreign matters, and devices for automatically and precisely controlling feed control elements such as a pump, thereby feeding the clean liquid in a constant amount and at a constant speed.
摘要翻译：本发明涉及一种用于以固定速率供给清洁液体的旋涂装置。在现有技术中的任何一个进料装置中，除了过滤器之外的其它成分都不具有消除异物的功能，并且不能实现在精确控制下供给液体的操作。这导致进料液体中异物（和气泡）的混合以及进料速度不均匀以及进料量的问题。作为解决这些问题的方法，本发明提供了自动检测和排除外来物质的因素的功能，以及用于自动和精确地控制诸如泵的进料控制元件的装置，由此将清洁液体进料恒定数量和恒定速度。

2. 发明授权

US07335574B2 Semiconductor device and manufacturing method of the same 有权
标题翻译：半导体器件及其制造方法相同
公开(公告)号：US07335574B2
公开(公告)日：2008-02-26
申请号：US11100598
申请日：2005-04-07
申请人： Hidekazu Okuda , Haruo Amada , Taizo Hashimoto
发明人： Hidekazu Okuda , Haruo Amada , Taizo Hashimoto
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： H01L29/7397 , H01L21/6835 , H01L24/11 , H01L24/29 , H01L24/73 , H01L24/81 , H01L2221/6834 , H01L2224/0401 , H01L2224/04026 , H01L2224/05124 , H01L2224/05155 , H01L2224/05166 , H01L2224/05184 , H01L2224/05644 , H01L2224/13099 , H01L2224/16 , H01L2224/29111 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/181 , H01L2924/01014 , H01L2924/0105 , H01L2924/3512 , H01L2924/00 , H01L2224/29099 , H01L2924/00012 , H01L2924/00014 , H01L2924/013
摘要： Provided is a technology capable of improving a production yield of a semiconductor device having, for example, IGBG as a semiconductor element. After formation of an interconnect on the surface side of a semiconductor substrate, a supporting substrate covering the interconnect is bonded onto the interconnect. Then, a BG tape is overlapped and bonded onto the supporting substrate and the semiconductor substrate is ground from the backside. The BG tape is then peeled off and an impurity is introduced into the backside of the semiconductor substrate by ion implantation. Then, the supporting substrate is peeled off, followed by heat treatment of the semiconductor substrate.
摘要翻译：提供了能够提高具有例如作为半导体元件的IGBG的半导体器件的制造成品率的技术。在半导体衬底的表面侧上形成互连后，覆盖互连的支撑衬底接合到互连上。然后，将BG带重叠并接合到支撑基板上，并且半导体基板从背面研磨。然后将BG带剥离，通过离子注入将杂质引入半导体衬底的背面。然后，将支撑基板剥离，然后对半导体基板进行热处理。

3. 发明授权

US4593168A Method and apparatus for the heat-treatment of a plate-like member 失效
标题翻译：板状构件的热处理方法和装置
公开(公告)号：US4593168A
公开(公告)日：1986-06-03
申请号：US581268
申请日：1984-02-17
申请人： Haruo Amada
发明人： Haruo Amada
IPC分类号： H01L21/205 , C23C16/44 , C23C16/458 , C30B25/10 , C30B25/12 , C30B31/12 , C30B31/14 , H01L21/18 , H01L21/22 , H05B6/80 , H05B6/78
CPC分类号： H01L21/18 , C30B25/10 , C30B25/12 , C30B31/12 , C30B31/14 , H05B6/806 , Y10T29/41
摘要： The present invention relates to a method of heat-treating a semiconductor wafer by utilizing an electromagnetic wave. The wafer is floated by the blast of a gas and is held in a non-contacting state, and the electromagnetic wave, such as microwave, is projected on the wafer in this state so as to heat it. According to the present invention, only the wafer is heated and, hence, the wafer can be heat-treated uniformly and efficiently with great precision.
摘要翻译：本发明涉及利用电磁波对半导体晶片进行热处理的方法。晶片被气体喷射而浮起并保持在非接触状态，并且在这种状态下将电磁波（如微波）投影在晶片上以便加热。根据本发明，只有晶片被加热，因此可以高精度地均匀且有效地热处理晶片。

4. 发明申请

US20100127306A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：US20100127306A1
公开(公告)日：2010-05-27
申请号：US12644376
申请日：2009-12-22
申请人： Hidekazu Okuda , Haruo Amada , Taizo Hashimoto
发明人： Hidekazu Okuda , Haruo Amada , Taizo Hashimoto
IPC分类号： H01L29/739 , H01L21/331
CPC分类号： H01L29/7397 , H01L21/6835 , H01L24/11 , H01L24/29 , H01L24/73 , H01L24/81 , H01L2221/6834 , H01L2224/0401 , H01L2224/04026 , H01L2224/05124 , H01L2224/05155 , H01L2224/05166 , H01L2224/05184 , H01L2224/05644 , H01L2224/13099 , H01L2224/16 , H01L2224/29111 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/181 , H01L2924/01014 , H01L2924/0105 , H01L2924/3512 , H01L2924/00 , H01L2224/29099 , H01L2924/00012 , H01L2924/00014 , H01L2924/013
摘要： Provided is a technology capable of improving a production yield of a semiconductor device having, for example, IGBG as a semiconductor element. After formation of an interconnect on the surface side of a semiconductor substrate, a supporting substrate covering the interconnect is bonded onto the interconnect. Then, a BG tape is overlapped and bonded onto the supporting substrate and the semiconductor substrate is ground from the backside. The BG tape is then peeled off and an impurity is introduced into the backside of the semiconductor substrate by ion implantation. Then, the supporting substrate is peeled off, followed by heat treatment of the semiconductor substrate.
摘要翻译：提供了能够提高具有例如作为半导体元件的IGBG的半导体器件的制造成品率的技术。在半导体衬底的表面侧上形成互连后，覆盖互连的支撑衬底接合到互连上。然后，将BG带重叠并接合到支撑基板上，并且半导体基板从背面研磨。然后将BG带剥离，通过离子注入将杂质引入半导体衬底的背面。然后，将支撑基板剥离，然后对半导体基板进行热处理。

5. 发明申请

US20120009695A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US20120009695A1
公开(公告)日：2012-01-12
申请号：US13237235
申请日：2011-09-20
申请人： Haruo Amada , Kenji Shimazawa
发明人： Haruo Amada , Kenji Shimazawa
IPC分类号： H01L21/66 , H01L21/822
CPC分类号： H01L29/7395 , H01L21/3083 , H01L21/6835 , H01L21/78 , H01L22/14 , H01L29/66333 , H01L2221/6834 , H01L2924/0002 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , H01L2924/00
摘要： The semiconductor device is formed by forming a first metal film over a first main surface of a semiconductor wafer having a first thickness, performing back grinding to a second main surface of the semiconductor wafer thereby making a second thickness thinner than the first thickness and forming an insulation film pattern having a first insulation film and containing an annular insulation film pattern along the periphery of a second main surface of the semiconductor wafer over the second main surface along the periphery thereof. The second main surface of the semiconductor wafer is bonded to a pressure sensitive adhesive sheet thereby holding the device semiconductor wafer by way of the pressure sensitive adhesive sheet to a dicing frame in a state where the insulation film pattern is present.
摘要翻译：半导体器件通过在具有第一厚度的半导体晶片的第一主表面上形成第一金属膜，对半导体晶片的第二主表面进行反向磨削，从而形成比第一厚度更薄的第二厚度，并形成绝缘膜图案具有第一绝缘膜，并且沿其周边在第二主表面上沿着半导体晶片的第二主表面的周边包含环形绝缘膜图案。将半导体晶片的第二主表面粘合到压敏粘合片上，从而在存在绝缘膜图案的状态下通过压敏粘合片将器件半导体晶片保持在切割框架上。

6. 发明申请

US20050233499A1 Semiconductor device and manufacturing method of the same 有权
标题翻译：半导体器件及其制造方法相同
公开(公告)号：US20050233499A1
公开(公告)日：2005-10-20
申请号：US11100598
申请日：2005-04-07
申请人： Hidekazu Okuda , Haruo Amada , Taizo Hashimoto
发明人： Hidekazu Okuda , Haruo Amada , Taizo Hashimoto
IPC分类号： H01L21/28 , H01L21/304 , H01L21/336 , H01L21/44 , H01L21/60 , H01L21/68 , H01L29/41 , H01L29/739 , H01L29/78
CPC分类号： H01L29/7397 , H01L21/6835 , H01L24/11 , H01L24/29 , H01L24/73 , H01L24/81 , H01L2221/6834 , H01L2224/0401 , H01L2224/04026 , H01L2224/05124 , H01L2224/05155 , H01L2224/05166 , H01L2224/05184 , H01L2224/05644 , H01L2224/13099 , H01L2224/16 , H01L2224/29111 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/181 , H01L2924/01014 , H01L2924/0105 , H01L2924/3512 , H01L2924/00 , H01L2224/29099 , H01L2924/00012 , H01L2924/00014 , H01L2924/013
摘要： Provided is a technology capable of improving a production yield of a semiconductor device having, for example, IGBG as a semiconductor element. After formation of an interconnect on the surface side of a semiconductor substrate, a supporting substrate covering the interconnect is bonded onto the interconnect. Then, a BG tape is overlapped and bonded onto the supporting substrate and the semiconductor substrate is ground from the backside. The BG tape is then peeled off and an impurity is introduced into the backside of the semiconductor substrate by ion implantation. Then, the supporting substrate is peeled off, followed by heat treatment of the semiconductor substrate.
摘要翻译：提供了能够提高具有例如作为半导体元件的IGBG的半导体器件的制造成品率的技术。在半导体衬底的表面侧上形成互连后，覆盖互连的支撑衬底接合到互连上。然后，将BG带重叠并接合到支撑基板上，并且半导体基板从背面研磨。然后将BG带剥离，通过离子注入将杂质引入半导体衬底的背面。然后，将支撑基板剥离，然后对半导体基板进行热处理。

7. 发明授权

US5857661A Valve drive control method, valve drive control apparatus and fluid member supply apparatus 失效
标题翻译：阀驱动控制方法，阀驱动控制装置和流体部件供给装置
公开(公告)号：US5857661A
公开(公告)日：1999-01-12
申请号：US550373
申请日：1995-10-30
申请人： Haruo Amada , Takashi Komatsu
发明人： Haruo Amada , Takashi Komatsu
IPC分类号： F16K7/17 , B01D27/10 , B05B9/03 , F04B43/02 , F16K7/07 , F16K23/00 , F16K31/12
CPC分类号： F16K23/00 , F16K7/075 , Y10T137/7736
摘要： A valve drive control apparatus having a communication unit for communicating a flow-in-side tube path with a flow-out-side tube path, which guide a fluid member, and a control medium storage chamber into which an attenuation characteristic control medium is filled. The valve drive control apparatus further includes an elastic deform member for defining the communication unit and the control medium storage chamber, a drive unit for pressuring the attenuation characteristic control medium so as to deform the elastic deform member via the attenuation characteristic control medium, and also a control unit for controlling the drive unit based on a drive control valve obtained from a valve drive characteristic representative of a relationship between a deform amount of a valve mechanism unit and a drive pressure value of the valve mechanism unit. The valve drive characteristic is acquired from a dynamic fluid characteristic of the fluid member and a dynamic fluid characteristic of the attenuation characteristic control medium.
摘要翻译：一种阀驱动控制装置，其具有用于使流入侧管路与引导流体构件的流出侧管路连通的通信单元以及填充有衰减特性控制介质的控制介质储存室。阀驱动控制装置还包括用于限定通信单元和控制介质存储室的弹性变形构件，用于对衰减特性控制介质进行加压以便经由衰减特性控制介质使弹性变形构件变形的驱动单元，以及控制单元，用于基于从表示阀机构单元的变形量与阀机构单元的驱动压力值之间的关系的阀驱动特性获得的驱动控制阀来控制驱动单元。阀驱动特性是从流体部件的动态流体特性和衰减特性控制介质的动态流体特性获得的。

8. 发明授权

US08039276B2 Manufacturing method of semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US08039276B2
公开(公告)日：2011-10-18
申请号：US12719067
申请日：2010-03-08
申请人： Haruo Amada , Kenji Shimazawa
发明人： Haruo Amada , Kenji Shimazawa
IPC分类号： H01L21/30
CPC分类号： H01L29/7395 , H01L21/3083 , H01L21/6835 , H01L21/78 , H01L22/14 , H01L29/66333 , H01L2221/6834 , H01L2924/0002 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , H01L2924/00
摘要： The semiconductor device si formed by forming a first metal film over a first main surface of a semiconductor wafer having a first thinkness, performing back grinding to a second main surface of the semiconductor wafer thereby making a second thickness thinner than the first thickness and forming an insulation film pattern having a first insulation film and containing an annular insulation film pattern along the periphery of a second main surface of the semiconductor wafer over the second main surface along the periphery thereof. The second main surface of the semiconductor wafer is bonded to a pressure sensitive adhesive sheet thereby holding the device semiconductor wafer by way of the pressure sensitive adhesive sheet to a dicing frame in a state where the insulation film pattern is present.
摘要翻译：半导体器件si通过在具有第一想法的半导体晶片的第一主表面上形成第一金属膜，对半导体晶片的第二主表面进行反向磨削，从而形成比第一厚度薄的第二厚度，并形成绝缘膜图案具有第一绝缘膜，并且沿其周边在第二主表面上沿着半导体晶片的第二主表面的周边包含环形绝缘膜图案。将半导体晶片的第二主表面粘合到压敏粘合片上，从而在存在绝缘膜图案的状态下通过压敏粘合片将器件半导体晶片保持在切割框架上。

9. 发明申请

US20110212609A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：US20110212609A1
公开(公告)日：2011-09-01
申请号：US13102666
申请日：2011-05-06
申请人： Hidekazu Okuda , Haruo Amada , Taizo Hashimoto
发明人： Hidekazu Okuda , Haruo Amada , Taizo Hashimoto
IPC分类号： H01L21/265
CPC分类号： H01L29/7397 , H01L21/6835 , H01L24/11 , H01L24/29 , H01L24/73 , H01L24/81 , H01L2221/6834 , H01L2224/0401 , H01L2224/04026 , H01L2224/05124 , H01L2224/05155 , H01L2224/05166 , H01L2224/05184 , H01L2224/05644 , H01L2224/13099 , H01L2224/16 , H01L2224/29111 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/181 , H01L2924/01014 , H01L2924/0105 , H01L2924/3512 , H01L2924/00 , H01L2224/29099 , H01L2924/00012 , H01L2924/00014 , H01L2924/013
摘要： Provided is a technology capable of improving a production yield of a semiconductor device having, for example, IGBG as a semiconductor element. After formation of an interconnect on the surface side of a semiconductor substrate, a supporting substrate covering the interconnect is bonded onto the interconnect. Then, a BG tape is overlapped and bonded onto the supporting substrate and the semiconductor substrate is ground from the backside. The BG tape is then peeled off and an impurity is introduced into the backside of the semiconductor substrate by ion implantation. Then, the supporting substrate is peeled off, followed by heat treatment of the semiconductor substrate.
摘要翻译：提供了能够提高具有例如作为半导体元件的IGBG的半导体器件的制造成品率的技术。在半导体衬底的表面侧上形成互连后，覆盖互连的支撑衬底接合到互连上。然后，将BG带重叠并接合到支撑基板上，并且半导体基板从背面研磨。然后将BG带剥离，通过离子注入将杂质引入半导体衬底的背面。然后，将支撑基板剥离，然后对半导体基板进行热处理。

10. 发明授权

US07977165B2 Method of manufacturing a semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US07977165B2
公开(公告)日：2011-07-12
申请号：US12644376
申请日：2009-12-22
申请人： Hidekazu Okuda , Haruo Amada , Taizo Hashimoto
发明人： Hidekazu Okuda , Haruo Amada , Taizo Hashimoto
IPC分类号： H01L21/332
CPC分类号： H01L29/7397 , H01L21/6835 , H01L24/11 , H01L24/29 , H01L24/73 , H01L24/81 , H01L2221/6834 , H01L2224/0401 , H01L2224/04026 , H01L2224/05124 , H01L2224/05155 , H01L2224/05166 , H01L2224/05184 , H01L2224/05644 , H01L2224/13099 , H01L2224/16 , H01L2224/29111 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/181 , H01L2924/01014 , H01L2924/0105 , H01L2924/3512 , H01L2924/00 , H01L2224/29099 , H01L2924/00012 , H01L2924/00014 , H01L2924/013
摘要： Provided is a technology capable of improving a production yield of a semiconductor device having, for example, IGBG as a semiconductor element. After formation of an interconnect on the surface side of a semiconductor substrate, a supporting substrate covering the interconnect is bonded onto the interconnect. Then, a BG tape is overlapped and bonded onto the supporting substrate and the semiconductor substrate is ground from the backside. The BG tape is then peeled off and an impurity is introduced into the backside of the semiconductor substrate by ion implantation. Then, the supporting substrate is peeled off, followed by heat treatment of the semiconductor substrate.
摘要翻译：提供了能够提高具有例如作为半导体元件的IGBG的半导体器件的制造成品率的技术。在半导体衬底的表面侧上形成互连后，覆盖互连的支撑衬底接合到互连上。然后，将BG带重叠并接合到支撑基板上，并且半导体基板从背面研磨。然后将BG带剥离，通过离子注入将杂质引入半导体衬底的背面。然后，将支撑基板剥离，然后对半导体基板进行热处理。

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