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    • 2. 发明授权
    • Clathrate compounds and manufacturing method thereof
    • 包合物及其制造方法
    • US06461581B1
    • 2002-10-08
    • US09631176
    • 2000-08-02
    • Haruki EguchiAkihiko SuzukiSatoshi TakahashiKaoru MiyaharaTohru TanakaShigemitsu KiharaKazuo Tsumuraya
    • Haruki EguchiAkihiko SuzukiSatoshi TakahashiKaoru MiyaharaTohru TanakaShigemitsu KiharaKazuo Tsumuraya
    • C01B3100
    • H01L35/14C01B33/06Y02P20/129Y02P20/13
    • The present invention provides a clathrate compound which can be used as a thermoelectric material, a hard material, or a semiconductor material. Silicon or carbon are formed into a clathrate lattice, and a clathrate compound is then formed in which specified doping atoms are encapsulated within the clathrate lattice, and a portion of the atoms of the clathrate lattice are substituted with specified substitution atoms. The clathrate lattice is, for example, a silicon clathrate 34 (Si34) mixed lattice of a Si20 cluster including a dodecahedron of Si atoms, and a Si28 cluster including a hexahedron of Si atoms. Suitable doping atoms are atoms from group 1A, group 2A, group 3A, group 1B, group 2B, group 3B, group 4A, group 5A, group 6A, and group 8, and suitable substitution atoms are atoms from group 1A, group 2A, group 3A, group 1B, group 2B, group 3B, group 5A, group 6A, group 7A, group 5B, group 6B, group 7B, and group 8 of the periodic table. Suitable manufacturing methods include melt methods and sintering methods, and moreover intercalant intercalation compounds or the like may also be used as raw materials.
    • 本发明提供可用作热电材料,硬质材料或半导体材料的包合物。 硅或碳形成包合物晶格,然后形成包合物化合物,其中特定的掺杂原子被包封在包合物晶格内,并且包合物晶格的一部分原子被指定的取代原子取代。 包合物晶格是例如包含Si原子的十二面体的Si 20簇的硅包合物34(Si34)混合晶格和包含Si原子的六面体的Si28簇。 合适的掺杂原子是1A组,2A组,3A组,1B组,2B组,3B组,4A组,5A组,6A组和8组的原子,合适的取代原子是来自1A组,2A组, 3A组,1B组,2B组,3B组,5A组,6A组,7A组,5B组,6B组,7B组和8周期。 合适的制造方法包括熔融法和烧结方法,而且插入剂插层化合物等也可以用作原料。