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1. 发明授权

US06207789B1 Phenolic resin, resin composition, molding material for encapsulation, and electronic component device 失效
标题翻译：酚醛树脂，树脂组合物，用于封装的成型材料和电子部件装置
公开(公告)号：US06207789B1
公开(公告)日：2001-03-27
申请号：US09445275
申请日：2000-02-23
申请人： Haruaki Sue , Shinsuke Hagiwara , Fumio Furusawa , Seiichi Akagi , Kazuyoshi Tendo
发明人： Haruaki Sue , Shinsuke Hagiwara , Fumio Furusawa , Seiichi Akagi , Kazuyoshi Tendo
IPC分类号： C08G1404
CPC分类号： C08G8/24 , C08G8/08 , C08G8/10 , H01B3/36 , H01L23/293 , H01L24/45 , H01L2224/29339 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides a resin containing in the backbone chain a structural unit represented by the following Formula (I) or (II), as a novel phenolic resin having a high Tg, a low moisture absorption, a low molding shrinkage, high adhesive properties and high flow properties. The present invention also provides a resin composition and a molding material each containing the above resin, and an electronic component device having a device element encapsulated with it.
摘要翻译：本发明提供一种在主链中含有由下式（I）或（II）表示的结构单元的树脂，作为具有高Tg，低吸湿性，低成型收缩率，高粘合性的新型酚醛树脂和高流动性。本发明还提供了各自含有上述树脂的树脂组合物和成型材料，以及具有被封装的器件元件的电子部件器件。

2. 发明授权

US06713589B2 Phenyl, naphthly or fluorene cyclopentyl epoxy resins 失效
标题翻译：苯基，萘或芴环戊基环氧树脂
公开(公告)号：US06713589B2
公开(公告)日：2004-03-30
申请号：US09986630
申请日：2001-11-09
申请人： Haruaki Sue , Shinsuke Hagiwara , Fumio Furusawa , Seiichi Akagi , Akihiro Kobayashi , Hideki Yokoyama
发明人： Haruaki Sue , Shinsuke Hagiwara , Fumio Furusawa , Seiichi Akagi , Akihiro Kobayashi , Hideki Yokoyama
IPC分类号： C07D30128
CPC分类号： C08G59/3218 , C07C39/17 , C07C2601/08 , C08G59/24 , C08L63/00 , H01L23/293 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1301 , H01L2924/00014 , H01L2924/00
摘要： This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorption, high adhesion and fluidity which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar1 and Ar2 are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.
摘要翻译：本发明提供一种适合作为电子器件的封装材料的化合物，其具有高Tg，低吸湿性，高粘附性和流动性，它是式（I）表示的环戊烯化合物及其由式（III）表示的中间体环戊烯基化合物，。在该式中，m为0以上，Ar 1和Ar 2分别为酚残基，萘酚残基或芴衍生物残基，各自含有羟基或缩水甘油氧基。

3. 发明授权

US06329492B1 Phenyl, naphthyl or fluorene cyclopentyl epoxy resins 失效
标题翻译：苯基，萘基或芴环戊基环氧树脂
公开(公告)号：US06329492B1
公开(公告)日：2001-12-11
申请号：US09319487
申请日：1999-08-13
申请人： Haruaki Sue , Shinsuke Hagiwara , Fumio Furusawa , Seiichi Akagi , Akihiro Kobayashi , Hideki Yokoyama
发明人： Haruaki Sue , Shinsuke Hagiwara , Fumio Furusawa , Seiichi Akagi , Akihiro Kobayashi , Hideki Yokoyama
IPC分类号： C08G5906
CPC分类号： C08G59/3218 , C07C39/17 , C07C2601/08 , C08G59/24 , C08L63/00 , H01L23/293 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1301 , H01L2924/00014 , H01L2924/00
摘要： This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorptive, high adhesion and rich fluidity, which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar1 and Ar2 are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.
摘要翻译：本发明提供一种适合作为电子器件的封装材料的化合物，其具有高Tg，低吸水性，高粘附性和较高的流动性，其为由式（I）表示的环戊烯化合物及其由式（I）表示的中间体环戊烯基化合物 III）。在该式中，m为0以上，Ar 1和Ar 2分别为酚残基，萘酚残基或芴衍生物残基，各自含有羟基或缩水甘油氧基。

4. 发明申请

US20080039556A1 Encapsulated Epoxy-Resin Molding Compound, And Electronic Component Device 审中-公开
标题翻译：封装环氧树脂成型复合物和电子元件装置
公开(公告)号：US20080039556A1
公开(公告)日：2008-02-14
申请号：US11572155
申请日：2005-07-12
申请人： Ryoichi Ikezawa , Hidetaka Yoshizawa , Seiichi Akagi
发明人： Ryoichi Ikezawa , Hidetaka Yoshizawa , Seiichi Akagi
IPC分类号： C08L63/00 , C08K9/02
CPC分类号： C08L63/00 , C08G59/1483 , C08G59/621 , C08K9/02
摘要： The present invention relates to an encapsulated epoxy-resin molding compound, comprising an epoxy resin (A), a hardening agent (B), and magnesium hydroxide (C), wherein the magnesium hydroxide (C) contains magnesium hydroxide coated with silica, and provides a non-halogenated and non-antimony encapsulated epoxy-resin molding compound superior in flame resistance moldability and also in reliability such as reflow resistance, moisture resistance, high-temperature storage stability, and thus, favorable for sealing VLSI, and an electronic component device carrying an element sealed with the molding compound.
摘要翻译：本发明涉及包含环氧树脂（A），硬化剂（B）和氢氧化镁（C）的包封的环氧树脂模塑料，其中氢氧化镁（C）含有用二氧化硅涂覆的氢氧化镁，以及提供了耐火成型性优异的非卤化和非锑封装的环氧树脂模塑料，以及耐回流性，耐湿性，高温储存稳定性等可靠性，因此有利于密封VLSI，电子部件携带用模塑料密封的元件的装置。

5. 发明授权

US07846998B2 Sealant epoxy-resin molding material, and electronic component device 有权
标题翻译：密封胶环氧树脂成型材料和电子部件装置
公开(公告)号：US07846998B2
公开(公告)日：2010-12-07
申请号：US10598515
申请日：2005-03-03
申请人： Seiichi Akagi , Mitsuo Katayose , Takatoshi Ikeuchi , Yoshinori Endou , Ryouichi Ikezawa
发明人： Seiichi Akagi , Mitsuo Katayose , Takatoshi Ikeuchi , Yoshinori Endou , Ryouichi Ikezawa
IPC分类号： C03C25/26 , C08G59/38 , C08K5/00
CPC分类号： H01L23/295 , C08G59/245 , C08G59/621 , C08K5/1515 , C08K5/49 , C08K5/544 , C08L2666/28 , C09J163/00 , H01L23/296 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B). The epoxy resin (A) contains a compound represented by the general formula (I) below. The encapsulation epoxy resin material has excellent reliability in flame retardance, formability, reflow resistance, moisture resistance, high-temperature shelf characteristics and the like, and is suitably used for encapsulation of a VLSI. Also disclosed is an electronic component comprising an element encapsulated with such a material. (I) (In the general formula (I), R1s may be the same or different and respectively represent one selected from substituted or unsubstituted hydrocarbon groups having 1-12 carbon atoms and substituted or unsubstituted alkoxy groups having 1-12 carbon atoms; n represents an integer of 0-4; R2s may be the same or different and respectively represent one selected from substituted or unsubstituted hydrocarbon groups having 1-12 carbon atoms and substituted or unsubstituted alkoxy groups having 1-12 carbon atoms; and m represents an integer of 0-6.)
摘要翻译：公开了含有环氧树脂（A）和固化剂（B）的包封环氧树脂材料。环氧树脂（A）含有下述通式（I）表示的化合物。封装环氧树脂材料在阻燃性，成形性，耐回流性，耐湿性，高温搁架特性等方面具有优异的可靠性，并且适合用于VLSI的封装。还公开了一种电子部件，其包括用这种材料封装的元件。（I）（通式（I）中，R 1可以相同或不同，分别表示选自具有1-12个碳原子的取代或未取代的烃基和具有1-12个碳原子的取代或未取代的烷氧基的一个; n 表示0-4的整数; R 2可以相同或不同，分别表示选自具有1-12个碳原子的取代或未取代的烃基和具有1-12个碳原子的取代或未取代的烷氧基的一个; m表示整数的0-6。）

6. 发明申请

US20090143511A1 ENCAPSULATED EPOXY-RESIN MOLDING COMPOUND, AND ELECTRONIC COMPONENT DEVICE 审中-公开
标题翻译：包封环氧树脂模塑料和电子元件装置
公开(公告)号：US20090143511A1
公开(公告)日：2009-06-04
申请号：US11572162
申请日：2005-07-12
申请人： Ryoichi Ikezawa , Hidetaka Yoshizawa , Seiichi Akagi
发明人： Ryoichi Ikezawa , Hidetaka Yoshizawa , Seiichi Akagi
IPC分类号： C08K5/523 , C08K3/22 , C08K5/098
CPC分类号： C08L63/00 , C08G59/621 , C08K3/22 , C08K5/523 , H01L23/295 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： The present invention relates to an encapsulated epoxy-resin molding compound, comprising an epoxy resin (A), a hardening agent (B), and magnesium hydroxide (C), wherein the magnesium hydroxide (C) has a [101]/[001] peak intensity ratio of 0.9 or more as determined by X-ray diffraction, a BET specific surface area of 1 to 4 m2/g, and an average particle diameter of 5 μm or less, and provides an encapsulated epoxy-resin molding compound superior in flame resistance moldability and also in reliability such as reflow resistance, moisture resistance, high-temperature storage stability, and thus, favorable for sealing VLSI, and an electronic component device carrying an element sealed with the molding compound.
摘要翻译：本发明涉及包含环氧树脂（A），硬化剂（B）和氢氧化镁（C）的包封的环氧树脂模塑料，其中氢氧化钙（C）具有[101] / [001 ]峰强度比为0.9以上，通过X射线衍射测定，BET比表面积为1〜4m 2 / g，平均粒径为5μm以下，并且提供了包封的环氧树脂模塑料耐燃性成型性以及耐回流性，耐湿性，高温保存稳定性等的可靠性，有利于密封VLSI的电子部件装置以及携带用模塑料密封的元件的电子部件装置。

7. 发明申请

US20090062430A1 Epoxy Resin Composition for Sealing and Electronic Component Device 审中-公开
标题翻译：密封用环氧树脂组合物及电子元器件
公开(公告)号：US20090062430A1
公开(公告)日：2009-03-05
申请号：US12097319
申请日：2006-12-07
申请人： Ryoichi Ikezawa , Seiichi Akagi
发明人： Ryoichi Ikezawa , Seiichi Akagi
IPC分类号： C08G59/62
CPC分类号： H01L23/293 , C08G59/621 , C08G59/688 , C08L63/00 , H01L2924/0002 , H01L2924/09701 , C08L2666/22 , H01L2924/00
摘要： The invention relates to an epoxy resin composition for sealing comprising (A) an epoxy resin, and (B) a curing agent, wherein the following is comprised as the curing agent (B): (C) a compound or compounds represented by the following general formula (I) in which n is or n's are each an integer of 1 to 10, and m is or m's are each an integer of 1 to 10: wherein R1 is selected from a hydrogen atom and substituted or unsubstituted monovalent hydrocarbon groups having 1 to 10 carbon atoms, and R2 is selected from a hydrogen atom and substituted or unsubstituted monovalent hydrocarbon groups having 1 to 10 carbon atoms. This makes it possible to provide a halogen-free and antimony-free epoxy resin composition for sealing which is good in flame retardancy without lowering reliabilities, such as moldability, reflow resistance, humidity resistance and high-temperature-standing property, and an electron component device equipped with an element sealed with this composition.
摘要翻译：本发明涉及一种用于密封的环氧树脂组合物，其包含（A）环氧树脂和（B）固化剂，其中作为固化剂（B）包含以下物质：（C）以下化合物或化合物 n为n或n的通式（I）各自为1〜10的整数，m为或m'为1〜10的整数，式中，R 1选自氢原子，取代或未取代的一价烃基， 1〜10个碳原子，R2选自氢原子和取代或未取代的碳原子数为1〜10的一价烃基。这使得可以提供一种无卤阻燃的环氧树脂组合物，它具有良好的阻燃性，而不降低可塑性，耐回流性，耐湿性和高温保持性等可靠性，并且可以提供电子成分装备有用该组合物密封的元件的装置。

8. 发明申请

US20090137717A1 ENCAPSULATED EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE 审中-公开
标题翻译：包封环氧树脂组合物和电子元件装置
公开(公告)号：US20090137717A1
公开(公告)日：2009-05-28
申请号：US11995372
申请日：2006-07-13
申请人： Ryoichi Ikezawa , Hidetaka Yoshizawa , Seiichi Akagi
发明人： Ryoichi Ikezawa , Hidetaka Yoshizawa , Seiichi Akagi
IPC分类号： C08K3/22
CPC分类号： C08L63/00 , C08K3/22 , H01L23/293 , H01L23/295 , H01L2924/0002 , H01L2924/09701 , H01L2924/19041 , H01L2924/19043 , H01L2924/00
摘要： The present invention relates to an encapsulated epoxy resin composition containing an epoxy resin (A), a hardening agent (B), and magnesium hydroxide (C), the magnesium hydroxide (C) comprising magnesium hydroxide particles with its crystal appearance in a hexagonal column shape having two hexagonal top and bottom base faces in parallel with each other and six peripheral prism faces formed between the base faces and having a length in the c-axis direction of 1.5×10−6 to 6.0×10−6 m, and provides an encapsulated epoxy resin composition favorable as a sealer for VLSI's that is superior in flame resistance and also in reliability such as moldability, reflow resistance, moisture resistance and high temperature storage characteristics and an electronic component device containing an element sealed with the composition.
摘要翻译：本发明涉及包含环氧树脂（A），硬化剂（B）和氢氧化镁（C）的包封的环氧树脂组合物，所述氢氧化镁（C）包含氢氧化镁颗粒，其晶体外观为六方柱具有彼此平行的两个六边形顶部和底部基面的形状，以及形成在基面之间并且在c轴方向上的长度为1.5×10 -6至6.0×10 -6 m的六个圆周棱镜面，并且提供了封装环氧树脂组合物作为具有优异的阻燃性以及成型性，耐回流性，耐湿性和高温储存特性等可靠性的VLSI的密封剂，以及包含用该组合物密封的元素的电子部件装置。

9. 发明申请

US20080234409A1 Sealant Epoxy-Resin Molding Material, and Electronic Component Device 有权
标题翻译：密封胶环氧树脂成型材料和电子元件装置
公开(公告)号：US20080234409A1
公开(公告)日：2008-09-25
申请号：US10598515
申请日：2005-03-03
申请人： Seiichi Akagi , Mitsuo Katayose , Takatoshi Ikeuchi , Yoshinori Endou , Ryouichi Ikezawa
发明人： Seiichi Akagi , Mitsuo Katayose , Takatoshi Ikeuchi , Yoshinori Endou , Ryouichi Ikezawa
IPC分类号： C08L63/00
CPC分类号： H01L23/295 , C08G59/245 , C08G59/621 , C08K5/1515 , C08K5/49 , C08K5/544 , C08L2666/28 , C09J163/00 , H01L23/296 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B). The epoxy resin (A) contains a compound represented by the general formula (I) below. The encapsulation epoxy resin material has excellent reliability in flame retardance, formability, reflow resistance, moisture resistance, high-temperature shelf characteristics and the like, and is suitably used for encapsulation of a VLSI. Also disclosed is an electronic component comprising an element encapsulated with such a material. (I) (In the general formula (I), R1s may be the same or different and respectively represent one selected from substituted or unsubstituted hydrocarbon groups having 1-12 carbon atoms and substituted or unsubstituted alkoxy groups having 1-12 carbon atoms; n represents an integer of 0-4; R2s may be the same or different and respectively represent one selected from substituted or unsubstituted hydrocarbon groups having 1-12 carbon atoms and substituted or unsubstituted alkoxy groups having 1-12 carbon atoms; and m represents an integer of 0-6.)
摘要翻译：公开了含有环氧树脂（A）和固化剂（B）的包封环氧树脂材料。环氧树脂（A）含有下述通式（I）表示的化合物。封装环氧树脂材料在阻燃性，成形性，耐回流性，耐湿性，高温搁架特性等方面具有优异的可靠性，并且适合用于VLSI的封装。还公开了一种电子部件，其包括用这种材料封装的元件。（I）（通式（I）中，R 1可以相同或不同，分别表示选自具有1-12个碳原子的取代或未取代的烃基和取代或未取代的烷氧基具有1-12个碳原子的基团; n表示0-4的整数; R 2可以相同或不同，分别表示选自具有1-12个碳原子的取代或未取代的烃基中的一个和具有1-12个碳原子的取代或未取代的烷氧基; m表示0-6的整数。）

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