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    • 2. 发明授权
    • Methods for improving zero dislocation yield of single crystals
    • 改善单晶零位错产量的方法
    • US5980629A
    • 1999-11-09
    • US490473
    • 1995-06-14
    • Richard L. HansenLarry E. DrafallRobert M. McCutchanJohn D. HolderLeon A. AllenRobert D. Shelley
    • Richard L. HansenLarry E. DrafallRobert M. McCutchanJohn D. HolderLeon A. AllenRobert D. Shelley
    • C03B20/00C30B15/10C30B29/06C30B35/00C30B15/20
    • C30B15/10C30B35/002Y10T117/10
    • A method of reinforcing a crucible for the containment of molten semiconductor material in a Czochralski process, and of inhibiting formation of dislocations within a single crystal grown by the process. The crucible includes a body of vitreous silica having a bottom wall and a sidewall formation extending up from the bottom wall and defining a cavity for holding the molten semiconductor material. The sidewall formation and bottom wall each have an inner and an outer surface. A first devitrification promoter is deposited on the inner surface of the sidewall formation at a temperature below about 600.degree. C. The deposit is such that, when the crucible is heated above 600.degree. C., a first layer of substantially devitrified silica forms on the inner surface which is capable of promoting substantially uniform dissolution of the inner surface and reducing the release of crystalline silica particulates into the molten semiconductor material as a crystal is pulled from the molten semiconductor material. A second devitrification promoter is deposited on the outer surface of the sidewall formation at a temperature below about 600.degree. C. The deposit is such that, when the crucible is heated above 600.degree. C., a second layer of substantially devitrified silica forms on the outer surface which is capable of reinforcing the vitreous silica body.
    • 一种在切克劳斯基法中增强用于容纳熔融半导体材料的坩埚的方法,以及抑制通过该方法生长的单晶内的位错形成。 坩埚包括具有底壁和从底壁向上延伸并限定用于保持熔融半导体材料的空腔的玻璃体二氧化硅体。 侧壁形成和底壁各自具有内表面和外表面。 在低于约600℃的温度下,第一反玻璃化助催化剂沉积在侧壁结构的内表面上。沉积物使得当坩埚被加热至高于600℃时,第一层基本上失透的二氧化硅形成在 内表面能够促进内表面的基本上均匀的溶解,并且当从熔融半导体材料中拉出晶体时,减少结晶二氧化硅微粒释放到熔融半导体材料中。 在低于约600℃的温度下,第二失透促进剂沉积在侧壁结构的外表面上。沉积物使得当坩埚被加热到600℃以上时,在第二层基本上失透的二氧化硅 能够增强二氧化硅玻璃体的外表面。
    • 4. 发明授权
    • Surface-treated crucibles for improved zero dislocation performance
    • 经表面处理的坩埚可提高零位错性能
    • US5976247A
    • 1999-11-02
    • US490465
    • 1995-06-14
    • Richard L. HansenLarry E. DrafallRobert M. McCutchanJohn D. HolderLeon A. AllenRobert D. Shelley
    • Richard L. HansenLarry E. DrafallRobert M. McCutchanJohn D. HolderLeon A. AllenRobert D. Shelley
    • C30B29/06C03C17/02C03C17/34C30B15/10C30B35/00
    • C03C17/3417C03C17/02C30B15/10C30B35/002C03C2217/213Y10S65/08Y10T117/10Y10T117/1052
    • A crucible in which a semiconductor material is melted and held during a crystal growing process. The crucible includes a body of vitreous silica having a bottom wall and a sidewall formation extending up from the bottom wall and defining a cavity for holding the molten semiconductor material. The sidewall formation has an inner and an outer surface. A first devitrification promoter on the inner surface of the sidewall formation is distributed such that a first layer of substantially devitrified silica is formed on the inner surface of the crucible which is in contact with the molten semiconductor material when the semiconductor material is melted in the crucible during the crystal growing process. A second devitrification promoter on the outer surface of the sidewall formation is distributed such that a second layer of substantially devitrified silica is formed on the outer surface of the crucible when the semiconductor material is melted in the crucible during the crystal growing process. The first substantially devitrified silica layer is such that it promotes uniform dissolution of the inner surface and in so doing significantly reduces the release of crystalline silica particulates into the molten semiconductor material as a crystal is pulled from the molten semiconductor material. The second substantially devitrified silica layer is such that it reinforces the vitreous silica body.
    • 坩埚,其中半导体材料在晶体生长过程中被熔化和保持。 坩埚包括具有底壁和从底壁向上延伸并限定用于保持熔融半导体材料的空腔的玻璃体二氧化硅体。 侧壁形成具有内表面和外表面。 分布在侧壁结构的内表面上的第一失透促进剂,使得当半导体材料在坩埚中熔化时,在与熔融半导体材料接触的坩埚的内表面上形成基本上失透的二氧化硅的第一层 在晶体生长过程中。 分布在侧壁形状的外表面上的第二失透促进剂,使得当晶体生长过程中半导体材料在坩埚中熔化时,在坩埚的外表面上形成第二层基本上失透的二氧化硅。 第一基本上反玻璃化的二氧化硅层是促进内表面的均匀溶解,并且在这样做时,晶体从熔融半导体材料中拉出时,显着地减少了结晶二氧化硅微粒释放到熔融半导体材料中。 第二基本上反玻璃化的二氧化硅层使得它增强了二氧化硅玻璃体。