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    • 1. 发明授权
    • Heat dissipating assembly having a fan duct
    • 具有风扇导管的散热组件
    • US07663882B2
    • 2010-02-16
    • US11959272
    • 2007-12-18
    • Hao LiTao LiJun Zhang
    • Hao LiTao LiJun Zhang
    • H05K7/20
    • H01L23/467H01L23/4006H01L23/427H01L2924/0002H01L2924/00
    • A heat dissipating assembly for dissipating heat from a graphic card and a hard disk driver (30), includes a heat sink (10) for contacting the graphic card and a fan duct (20) fixed on the heat sink. The fan duct is made by bending a planar metal plate and has a first portion soldered to a top face of the heat sink and a second portion slantwise and upwardly extending from the first portion. When a fan (40) generates an airflow towards the heat sink, a part of the airflow flows through the heat sink to remove heat in the heat sink, and another part of the airflow is guided slantwise and upwardly by the second portion of the fan duct to flow through the hard disk driver, thereby to cool the hard driver.
    • 一种用于从图形卡和硬盘驱动器(30)散热的散热组件,包括用于接触图形卡的散热片(10)和固定在散热片上的风扇导管(20)。 风扇管道是通过弯曲平面金属板制成的,并且具有焊接到散热器的顶面的第一部分和从第一部分倾斜向上延伸的第二部分。 当风扇(40)朝向散热器产生气流时,一部分气流流过散热器以去除散热器中的热量,另一部分气流被风扇的第二部分倾斜向上引导 管道流过硬盘驱动器,从而冷却硬盘驱动器。
    • 2. 发明授权
    • Heat dissipation device having a back plate unit
    • 具有背板单元的散热装置
    • US07903419B2
    • 2011-03-08
    • US11845735
    • 2007-08-27
    • Hao LiJun LongTao Li
    • Hao LiJun LongTao Li
    • H05K7/20H01L23/34F28F7/00
    • H01L23/4093H01L23/40H01L2023/4081H01L2023/4087H01L2924/0002Y10T24/44026Y10T24/44034Y10T24/44556H01L2924/00
    • A heat dissipation device for dissipating heat from an electronic component (12) mounted on a printed circuit board (10) includes a retention module (30) resting on the printed circuit board, a heat sink (20) disposed on the retention module for contacting the electronic component, a clip (40) for securing the heat sink to the retention module, and a back plate unit mounted below the printed circuit board for engaging with the retention module and supporting the electronic component. The back plate unit includes a back plate (50), a gasket (62) engaging with the back plate, and a bracket (64) being sandwiched between the gasket and the back plate. The gasket has an annular top face contacting the printed circuit board, and a plurality of blocks (6202) contacting the back plate, whereby the gasket can provide a sufficient and uniform support to the electronic component.
    • 一种用于从安装在印刷电路板(10)上的电子部件(12)散热的散热装置,包括搁置在印刷电路板上的保持模块(30),设置在保持模块上的散热片(20) 电子部件,用于将散热器固定到保持模块的夹子(40),以及安装在印刷电路板下方的用于与保持模块接合并支撑电子部件的背板单元。 背板单元包括背板(50),与背板接合的垫圈(62)和夹在垫圈和背板之间的托架(64)。 垫圈具有接触印刷电路板的环形顶面和与背板接触的多个块(6202),由此垫圈可以向电子部件提供足够且均匀的支撑。
    • 3. 发明申请
    • Heat Dissipation device
    • 散热装置
    • US20080049397A1
    • 2008-02-28
    • US11309905
    • 2006-10-26
    • Jun LongHao LiTao Li
    • Jun LongHao LiTao Li
    • H05K7/20
    • H01L23/467H01L23/4093H01L2924/0002H01L2924/00
    • A heat dissipation device for an electronic unit includes a heat sink (10), a pair of fan holders (30, 40) and a fan (50) mounted on the heat sink via the fan holders. The heat sink includes a base (11) with a plurality of fins (15) extending upwardly therefrom along a lateral direction thereof. The base forms a pair of lateral walls at two opposite lateral sides thereof. The fins are sandwiched between the lateral walls. A pair of supporting plates (17) extend from the lateral walls for mounting the fan holders on the heat sink. The fan holders cooperate with the lateral walls of the heat sink to encompass a top of the fins to prevent airflow generated by the fan from escaping from the top of the fins.
    • 一种用于电子单元的散热装置包括散热片(10),一对风扇支架(30,40)和通过风扇支架安装在散热器上的风扇(50)。 散热器包括具有从其沿其横向方向向上延伸的多个翅片(15)的基座(11)。 底座在其两个相对的侧面形成一对侧壁。 翅片夹在两侧壁之间。 一对支撑板(17)从侧壁延伸,用于将风扇支架安装在散热器上。 风扇支架与散热器的侧壁配合以包围散热片的顶部,以防止风扇产生的气流从散热片的顶部逸出。
    • 4. 发明授权
    • Heat dissipation device
    • 散热装置
    • US07382615B2
    • 2008-06-03
    • US11309905
    • 2006-10-26
    • Jun LongHao LiTao Li
    • Jun LongHao LiTao Li
    • H05K7/20
    • H01L23/467H01L23/4093H01L2924/0002H01L2924/00
    • A heat dissipation device for an electronic unit includes a heat sink (10), a pair of fan holders (30, 40) and a fan (50) mounted on the heat sink via the fan holders. The heat sink includes a base (11) with a plurality of fins (15) extending upwardly therefrom along a lateral direction thereof. The base forms a pair of lateral walls at two opposite lateral sides thereof. The fins are sandwiched between the lateral walls. A pair of supporting plates (17) extend from the lateral walls for mounting the fan holders on the heat sink. The fan holders cooperate with the lateral walls of the heat sink to encompass a top of the fins to prevent airflow generated by the fan from escaping from the top of the fins.
    • 一种用于电子单元的散热装置包括散热片(10),一对风扇支架(30,40)和通过风扇支架安装在散热器上的风扇(50)。 散热器包括具有从其沿其横向方向向上延伸的多个翅片(15)的基座(11)。 底座在其两个相对的侧面形成一对侧壁。 翅片夹在两侧壁之间。 一对支撑板(17)从侧壁延伸,用于将风扇支架安装在散热器上。 风扇支架与散热器的侧壁配合以包围散热片的顶部,以防止风扇产生的气流从散热片的顶部逸出。
    • 5. 发明申请
    • Heat dissipation device
    • 散热装置
    • US20080101018A1
    • 2008-05-01
    • US11309919
    • 2006-10-27
    • Jun LongHao LiTao Li
    • Jun LongHao LiTao Li
    • H05K7/20
    • H01L23/467H01L2924/0002H01L2924/00
    • A heat dissipation device includes a heat sink (10) in thermal contact with a first heat-generating electronic component. A fan duct (30) receives the heat sink therein and has an inlet (350) and an outlet (302) at opposite sides thereof. A fan (20) is mounted in the fan duct at the inlet. A portion of airflow generated by the fan flows through the heat sink to cool the first heat-generating electronic component. A shutter (31) is mounted on the fan duct. Another portion of the airflow generated by the fan flows through the shutter to blow a second heat-generating electronic component located beside the first heat-generating electronic component and outside the fan duct.
    • 散热装置包括与第一发热电子部件热接触的散热器(10)。 风扇管道(30)在其中容纳散热器,并且在其相对侧具有入口(350)和出口(302)。 风扇(20)安装在风扇导管的入口处。 由风扇产生的气流的一部分流过散热器以冷却第一发热电子部件。 风扇导管上安装有快门(31)。 由风扇产生的气流的另一部分流经活门,吹出位于第一发热电子元件旁边的第二个发热电子部件,并在风扇通道的外面。
    • 6. 发明授权
    • Heat sink assembly with a locking device
    • 带有锁定装置的散热器组件
    • US07746643B2
    • 2010-06-29
    • US11831930
    • 2007-07-31
    • Hao LiJun LongTao Li
    • Hao LiJun LongTao Li
    • H05K7/20H01L23/34H01L23/26A44B21/00
    • H01L23/4093H01L2924/0002Y10T24/44026Y10T24/44034H01L2924/00
    • A heat sink assembly includes a heat sink having a first shoulder and a second shoulder, and a locking device having a retention module, a first clip and a second clip. The first clip has two extension portions engaging with the retention module and a pressing portion between the two extension portions. The second clip comprises a pressing portion located on the second shoulder, an axle connecting with the pressing portion and pivotably engaging with the retention module and a locking portion connecting with the pressing portion. The second clip can rotate around the axle thereof when the heat sink assembly is in an unlocked position; the locking portion engages with the retention module and the pressing portion presses the second shoulder of the heat sink toward the retention module when the heat sink assembly is in a locked position.
    • 散热器组件包括具有第一肩部和第二肩部的散热器,以及具有保持模块,第一夹子和第二夹子的锁定装置。 第一夹子具有与保持模块接合的两个延伸部分和两个延伸部分之间的按压部分。 所述第二夹具包括位于所述第二肩部上的按压部,与所述按压部分连接并与所述保持模块可枢转地接合的轴和与所述按压部连接的锁定部。 当散热器组件处于解锁位置时,第二夹子可绕其轴线旋转; 当散热器组件处于锁定位置时,锁定部分与保持模块接合并且按压部分将散热器的第二肩部朝向保持模块按压。
    • 7. 发明授权
    • Heat dissipation device
    • 散热装置
    • US07495912B2
    • 2009-02-24
    • US11309919
    • 2006-10-27
    • Jun LongHao LiTao Li
    • Jun LongHao LiTao Li
    • H05K7/20F28F7/00
    • H01L23/467H01L2924/0002H01L2924/00
    • A heat dissipation device includes a heat sink (10) in thermal contact with a first heat-generating electronic component. A fan duct (30) receives the heat sink therein and has an inlet (350) and an outlet (302) at opposite sides thereof. A fan (20) is mounted in the fan duct at the inlet. A portion of airflow generated by the fan flows through the heat sink to cool the first heat-generating electronic component. A shutter (31) is mounted on the fan duct. Another portion of the airflow generated by the fan flows through the shutter to blow a second heat-generating electronic component located beside the first heat-generating electronic component and outside the fan duct.
    • 散热装置包括与第一发热电子部件热接触的散热器(10)。 风扇管道(30)在其中容纳散热器,并且在其相对侧具有入口(350)和出口(302)。 风扇(20)安装在风扇导管的入口处。 由风扇产生的气流的一部分流过散热器以冷却第一发热电子部件。 风扇导管上安装有快门(31)。 由风扇产生的气流的另一部分流经活门,吹出位于第一发热电子元件旁边的第二个发热电子部件,并在风扇通道的外面。