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1. 发明授权

US08446014B2 Integrated circuit interconnect structure 失效
标题翻译：集成电路互连结构
公开(公告)号：US08446014B2
公开(公告)日：2013-05-21
申请号：US13531008
申请日：2012-06-22
申请人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
发明人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
IPC分类号： H01L23/48
CPC分类号： H01L23/528 , H01L23/5286 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit (IC) interconnect structure that includes a first via positioned in a dielectric and coupled to a high current device at one end, and a buffer metal segment positioned in a dielectric and coupled to the first via at an opposite end thereof. The buffer metal segment includes a plurality of electrically insulating inter-dielectric (ILD) pads forming an ILD cheesing pattern thereon, to direct current. The IC interconnect structure further includes a second via positioned in a dielectric formed over the buffer metal segment and coupled to the buffer metal segment at one end and a metal power line formed in a dielectric and coupled to the second via at an opposite end thereof. The use of the ILD pads on the buffer metal segment enables a more even distribution of current along the metal power line.
摘要翻译：一种集成电路（IC）互连结构，其包括位于电介质中并且在一端耦合到高电流器件的第一通孔和位于电介质中的缓冲金属段，并在其相对端耦合到第一通孔。缓冲金属段包括在其上形成ILD干酪糖化图案的多个电绝缘介电层（ILD）焊盘以引导电流。 IC互连结构还包括位于介质上的第二通孔，该电介质形成在缓冲金属段上并且在一端耦合到缓冲金属段，并且金属电源线形成在电介质中，并在其相对端耦合到第二通孔。缓冲金属片段上的ILD焊盘的使用使得能够沿着金属电源线更均匀地分布电流。

2. 发明申请

US20120273966A1 INTEGRATED CIRCUIT INTERCONNECT STRUCTURE 失效
公开(公告)号：US20120273966A1
公开(公告)日：2012-11-01
申请号：US13531008
申请日：2012-06-22
申请人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
发明人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
IPC分类号： H01L23/48
CPC分类号： H01L23/528 , H01L23/5286 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit (IC) interconnect structure that includes a first via positioned in a dielectric and coupled to a high current device at one end, and a buffer metal segment positioned in a dielectric and coupled to the first via at an opposite end thereof. The buffer metal segment includes a plurality of electrically insulating inter-dielectric (ILD) pads forming an ILD cheesing pattern thereon, to direct current. The IC interconnect structure further includes a second via positioned in a dielectric formed over the buffer metal segment and coupled to the buffer metal segment at one end and a metal power line formed in a dielectric and coupled to the second via at an opposite end thereof. The use of the ILD pads on the buffer metal segment enables a more even distribution of current along the metal power line.

3. 发明申请

US20110254168A1 INTEGRATED CIRCUIT INTERCONNECT STRUCTURE 有权
标题翻译：集成电路互连结构
公开(公告)号：US20110254168A1
公开(公告)日：2011-10-20
申请号：US12760594
申请日：2010-04-15
申请人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
发明人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
IPC分类号： H01L23/522 , H01L21/768 , G06F17/50
CPC分类号： H01L23/528 , H01L23/5286 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit (IC) interconnect structure that includes a first via positioned in a dielectric and coupled to a high current device at one end, and a buffer metal segment positioned in a dielectric and coupled to the first via at an opposite end thereof. The buffer metal segment includes a plurality of electrically insulating inter-dielectric (ILD) pads forming an ILD cheesing pattern thereon, to direct current. The IC interconnect structure further includes a second via positioned in a dielectric formed over the buffer metal segment and coupled to the buffer metal segment at one end and a metal power line formed in a dielectric and coupled to the second via at an opposite end thereof. The use of the ILD pads on the buffer metal segment enables a more even distribution of current along the metal power line.
摘要翻译：一种集成电路（IC）互连结构，其包括位于电介质中并且在一端耦合到高电流器件的第一通孔和位于电介质中的缓冲金属段，并在其相对端耦合到第一通孔。缓冲金属段包括在其上形成ILD干酪糖化图案的多个电绝缘介电层（ILD）焊盘以引导电流。 IC互连结构还包括位于介质上的第二通孔，该电介质形成在缓冲金属段上并且在一端耦合到缓冲金属段，并且金属电源线形成在电介质中，并在其相对端耦合到第二通孔。缓冲金属片段上的ILD焊盘的使用使得能够沿着金属电源线更均匀地分布电流。

4. 发明授权

US08455351B2 Method of forming an integrated circuit interconnect structure 失效
标题翻译：形成集成电路互连结构的方法
公开(公告)号：US08455351B2
公开(公告)日：2013-06-04
申请号：US13531015
申请日：2012-06-22
申请人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
发明人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
IPC分类号： H01L21/768
CPC分类号： H01L23/528 , H01L23/5286 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit (IC) interconnect structure that includes a first via positioned in a dielectric and coupled to a high current device at one end, and a buffer metal segment positioned in a dielectric and coupled to the first via at an opposite end thereof. The buffer metal segment includes a plurality of electrically insulating inter-dielectric (ILD) pads forming an ILD cheesing pattern thereon, to direct current. The IC interconnect structure further includes a second via positioned in a dielectric formed over the buffer metal segment and coupled to the buffer metal segment at one end and a metal power line formed in a dielectric and coupled to the second via at an opposite end thereof. The use of the ILD pads on the buffer metal segment enables a more even distribution of current along the metal power line.
摘要翻译：一种集成电路（IC）互连结构，其包括位于电介质中并且在一端耦合到高电流器件的第一通孔和位于电介质中并且在其相对端处耦合到第一通孔的缓冲金属段。缓冲金属段包括在其上形成ILD干酪糖化图案的多个电绝缘介电层（ILD）焊盘以引导电流。 IC互连结构还包括位于介质上的第二通孔，该电介质形成在缓冲金属段上并且在一端耦合到缓冲金属段，并且金属电源线形成在电介质中，并在其相对端耦合到第二通孔。缓冲金属片段上的ILD焊盘的使用使得能够沿着金属电源线更均匀地分布电流。

5. 发明申请

US20120264289A1 INTEGRATED CIRCUIT INTERCONNECT STRUCTURE 失效
标题翻译：集成电路互连结构
公开(公告)号：US20120264289A1
公开(公告)日：2012-10-18
申请号：US13531015
申请日：2012-06-22
申请人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
发明人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
IPC分类号： H01L21/768
CPC分类号： H01L23/528 , H01L23/5286 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit (IC) interconnect structure that includes a first via positioned in a dielectric and coupled to a high current device at one end, and a buffer metal segment positioned in a dielectric and coupled to the first via at an opposite end thereof. The buffer metal segment includes a plurality of electrically insulating inter-dielectric (ILD) pads forming an ILD cheesing pattern thereon, to direct current. The IC interconnect structure further includes a second via positioned in a dielectric formed over the buffer metal segment and coupled to the buffer metal segment at one end and a metal power line formed in a dielectric and coupled to the second via at an opposite end thereof. The use of the ILD pads on the buffer metal segment enables a more even distribution of current along the metal power line.
摘要翻译：一种集成电路（IC）互连结构，其包括位于电介质中并且在一端耦合到高电流器件的第一通孔和位于电介质中的缓冲金属段，并在其相对端耦合到第一通孔。缓冲金属段包括在其上形成ILD干酪糖化图案的多个电绝缘介电层（ILD）焊盘以引导电流。 IC互连结构还包括位于介质上的第二通孔，该电介质形成在缓冲金属段上并且在一端耦合到缓冲金属段，并且金属电源线形成在电介质中，并在其相对端耦合到第二通孔。缓冲金属片段上的ILD焊盘的使用使得能够沿着金属电源线更均匀地分布电流。

6. 发明授权

US08237286B2 Integrated circuit interconnect structure 有权
标题翻译：集成电路互连结构
公开(公告)号：US08237286B2
公开(公告)日：2012-08-07
申请号：US12760594
申请日：2010-04-15
申请人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
发明人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
IPC分类号： H01L23/522
CPC分类号： H01L23/528 , H01L23/5286 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit (IC) interconnect structure that includes a first via positioned in a dielectric and coupled to a high current device at one end, and a buffer metal segment positioned in a dielectric and coupled to the first via at an opposite end thereof. The buffer metal segment includes a plurality of electrically insulating inter-dielectric (ILD) pads forming an ILD cheesing pattern thereon, to direct current. The IC interconnect structure further includes a second via positioned in a dielectric formed over the buffer metal segment and coupled to the buffer metal segment at one end and a metal power line formed in a dielectric and coupled to the second via at an opposite end thereof. The use of the ILD pads on the buffer metal segment enables a more even distribution of current along the metal power line.
摘要翻译：一种集成电路（IC）互连结构，其包括位于电介质中并且在一端耦合到高电流器件的第一通孔和位于电介质中的缓冲金属段，并在其相对端耦合到第一通孔。缓冲金属段包括在其上形成ILD干酪糖化图案的多个电绝缘介电层（ILD）焊盘以引导电流。 IC互连结构还包括位于介质上的第二通孔，该电介质形成在缓冲金属段上并且在一端耦合到缓冲金属段，并且金属电源线形成在电介质中，并在其相对端耦合到第二通孔。缓冲金属片段上的ILD焊盘的使用使得能够沿着金属电源线更均匀地分布电流。

7. 发明申请

US20100277210A1 THREE-DIMENSIONAL CHIP-STACK SYNCHRONIZATION 有权
标题翻译：三维芯片堆叠同步
公开(公告)号：US20100277210A1
公开(公告)日：2010-11-04
申请号：US12432801
申请日：2009-04-30
申请人： Ping-Chuan Wang , Anthony R. Bonaccio , Jong-Ru Guo , Louis Lu-Chen Hsu
发明人： Ping-Chuan Wang , Anthony R. Bonaccio , Jong-Ru Guo , Louis Lu-Chen Hsu
IPC分类号： H03L7/06
CPC分类号： H03L7/099 , H03L7/18 , H03L7/22
摘要： a central reference clock is placed in a substantially middle chip of a 3-D chip-stack. The central reference clock is distributed to each child chip of the 3-D chip-stack, so that a plurality of clocks is generated for each individual chip in the 3-D-stack in a synchronous manner. A predetermined number of through-silicon-vias and on-chip wires are employed to form a delay element for each slave clock, ensuring that the clock generated for each child chip is substantially synchronized. Optionally, an on-chip clock trimming circuit is embedded for further precision tuning to eliminate local clock skews.
摘要翻译：中心参考时钟被放置在3-D芯片堆叠的基本上中间的芯片中。中心参考时钟被分配给3-D芯片组的每个子芯片，从而以同步的方式为3-D堆叠中的每个芯片生成多个时钟。采用预定数量的通硅通孔和片上导线来形成每个从时钟的延迟元件，确保为每个子芯片生成的时钟基本上同步。可选地，嵌入式片上时钟微调电路用于进一步精确调谐以消除本地时钟偏移。

8. 发明申请

US20100327958A1 Leakage Current Mitigation in a Semiconductor Device 有权
标题翻译：半导体器件漏电流减轻
公开(公告)号：US20100327958A1
公开(公告)日：2010-12-30
申请号：US12494460
申请日：2009-06-30
申请人： Jong-Ru Guo , Louis Lu-Chen Hsu , Rajiv Vasant Joshi , Ping-Chuan Wang , Zhijian Yang
发明人： Jong-Ru Guo , Louis Lu-Chen Hsu , Rajiv Vasant Joshi , Ping-Chuan Wang , Zhijian Yang
IPC分类号： H03K3/01 , G01R31/26
CPC分类号： H03K17/0822
摘要： A dormant mode target semiconductor device within a leakage current target unit is identified for mitigating leakage current to prevent it from reaching catastrophic runaway. A leakage current shift monitor unit is electrically connected to the output node of the leakage current target unit and collects leakage current from the selected target semiconductor device for two consecutive predefined temporal periods and measures the difference between the collected leakage currents. A comparator receives and compares the outputs of the current shift monitor unit and a reference voltage generator. The comparator propagates an alert signal to the leakage current target unit when the leakage voltage output from the leakage current shift monitor unit exceeds the reference voltage, a condition that indicates that the leakage current is about to approach catastrophic runaway levels. This alert signal switches the target semiconductor device to an active mode for leakage mitigation, which includes a repair voltage from a repair voltage generator applied to the gate of the target semiconductor device.
摘要翻译：识别泄漏电流目标单元内的休眠模式目标半导体器件，以减轻漏电流，防止其达到灾难性的失控。泄漏电流移动监视器单元电连接到泄漏电流目标单元的输出节点，并在两个连续的预定义时间周期内从所选择的目标半导体器件收集泄漏电流，并测量所收集的漏电流之间的差异。比较器接收并比较当前移位监视器单元和参考电压发生器的输出。当从泄漏电流移动监视器单元输出的泄漏电压超过参考电压时，比较器将报警信号传播到泄漏电流目标单元，表示泄漏电流即将接近灾难性失控水平的条件。该警报信号将目标半导体器件切换到用于泄漏减轻的活动模式，其包括施加到目标半导体器件的栅极的修复电压发生器的修复电压。

9. 发明授权

US07863960B2 Three-dimensional chip-stack synchronization 有权
标题翻译：三维芯片堆栈同步
公开(公告)号：US07863960B2
公开(公告)日：2011-01-04
申请号：US12432801
申请日：2009-04-30
申请人： Ping-Chuan Wang , Anthony R. Bonaccio , Jong-Ru Guo , Louis Lu-Chen Hsu
发明人： Ping-Chuan Wang , Anthony R. Bonaccio , Jong-Ru Guo , Louis Lu-Chen Hsu
IPC分类号： G06F1/04
CPC分类号： H03L7/099 , H03L7/18 , H03L7/22
摘要： A central reference clock is placed in a substantially middle chip of a 3-D chip-stack. The central reference clock is distributed to each child chip of the 3-D chip-stack, so that a plurality of clocks is generated for each individual chip in the 3-D-stack in a synchronous manner. A predetermined number of through-silicon-vias and on-chip wires are employed to form a delay element for each slave clock, ensuring that the clock generated for each child chip is substantially synchronized. Optionally, an on-chip clock trimming circuit is embedded for further precision tuning to eliminate local clock skews.
摘要翻译：中心参考时钟被放置在3-D芯片堆叠的基本上中间的芯片中。中心参考时钟被分配给3-D芯片组的每个子芯片，从而以同步的方式为3-D堆叠中的每个芯片生成多个时钟。采用预定数量的通硅通孔和片上导线来形成每个从时钟的延迟元件，确保为每个子芯片生成的时钟基本上同步。可选地，嵌入式片上时钟微调电路用于进一步精确调谐以消除本地时钟偏移。

10. 发明授权

US07545161B2 Method and apparatus to measure threshold shifting of a MOSFET device and voltage difference between nodes 失效
标题翻译：测量MOSFET器件的阈值偏移和节点之间的电压差的方法和装置
公开(公告)号：US07545161B2
公开(公告)日：2009-06-09
申请号：US11832796
申请日：2007-08-02
申请人： Louis Hsu , Jong-Ru Guo , Ping-Chuan Wang , Zhijian Yang
发明人： Louis Hsu , Jong-Ru Guo , Ping-Chuan Wang , Zhijian Yang
IPC分类号： G01R31/02
CPC分类号： G01R31/2621
摘要： An on-chip circuit to quantitatively measure threshold voltage shifts of a MOSFET. The circuit includes a programmable Vt reference sensor; a programmable Vt monitoring sensor; and a comparator for receiving inputs from the reference and monitoring sensors providing an output flag signal. The shifting of the MOSFET device voltage threshold monitors process variations, geometry sensitivity, plasma damage, stress, and hot carriers and other device damages. The same circuit also measures voltage differences between any two nodes in an integrated circuit chip or wafer.
摘要翻译：用于定量测量MOSFET的阈值电压偏移的片上电路。该电路包括可编程Vt参考传感器; 可编程Vt监控传感器; 以及比较器，用于从提供输出标志信号的参考和监视传感器接收输入。 MOSFET器件电压阈值的偏移可以监视工艺变化，几何感应，等离子体损伤，应力和热载体以及其他器件损坏。相同的电路还测量集成电路芯片或晶片中的任何两个节点之间的电压差。

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