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    • 2. 发明授权
    • Field-effect transistor
    • 场效应晶体管
    • US06429457B1
    • 2002-08-06
    • US09380611
    • 1999-09-15
    • Rolf Magnus BerggrenBengt Goran GustafssonJohan Roger Axel Karlsson
    • Rolf Magnus BerggrenBengt Goran GustafssonJohan Roger Axel Karlsson
    • H01L2184
    • H01L51/0508H01L29/6675H01L29/66848H01L29/66916H01L29/7827H01L29/78642H01L29/8083
    • A field-effect transistor is made with electrodes (2, 4, 5) and isolators (3) in vertically provided layers, such that at least the electrodes (4, 5) and the isolators (3) form a step (6) oriented vertically relative to the first electrode (2) or the substrate (1). Implemented as a junction field-effect transistor (JFET) or a metal-oxide semiconducting field-effect transistor (MOSFET) the electrodes (2, 5) forming respectively the drain and source electrode of the field-effect transistor or vice versa and the electrode (4) the gate electrode of the field-effect transistor. Over the layers in the vertical step (6) an amorphous, polycrystalline or microcrystalline inorganic or organic semiconductor material is provided and forms the active semiconductor of the transistor contacting the gate electrode (8) directly or indirectly and forming a vertically oriented transistor channel (9) of the p or n type between the first (2) and the second (5) electrode. In a method for fabrication of a field effect transistor a vertical step (6) is formed by a means of a photolithographic process and a soluble amorphous active semiconductor material (8) is deposited over the first electrode (2) and the vertical step (6) such that a vertically oriented transistor channel between the drain and source electrode (2, 5) is obtained. In a JFET the semiconductor material (8) contacts the gate electrode (4) directly. In a MOSFET a vertically oriented gate isolator (7) is provided between the gate electrode (4) and the semiconductor material (8).
    • 在垂直设置的层中,用电极(2,4,5)和隔离器(3)制成场效应晶体管,使得至少电极(4,5)和隔离器(3)形成一个取向的步骤(6) 垂直于第一电极(2)或衬底(1)。 实现为场效应晶体管(JFET)或金属氧化物半导体场效应晶体管(MOSFET),分别形成场效应晶体管的漏极和源极的电极(2,5)和电极 (4)场效应晶体管的栅电极。 在垂直步骤(6)中的层上,提供非晶,多晶或微晶无机或有机半导体材料,并直接或间接地形成与栅电极(8)接触的晶体管的有源半导体,并形成垂直取向的晶体管沟道(9 )在第一(2)和第二(5)电极之间的p或n型。 在制造场效应晶体管的方法中,通过光刻工艺形成垂直步骤(6),并且在第一电极(2)和垂直步骤(6)上沉积可溶性非晶有源半导体材料(8) ),使得在漏极和源极(2,5)之间获得垂直取向的晶体管沟道。 在JFET中,半导体材料(8)直接接触栅电极(4)。 在MOSFET中,在栅电极(4)和半导体材料(8)之间提供垂直定向的栅极隔离器(7)。