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1. 发明授权

US08435896B2 Stable, concentratable chemical mechanical polishing composition and methods relating thereto 有权
标题翻译：稳定，可浓缩的化学机械抛光组合物及其相关方法
公开(公告)号：US08435896B2
公开(公告)日：2013-05-07
申请号：US13039723
申请日：2011-03-03
申请人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
发明人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/3212 , C09G1/16
摘要： A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; a water soluble cellulose; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method of preparing a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.
摘要翻译：提供了用于化学机械抛光含有互连金属的半导体晶片的化学机械抛光组合物，包括作为初始组分的水; 唑类抑制剂; 碱金属有机表面活性剂; 水溶助长剂含磷剂; 水溶性纤维素; 任选地，非糖水溶性聚合物; 任选地，式I的水溶性酸化合物，其中R选自氢和C 1-5烷基，并且其中x是1或2; 任选地，络合剂; 任选地，氧化剂; 任选的有机溶剂; 和任选的研磨剂。此外，提供了制备本发明的化学机械抛光组合物的方法和基材的化学机械抛光方法，包括：提供基材，其中所述基材是具有铜互连的半导体晶片; 提供本发明的化学机械抛光组合物; 提供化学机械抛光垫; 在化学机械抛光垫和基板之间的界面处以0.69至34.5kPa的向下力产生动态接触; 并且将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物通过加入磷酸，氢氧化镁和氢氧化锂中的至少一种而显示pH调节至2至6的pH。

2. 发明申请

US20120225556A1 Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition 有权
标题翻译：稳定，浓缩，水溶性纤维素自由化学机械抛光组合物
公开(公告)号：US20120225556A1
公开(公告)日：2012-09-06
申请号：US13039705
申请日：2011-03-03
申请人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
发明人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
IPC分类号： H01L21/306 , C09K3/14 , C09K13/00
CPC分类号： H01L21/3212 , C09G1/16
摘要： A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method for making a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.
摘要翻译：提供了用于化学机械抛光含有互连金属的半导体晶片的化学机械抛光组合物，包括作为初始组分的水; 唑类抑制剂; 碱金属有机表面活性剂; 水溶助长剂含磷剂; 任选地，非糖水溶性聚合物; 任选地，式I的水溶性酸化合物，其中R选自氢和C 1-5烷基，并且其中x是1或2; 任选地，络合剂; 任选地，氧化剂; 任选的有机溶剂; 和任选的研磨剂。此外，提供了制造本发明的化学机械抛光组合物的方法和基板的化学机械抛光方法，包括：提供基板，其中所述基板是具有铜互连的半导体晶片; 提供本发明的化学机械抛光组合物; 提供化学机械抛光垫; 在化学机械抛光垫和基板之间的界面处以0.69至34.5kPa的向下力产生动态接触; 并且将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物通过加入磷酸，氢氧化镁和氢氧化锂中的至少一种而显示pH调节至2至6的pH。

3. 发明申请

US20120225555A1 Stable, concentratable chemical mechanical polishing composition and methods relating thereto 有权
标题翻译：稳定，可浓缩的化学机械抛光组合物及其相关方法
公开(公告)号：US20120225555A1
公开(公告)日：2012-09-06
申请号：US13039723
申请日：2011-03-03
申请人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
发明人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
IPC分类号： H01L21/306 , C09K13/00
CPC分类号： H01L21/3212 , C09G1/16
摘要： A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; a water soluble cellulose; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method of preparing a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.
摘要翻译：提供了用于化学机械抛光含有互连金属的半导体晶片的化学机械抛光组合物，包括作为初始组分的水; 唑类抑制剂; 碱金属有机表面活性剂; 水溶助长剂含磷剂; 水溶性纤维素; 任选地，非糖水溶性聚合物; 任选地，式I的水溶性酸化合物，其中R选自氢和C 1-5烷基，并且其中x是1或2; 任选地，络合剂; 任选地，氧化剂; 任选的有机溶剂; 和任选的研磨剂。此外，提供了制备本发明的化学机械抛光组合物的方法和基材的化学机械抛光方法，包括：提供基材，其中所述基材是具有铜互连的半导体晶片; 提供本发明的化学机械抛光组合物; 提供化学机械抛光垫; 在化学机械抛光垫和基板之间的界面处以0.69至34.5kPa的向下力产生动态接触; 并且将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物通过加入磷酸，氢氧化镁和氢氧化锂中的至少一种而显示pH调节至2至6的pH。

4. 发明授权

US08440097B2 Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition 有权
标题翻译：稳定，浓缩，水溶性纤维素自由化学机械抛光组合物
公开(公告)号：US08440097B2
公开(公告)日：2013-05-14
申请号：US13039705
申请日：2011-03-03
申请人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
发明人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
IPC分类号： C09K13/00
CPC分类号： H01L21/3212 , C09G1/16
摘要： A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method for making a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.
摘要翻译：提供了用于化学机械抛光含有互连金属的半导体晶片的化学机械抛光组合物，包括作为初始组分的水; 唑类抑制剂; 碱金属有机表面活性剂; 水溶助长剂含磷剂; 任选地，非糖水溶性聚合物; 任选地，式I的水溶性酸化合物，其中R选自氢和C 1-5烷基，并且其中x是1或2; 任选地，络合剂; 任选的氧化剂; 任选的有机溶剂; 和任选的研磨剂。此外，提供了制造本发明的化学机械抛光组合物的方法和基板的化学机械抛光方法，包括：提供基板，其中所述基板是具有铜互连的半导体晶片; 提供本发明的化学机械抛光组合物; 提供化学机械抛光垫; 在化学机械抛光垫和基板之间的界面处以0.69至34.5kPa的向下力产生动态接触; 并且将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物通过加入磷酸，氢氧化镁和氢氧化锂中的至少一种而显示pH调节至2至6的pH。

5. 发明授权

US06759550B1 Oxidation of alkyl aromatic compounds to aromatic acids in an aqueous medium 失效
标题翻译：烷基芳族化合物在水性介质中氧化成芳香酸
公开(公告)号：US06759550B1
公开(公告)日：2004-07-06
申请号：US10149554
申请日：2002-11-13
申请人： John Klier , Christopher J. Tucker , Thomas H. Kalantar , Kenneth A. Burdett , Daniel Patrick Green , Luciano Piras , Sergio Schena , Guo-shuh John Lee
发明人： John Klier , Christopher J. Tucker , Thomas H. Kalantar , Kenneth A. Burdett , Daniel Patrick Green , Luciano Piras , Sergio Schena , Guo-shuh John Lee
IPC分类号： C07C5116
CPC分类号： C07C51/265 , C07C63/33 , C07C65/24 , C07C65/21 , C07C63/06 , C07C53/10
摘要： The present invention pertains to an improved method of oxidizing substituted aromatic compounds (such as p xylene) to their corresponding aromatic acids (such as terephthalic acid). The improvement involves carrying out the oxidation reaction in an aqueous medium, wherein the aqueous medium contains at least 30 percent water, preferably up to 30 percent surfactant and preferably a low molecular weight material containing a hydrophilic end group as a co-surfactant. The reaction is carried out at a pH of less than 3.0.
摘要翻译：本发明涉及将取代的芳族化合物（例如对二甲苯）氧化成其相应的芳族酸（例如对苯二甲酸）的改进方法。改进包括在水性介质中进行氧化反应，其中水性介质含有至少30％的水，优选至多30％的表面活性剂，优选含有亲水端基作为辅助表面活性剂的低分子量材料。该反应在小于3.0的pH下进行。

6. 发明申请

US20140127309A1 ENCAPSULATED POLAR MATERIALS AND METHODS OF PREPARATION 审中-公开
标题翻译：包埋极性材料和制备方法
公开(公告)号：US20140127309A1
公开(公告)日：2014-05-08
申请号：US14122437
申请日：2012-05-31
申请人： Ian J. Drake , Andrew Hughes , Christopher J. Tucker , Thomas H. Kalantar , Joshua S Katz
发明人： Ian J. Drake , Andrew Hughes , Christopher J. Tucker , Thomas H. Kalantar , Joshua S Katz
IPC分类号： B01J13/16 , C12N11/04 , B01J13/18 , A61K9/50
CPC分类号： C12N11/04 , A01N25/28 , A61K8/11 , A61K9/5031 , A61K2800/10 , A61Q19/00 , B01J13/06 , B01J13/16 , B01J13/18 , B01J13/185
摘要： The present invention meets one or more of the above needs and is a composition comprising plurality of capsules wherein the capsules comprise: a core of one or more highly polar liquids; one or more polar active materials dissolved in or dispersed in one or more highly polar liquids; a mixture of one or more polymers and one of more highly polar liquids; or a mixture of one or more polymers, one or more highly polar liquids and one or more polar active materials, and a shell comprising, particles in a polymer matrix or particles; wherein the thickness of the shell is sufficient to prevent passage of the highly polar liquid or the active material through the shell or to control the rate passage of the highly polar liquid or the active material through the shell with the proviso that the one or more polymers may be located in the core, in the polymer matrix of the shell or both.
摘要翻译：本发明满足上述一个或多个需求，并且是包含多个胶囊的组合物，其中胶囊包含：一种或多种高极性液体的芯; 一种或多种溶于或分散在一种或多种高极性液体中的极性活性物质; 一种或多种聚合物和更高极性液体之一的混合物; 或一种或多种聚合物，一种或多种高极性液体和一种或多种极性活性物质的混合物，以及包含聚合物基质或颗粒中的颗粒的壳; 其中壳体的厚度足以防止高极性液体或活性物质通过壳体，或者控制高极性液体或活性材料通过壳体的速率通过，条件是一种或多种聚合物可以位于核心中，在壳的聚合物基质中或两者中。

7. 发明授权

US6143820A Preparation of a low polydisperse water-soluble polymeric composition 失效
标题翻译：低分散水溶性聚合物组合物的制备
公开(公告)号：US6143820A
公开(公告)日：2000-11-07
申请号：US216209
申请日：1998-12-18
申请人： John Klier , Thomas H. Kalantar , Christopher J. Tucker , Erin D. O'Driscoll , Andrew T. Graham
发明人： John Klier , Thomas H. Kalantar , Christopher J. Tucker , Erin D. O'Driscoll , Andrew T. Graham
IPC分类号： C08F8/50 , C08F22/02 , C08J11/16 , C08J11/22
CPC分类号： C08F8/50 , C08F2810/10
摘要： A water-soluble polymer having a low polydispersity index and controlled molecular weight can be prepared by oxidative degradation and shearing of a water-swellable crosslinked polymer or by hydrolysis of the crosslinked polymer to a high molecular weight soluble polymer, followed by oxidative degradation of the high molecular weight polymer.
摘要翻译：具有低多分散性指数和受控分子量的水溶性聚合物可以通过氧化降解和剪切水溶胀性交联聚合物或通过将交联聚合物水解成高分子量可溶性聚合物，然后氧化降解高分子量聚合物。

8. 发明授权

US09718938B2 Nanoporous polymeric foam having high porosity 有权
公开(公告)号：US09718938B2
公开(公告)日：2017-08-01
申请号：US13504561
申请日：2010-11-01
申请人： Stéphane Costeux , Lingbo Zhu , Christopher M. Weikart , Thomas H. Kalantar
发明人： Stéphane Costeux , Lingbo Zhu , Christopher M. Weikart , Thomas H. Kalantar
IPC分类号： C08J9/00 , C08J9/12
CPC分类号： C08J9/0066 , C08J9/0023 , C08J9/0071 , C08J9/122 , C08J2201/024 , C08J2201/03
摘要： Prepare a polymeric foam article having a thermoplastic polymer matrix defining multiple cells therein, wherein the polymeric foam article has the following characteristics: (a) the thermoplastic polymer matrix contains dispersed within it nano-sized nucleating additive particles that have at least two orthogonal dimensions that are less than 30 nanometers in length; (b) possesses at least one of the following two characteristics: (i) has an effective nucleation site density of at least 3×1014 sites per cubic centimeter of pre-foamed material; and (ii) has an average cell size of 300 nanometers or less; and (c) has a porosity percentage of more than 50 percent by rapidly expanding at a foaming temperature a foamable polymer composition containing the nucleating additive and a blowing agent containing at least one of carbon dioxide, nitrogen and argon.

9. 发明授权

US09650500B2 Nanoporous particles in a hollow latex matrix 有权
公开(公告)号：US09650500B2
公开(公告)日：2017-05-16
申请号：US13879522
申请日：2010-11-15
申请人： Yahong Zhang , Stéphane Costeux , Thomas H. Kalantar
发明人： Yahong Zhang , Stéphane Costeux , Thomas H. Kalantar
IPC分类号： C08K7/26 , C08K7/22 , C08J9/32 , C08J3/12
CPC分类号： C08K7/26 , C08J3/126 , C08J9/32 , C08J2325/06 , C08J2433/00 , C08K7/22 , Y10T428/249921 , Y10T428/249972 , Y10T428/268 , C08L51/06
摘要： Prepare an article of manufacture by providing a latex of hollow latex particles with a rigid inner shell and adhesive outer shell, providing nanoporous particles and dispersing them into the latex and drying the latex so as to cause the hollow latex particle to bind to one another and form an article of manufacture containing nanoporous particles and hollow latex particles wherein the hollow latex particles are bound directly to one another to form a continuous matrix and the nanoporous particles are dispersed within the continuous matrix of hollow latex particles.

10. 发明申请

US20110045975A1 MESO-SIZED CAPSULES USEFUL FOR THE DELIVERY OF AGRICULTURAL CHEMICALS 有权
标题翻译：适用于农业化学品交付的MESO-SIZED CAPSULES
公开(公告)号：US20110045975A1
公开(公告)日：2011-02-24
申请号：US12850676
申请日：2010-08-05
申请人： Robert J. Ehr , Thomas H. Kalantar , Lei Liu , Dale C. Schmidt , Mike P. Tolley , Kerrm Y. Yau , Qiang Zhang , Min Zhao
发明人： Robert J. Ehr , Thomas H. Kalantar , Lei Liu , Dale C. Schmidt , Mike P. Tolley , Kerrm Y. Yau , Qiang Zhang , Min Zhao
IPC分类号： A01N25/32 , A01N25/34 , A01N43/88 , A01N43/653 , A01P3/00 , A01P7/04 , A01P13/00
CPC分类号： A01N25/28 , A01N43/22 , A01N43/40 , A01N43/653 , A01N43/70 , A01N47/38 , A01N2300/00
摘要： Various aspects disclosed herein disclose mesocapsules that include active ingredients such as agriculturally active ingredients including various fungicides, insecticides, miticides, herbicides, safeners and modifiers of plant physiology or structure. These mesocapsules are comprised of a polyurea shell and include hydrophilic groups on their surfaces. These mesocapsules have a volume-average diameter of about 500 nm or less and some of them have a volume-average diameter on the order of about 300 nm or less. These mesocapsules are especially well suited for delivering active ingredients that are not very soluble in water, many of these compounds have solubility values in the range of 1,000 ppm or less. Methods for making these mesocapsules include interfacial polycondensation reactions carried out in the presence of surfactants such as sodium dodecyl sulfate and another method in which all or most of the surfactant is replaced by adding amino acids to the aqueous phase of the interfacial reaction mixture before forming the final emulsion.
摘要翻译：本文公开的各个方面公开了包括活性成分例如农业活性成分（包括各种杀真菌剂，杀虫剂，杀螨剂，除草剂，安全剂和植物生理学或结构的改性剂）的中间胶囊。这些中间胶囊由聚脲壳组成并且在其表面上包括亲水基团。这些中间体具有约500nm或更小的体积平均直径，并且它们中的一些具有约300nm或更小量级的体积平均直径。这些中间胶特别适用于递送不太可溶于水的活性成分，这些化合物中的许多具有在1,000ppm或更低的范围内的溶解度值。制备这些中间胶囊的方法包括在表面活性剂如十二烷基硫酸钠存在下进行的界面缩聚反应，以及在形成所述界面反应混合物的水相之前通过向界面反应混合物的水相中加入氨基酸来代替所有或大部分表面活性剂的方法最终乳液。

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