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1. 发明申请

US20130064987A1 METHOD AND APPARATUS FOR PRODUCING PHOTO-REACTION PRODUCT SHEET 审中-公开
标题翻译：生产光反应产物的方法和装置
公开(公告)号：US20130064987A1
公开(公告)日：2013-03-14
申请号：US13608112
申请日：2012-09-10
申请人： Hajime Fukunaga , Masakazu Morimoto , Jun Akiyama
发明人： Hajime Fukunaga , Masakazu Morimoto , Jun Akiyama
IPC分类号： B05D5/10 , B05C9/14 , B05D3/02
CPC分类号： B32B37/15 , B29C35/0888 , B29C35/10 , B29C2035/0827 , B32B2310/0831 , C09J7/38 , C09J2205/31
摘要： A photo-reactive composition layer is formed on a support with transparency while moving the support with transparency in one direction. The support is reversed as to be moved in a direction opposite to the one direction to generate a serpentine transport path, whereby the supports prior to reverse and subsequent to reverse face to each other serpentinely. Light from lamps for ultraviolet-ray emission is applied to the support, and every photo-reactive composition layer on the support serpentinely is photo-polymerized while light is transmitted through the support and the photo-reactive composition layer formed on the support.
摘要翻译：在具有透明性的支撑体上形成光反应性组合物层，同时沿着一个方向以透明度移动支撑体。支撑件相反地沿与一个方向相反的方向移动以产生蛇形传输路径，由此支撑件在反向之后并且随后彼此反向地相对于蛇形地。来自用于紫外线发射的灯的光被施加到载体上，并且载体上的每个光反应性组合物层被蛇形地光聚合，同时光透射通过载体和形成在载体上的光反应性组合物层。

2. 发明申请

US20050011613A1 Method and apparatus for joining adhesive tape 失效
标题翻译：连接胶带的方法和装置
公开(公告)号：US20050011613A1
公开(公告)日：2005-01-20
申请号：US10886610
申请日：2004-07-09
申请人： Masakazu Morimoto , Shinsuke Ikishima , Masayoshi Natsume , Shigeki Ishiguro
发明人： Masakazu Morimoto , Shinsuke Ikishima , Masayoshi Natsume , Shigeki Ishiguro
IPC分类号： B62D65/00 , B65H35/07 , B65H37/00 , B65H37/04 , B32B31/00
CPC分类号： B65H37/005 , B65H2801/51 , Y10T156/17 , Y10T156/1788
摘要： An adhesive tape inserted into a tape inserting clearance defined between a tape supplying roller and a tape guide is supplied to joining rollers while being wound around the tape supplying roller under guidance. At the tape inserting clearance, one side edge of the adhesive tape is guided to a tape positioner in slide contact, to be positioned in a tape width direction, and further, the adhesive tape T is inserted and moved while allowing the tape to be moved toward the other side edge of the adhesive tape.
摘要翻译：插入到带供应辊和带引导件之间的带插入间隙中的胶带被提供给接合辊，同时在引导下卷绕在带供应辊上。在带插入间隙处，胶带的一个侧边缘被引导到滑动接触的带定位器，以沿带宽度方向定位，此外，粘合带T被插入和移动，同时允许带移动朝向胶带的另一侧边缘。

3. 发明授权

US07506678B2 Adhesive tape joining apparatus 失效
标题翻译：胶带接合装置
公开(公告)号：US07506678B2
公开(公告)日：2009-03-24
申请号：US11392809
申请日：2006-03-30
申请人： Osamu Degawa , Masakazu Morimoto , Shinsuke Ikishima
发明人： Osamu Degawa , Masakazu Morimoto , Shinsuke Ikishima
IPC分类号： B32B37/22 , B32B38/10
CPC分类号： B29C63/024 , B29L2031/3005 , B65H37/005 , B65H2801/51 , Y10T156/1788 , Y10T156/1795
摘要： A main body to be moved and operated along a workpiece includes a joining roller which elastically presses the supplied adhesive tape against a tape joining face of the workpiece, guide members which determine the position of the main body and maintain the posture of the main body with respect to the workpiece being engaged with the outer face of the workpiece at the opposite side of the tape joining face, a separator guide which is arranged to be opposed to a tape supply roller, and a tape guide which is arranged in the vicinity of the side where the adhesive tape is reeled out toward the separator guide. On the separator guide, a separator guide face is formed, which guides a separator st separated from the adhesive tape into a direction different from an adhesive tape joining direction.
摘要翻译：沿着工件移动和操作的主体包括：接合辊，其将供给的粘合带弹性地压靠在工件的带接合面上;导向构件，其确定主体的位置并保持主体的姿势; 相对于与带接合面的相对侧的工件的外表面接合的工件，布置成与带供应辊相对的分离器引导件和布置在带接合面附近的带引导件粘合带朝向分离器引导件被卷出的一侧。在分离器引导件上，形成分离器导向面，该分离器导向面将从粘合带分离出的分离器引导到与胶带接合方向不同的方向。

4. 发明申请

US20120208012A1 SEMICONDUCTOR PROCESSING SHEET 审中-公开
标题翻译：半导体处理表
公开(公告)号：US20120208012A1
公开(公告)日：2012-08-16
申请号：US13388879
申请日：2010-07-20
申请人： Keisuke Watanabe , Masakazu Morimoto , Junki Mori , Masayoshi Natsume
发明人： Keisuke Watanabe , Masakazu Morimoto , Junki Mori , Masayoshi Natsume
IPC分类号： B32B27/18 , B24B7/16 , C09J7/02
CPC分类号： H01L21/6836 , C08K5/0041 , C08K5/0091 , C09J7/20 , C09J2201/128 , C09J2203/326 , C09J2205/106 , H01L2221/68327 , Y10T428/2848 , Y10T428/31504
摘要： A semiconductor processing sheet contains a base layer having a plastic sheet containing pigment as a core layer, wherein a non-pigment-containing layer is arranged in the outermost layer on front and back main surfaces of the core layer. According to the present invention, in a process for manufacturing semiconductor devices, it is possible to minimize contamination of the inner surface for the film manufacturing die that is due to the pigment contained in the film while maintaining the visibility of the semiconductor processing sheet. Consequently, partial occlusion of the die lip aperture due to pigment contamination is reduced, with the result that effective prevention of the deterioration of the sheet thickness precision due to adhering pigment is possible.
摘要翻译：半导体处理片包含具有含有颜料作为核心层的塑料片的基底层，其中，在芯层的前后主表面的最外层配置有非颜料含量层。根据本发明，在半导体装置的制造方法中，能够使保持半导体处理用片材的可视性的同时，使包含在膜中的颜料导致的膜制造用模具的内表面的污染最小化。因此，由于颜料污染导致的模唇孔的局部闭塞减少，结果是可以有效地防止由于颜料附着引起的板厚精度的劣化。

5. 发明申请

US20060219367A1 Adhesive tape joining apparatus 失效
公开(公告)号：US20060219367A1
公开(公告)日：2006-10-05
申请号：US11392809
申请日：2006-03-30
申请人： Osamu Degawa , Masakazu Morimoto , Shinsuke Ikishima
发明人： Osamu Degawa , Masakazu Morimoto , Shinsuke Ikishima
IPC分类号： B32B37/00 , B44C7/00 , B62D65/16
CPC分类号： B29C63/024 , B29L2031/3005 , B65H37/005 , B65H2801/51 , Y10T156/1788 , Y10T156/1795
摘要： A main body to be moved and operated along a workpiece includes a joining roller which elastically presses the supplied adhesive tape against a tape joining face of the workpiece, guide members which determine the position of the main body and maintain the posture of the main body with respect to the workpiece being engaged with the outer face of the workpiece at the opposite side of the tape joining face, a separator guide which is arranged to be opposed to a tape supply roller, and a tape guide which is arranged in the vicinity of the side where the adhesive tape is reeled out toward the separator guide. On the separator guide, a separator guide face is formed, which guides a separator st separated from the adhesive tape into a direction different from an adhesive tape joining direction.

6. 发明申请

US20060019069A1 Pressure-sensitive adhesive tape 有权
标题翻译：压敏胶带
公开(公告)号：US20060019069A1
公开(公告)日：2006-01-26
申请号：US11184261
申请日：2005-07-19
申请人： Shinsuke Ikishima , Hiroichi Ukei , Masakazu Morimoto
发明人： Shinsuke Ikishima , Hiroichi Ukei , Masakazu Morimoto
IPC分类号： B32B3/00 , B32B15/04
CPC分类号： C09J7/22 , C09J7/38 , C09J2201/28 , Y10T428/14 , Y10T428/24479 , Y10T428/2457 , Y10T428/28
摘要： A pressure-sensitive adhesive tape which comprises a resin film and a pressure-sensitive adhesive layer formed on at least one side of the film, and which has a concave-convex form containing plural grooves arranged at given intervals in a face of the pressure-sensitive adhesive layer that is to be stuck onto an adherend, and has a region where the interval of the arrangement of the grooves is 400 μm or more, the tensile modulus of the pressure-sensitive adhesive tape in the temperature range of 23 to 80° C. being in the range of 30 to 600 MPa. This tape has such an excellent workability that when the tape is stuck onto an adherend, air bubbles escape easily therefrom so as to prevent the generation of defects based on the entrainment of the air bubbles.
摘要翻译：一种压敏粘合带，其包括形成在所述膜的至少一侧上的树脂膜和压敏粘合剂层，并且所述压敏粘合带具有凹凸形状，所述凹凸形状包含在所述压敏粘合剂的表面中以给定间隔布置的多个凹槽，粘贴在被粘物上的粘合剂层，并且具有槽的配置间隔为400μm以上的区域，粘合带的拉伸模量在23〜80℃的温度范围内 C.在30至600MPa的范围内。这种胶带具有这样优异的可加工性，即当胶带被粘附到被粘物上时，气泡容易从其中逸出，从而防止基于气泡的夹带产生缺陷。

7. 发明申请

US20110275179A1 PROTECTIVE TAPE JOINING METHOD AND PROTECTIVE TAPE USED THEREFOR 审中-公开
标题翻译：保护带接合方法及其使用的保护带
公开(公告)号：US20110275179A1
公开(公告)日：2011-11-10
申请号：US13144581
申请日：2010-07-26
申请人： Tomohiro Oomure , Keisuke Watanabe , Masakazu Morimoto , Masayoshi Natsume , Tsutomu Shimura , Tsuyoshi Habu , Masayuki Yamamoto
发明人： Tomohiro Oomure , Keisuke Watanabe , Masakazu Morimoto , Masayoshi Natsume , Tsutomu Shimura , Tsuyoshi Habu , Masayuki Yamamoto
IPC分类号： H01L21/56 , C09J7/02
CPC分类号： H01L21/67132 , Y10T428/2848
摘要： Provided is an improved method of joining a protective tape having one object to suppress generation of bending of a semiconductor wafer after a back-grinding process. The protective tape is supplied toward the semiconductor wafer suction-held on a chuck table, and an intermediate sheet is supplied along an upper side of the protective tape. Then, the intermediate sheet is interposed between a joining member and the protective tape along a surface of a base material in the protective tape so as to be movable. Under this state, the joining member and the semiconductor wafer move relative to each other in a horizontal direction, whereby the protective tape is joined to a surface of the semiconductor wafer.
摘要翻译：提供了一种改进的方法，其连接具有一个物体的保护带，以在后磨削过程之后抑制半导体晶片的弯曲产生。将保护带供给到被夹持在卡盘台上的半导体晶片，沿着保护带的上侧供给中间片。然后，中间片沿着保护带中的基材的表面介于接合构件和保护带之间，以便可移动。在该状态下，接合部件和半导体晶片在水平方向上相对移动，由此将保护带接合到半导体晶片的表面。

8. 发明授权

US07867601B2 Pressure-sensitive adhesive tape 有权
标题翻译：压敏胶带
公开(公告)号：US07867601B2
公开(公告)日：2011-01-11
申请号：US11184261
申请日：2005-07-19
申请人： Shinsuke Ikishima , Hiroichi Ukei , Masakazu Morimoto
发明人： Shinsuke Ikishima , Hiroichi Ukei , Masakazu Morimoto
IPC分类号： B32B9/00 , B32B33/00 , B32B3/00 , B32B3/28 , B32B3/30 , B32B7/12 , B32B15/04
CPC分类号： C09J7/22 , C09J7/38 , C09J2201/28 , Y10T428/14 , Y10T428/24479 , Y10T428/2457 , Y10T428/28
摘要： A pressure-sensitive adhesive tape which comprises a resin film and a pressure-sensitive adhesive layer formed on at least one side of the film, and which has a concave-convex form containing plural grooves arranged at given intervals in a face of the pressure-sensitive adhesive layer that is to be stuck onto an adherend, and has a region where the interval of the arrangement of the grooves is 400 μm or more, the tensile modulus of the pressure-sensitive adhesive tape in the temperature range of 23 to 80° C. being in the range of 30 to 600 MPa. This tape has such an excellent workability that when the tape is stuck onto an adherend, air bubbles escape easily therefrom so as to prevent the generation of defects based on the entrainment of the air bubbles.
摘要翻译：一种压敏粘合带，其包括形成在所述膜的至少一侧上的树脂膜和压敏粘合剂层，并且所述压敏粘合带具有凹凸形状，所述凹凸形状包含在所述压敏粘合剂的表面中以给定间隔布置的多个凹槽，要粘贴在被粘物上的粘合剂层，并且具有槽的排列间隔为400μm以上的区域，粘合带的拉伸模量在23〜80°的温度范围内 C.在30至600MPa的范围内。这种胶带具有这样优异的可加工性，即当胶带被粘附到被粘物上时，气泡容易从其中逸出，从而防止基于气泡的夹带产生缺陷。

9. 发明申请

US20080293885A1 Reactive Emulsion and Process for Producing the Same 审中-公开
标题翻译：反应性乳液及其生产方法
公开(公告)号：US20080293885A1
公开(公告)日：2008-11-27
申请号：US11918198
申请日：2006-04-19
申请人： Masakazu Morimoto , Naofumi Tsujino
发明人： Masakazu Morimoto , Naofumi Tsujino
IPC分类号： C08L79/04 , C08L81/00
CPC分类号： C08L51/003 , C08F265/00 , C08F265/04 , C09D151/003 , C08L2666/02
摘要： The present invention provides a reactive emulsion capable of exerting a superior cross-linking ability, while reducing an amount of expensive additionally polymerizable oxazoline to be used. The problem can be solved with a reactive emulsion containing a core part composed of fine particles of an acrylate-based emulsion and a shell part composed of a polymer containing an oxazoline group, locating around said core part.
摘要翻译：本发明提供能够发挥优异的交联能力的反应性乳液，同时减少昂贵的另外可聚合的恶唑啉的使用量。该问题可以用包含由丙烯酸酯类乳液的细颗粒构成的核心部分和由含有含有恶唑啉基团的聚合物构成的壳部分的反应性乳液来解决，所述壳部分位于所述芯部分周围。

10. 发明授权

US07299845B2 Method and apparatus for joining adhesive tape 失效
标题翻译：连接胶带的方法和装置
公开(公告)号：US07299845B2
公开(公告)日：2007-11-27
申请号：US10886610
申请日：2004-07-09
申请人： Masakazu Morimoto , Shinsuke Ikishima , Masayoshi Natsume , Shigeki Ishiguro
发明人： Masakazu Morimoto , Shinsuke Ikishima , Masayoshi Natsume , Shigeki Ishiguro
IPC分类号： B32B37/00
CPC分类号： B65H37/005 , B65H2801/51 , Y10T156/17 , Y10T156/1788
摘要： An adhesive tape inserted into a tape inserting clearance defined between a tape supplying roller and a tape guide is supplied to joining rollers while being wound around the tape supplying roller under guidance. At the tape inserting clearance, one side edge of the adhesive tape is guided to a tape positioner in slide contact, to be positioned in a tape width direction, and further, the adhesive tape T is inserted and moved while allowing the tape to be moved toward the other side edge of the adhesive tape.
摘要翻译：插入到带供应辊和带引导件之间的带插入间隙中的胶带被提供给接合辊，同时在引导下卷绕在带供应辊上。在带插入间隙处，胶带的一个侧边缘被引导到滑动接触的带定位器，以沿带宽度方向定位，此外，粘合带T被插入和移动，同时允许带移动朝向胶带的另一侧边缘。

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