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1. 发明专利

JP2000332046A CONDUCTIVE BALL MOUNTING EQUIPMENT 失效
公开(公告)号：JP2000332046A
公开(公告)日：2000-11-30
申请号：JP14327199
申请日：1999-05-24
申请人： HITACHI VIA MECHANICS LTD , HITACHI LTD
发明人： NAITO YOSHITATSU , OSAKA YOSHIHISA , SAJIKI KOJI , INOUE KOSUKE , DAIROKU NORIYUKI , SUZUKI TAKAMICHI
IPC分类号： H01L23/12 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To enable sure mounting of the necessary number of solder balls on a package without forming dimples on a ball suction surface of an alignment mask. SOLUTION: This conductive ball mounting equipment is constituted by installing a ball supply part which levitates and supplies solder balls, a flux supply part spreading flux on the solder balls, a mounting part positioning a package, an alignment mask connected with a vacuum pressure supply source in which mask a plurality of holes for sucking the solder balls are formed in the same arrangement as that of connecting terminals of the package, and a carrying part moving the alignment mask. In this case, vacuum pressure setting devices 11a, 11b, 11c are installed between a vacuum pressure supplying source 8 and an alignment mask 6.

2. 发明专利

JP2007219011A Maskless exposure apparatus and exposure method thereof 审中-公开
标题翻译：无菌接触装置及其接触方法
公开(公告)号：JP2007219011A
公开(公告)日：2007-08-30
申请号：JP2006036961
申请日：2006-02-14
申请人： Hitachi Via Mechanics Ltd , 日立ビアメカニクス株式会社
发明人： NAITO YOSHITATSU , SATO KOICHI , SAJIKI KOJI , NISHIJIMA OSAMU , IKEGAMI HITOSHI
IPC分类号： G03F7/20 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To set a relative angle between a DMD (spatial optical modulator) and a substrate with high accuracy in an inexpensive configuration.
SOLUTION: A rotating table 13 the rotation center of which can be moved in XY directions is provided and a substrate 6 as an exposure object is mounted on the rotating table 13 and preliminarily rotated by a predetermined angle θ with respect to the Y axis prior to starting exposure. The substrate 6 in the rotated state is subjected to XY axes complementary control so as to draw a pattern on the substrate 6 by exposure by subjecting each mirror M of the DMD 3 to on-off control based on time-series exposure data while the substrate 6 is inclined in the direction of the angle.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：在廉价的配置中，以高精度设置DMD（空间光调制器）和基板之间的相对角度。解决方案：提供其旋转中心可在XY方向移动的旋转台13，作为曝光对象的基板6安装在旋转台13上，相对于Y预先旋转预定角度θ 开始曝光之前的轴。旋转状态的基板6进行XY轴互补控制，以便通过对DMD 3的每个反射镜M进行基于时间序列曝光数据的开关控制的曝光来在基板6上绘制图案，同时基板 6在角度方向上倾斜。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2001144422A FLUX-SUPPLYING DEVICE IN CONDUCTIVE BALL-MOUNTING DEVICE 失效
公开(公告)号：JP2001144422A
公开(公告)日：2001-05-25
申请号：JP31965899
申请日：1999-11-10
申请人： HITACHI VIA MECHANICS LTD
发明人： SAJIKI KOJI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a flux-supplying device for securely supplying flux without being affected by solder balls falling into a flux bath. SOLUTION: The flux-supplying device in a conductive ball-mounting device is provided with a flux bath 6 that is supported rotatably, a squeegee 12 for forming the film of a flux 4 with a specific thickness by rotating the flux bath 6, and a capturing plate 17 for capturing conductive balls being mixed into the flux 4. The end of a downstream side comes into contact with the bottom surface of the flux bath 6, and a gap that is larger than the diameter of the conductive balls is formed at an area to the bottom surface of the flux bath 6 at the upstream side at the specific position of the downstream side of the flow of the flux 4 flowing from the area between the flux bath 6 and the squeegee 12 due to the rotation of the flux bath 6.

4. 发明专利

JP2001156434A SOLDER BALL MOUNTING METHOD AND DEVICE 失效
公开(公告)号：JP2001156434A
公开(公告)日：2001-06-08
申请号：JP34006499
申请日：1999-11-30
申请人： HITACHI VIA MECHANICS LTD
发明人： OGURO TAKAO , SAJIKI KOJI
IPC分类号： B23K1/00 , B23K3/06 , H01L21/60 , H01L23/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a solder ball mounting method and a device, where 20 to 30 thousand solder balls can be mounted on a work through a single process, so that a solder ball mounting operation can be enhanced in efficiency. SOLUTION: A mask 20 and a work 14 are positioned to a tilting table 4, the tilting table 4 is tilted by a previously determined angle around a tilt pin as an axis so as to make squeegees 34 located at a higher level. Solder balls 19 larger in number than holes 21 are supplied to holes 16 located opposite to the work 14 partitioned by the squeegees 34, then the squeegees 34 are moved to a lower side at a predetermined speed (lower than the speed of a solder ball which falls by its own weight). After the squeegees 34 are moved to a point outside a region where the holes 21 are arranged, the tilting table 4 is tilted to the opposite side, the solder balls 19 which are not engaged with the holes 21 are removed from the mask 20, then the tilting table 4 is turned horizontal in position, and lastly the squeegees 34 are returned to their original positions.

5. 发明专利

JP2000124346A CONDUCTIVE BALL SUPPLY DEVICE FOR CONDUCTIVE BALL MOUNTING APPARATUS 失效
公开(公告)号：JP2000124346A
公开(公告)日：2000-04-28
申请号：JP29100798
申请日：1998-10-13
申请人： HITACHI VIA MECHANICS LTD
发明人： SAJIKI KOJI
IPC分类号： B23K3/06 , H01L21/60 , H01L23/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a solder ball supply device which can decrease the storage amount of solder balls in a supply container. SOLUTION: This device is provided with a storage container 55, which is arranged rotatably above a supply container 29 and discharges internally stored conductive balls 2 by a certain quantity each time it rotates, a hopper 49 which receives the conductive balls 21 discharged from the storage container 55, and a flexible tube 50 which has one end connected to the hopper 49 and the other end enabled to move between a standby position and the opening part of the supply container 29.

6. 发明专利

JPH09298356A METHOD FOR FORMING BUMPS AND ITS APPARATUS AND ELECTRONIC DEVICE FORMED THEREBY 失效
公开(公告)号：JPH09298356A
公开(公告)日：1997-11-18
申请号：JP2521797
申请日：1997-02-07
申请人： HITACHI LTD , HITACHI SEIKO KK
发明人： INOUE KOSUKE , SUZUKI TAKAMICHI , ODAJIMA HITOSHI , IWASHITA KATSUHIRO , YONEDA TATSUYA , HONDA MICHIHARU , TANAKA KATSUHISA , YAMAGUCHI TAKESHI , MURAKAMI TETSUO , TSUCHIYA AKIRA , NAITOU YOSHITATSU , SUZUKI MITSUHIRO , NAMITA IZUMI , SAJIKI KOJI
IPC分类号： B23K3/06 , H01L21/321 , H01L21/60 , H01L23/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To improve the reliability and production ability by placing solder balls facing attraction jigs at indexed positions of the jigs and performing the attraction of the solder balls, flux coating and package mounting at the same time, and executing inspections at every step. SOLUTION: An attraction jig 50 attracts and arranges solder balls 61, the arrangement quality thereof is examined and flux 70a is fed to the balls 61 with checking if the balls 61 drop from the jig 50. A cleaned board is fed to a solder ball mounting apparatus which positions bump-forming pads of the board at the balls 61 and verifies if the balls 61 are mounted correctly on a package 75. The package is set in a high temp. atmosphere to melt and bond the balls 61 to the structure pads 307. After cooling them, solder bumps are formed on the pads 307 of the package 75.

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