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1. 发明专利

JPS61269320A BONDING DEVICE 失效
公开(公告)号：JPS61269320A
公开(公告)日：1986-11-28
申请号：JP11046285
申请日：1985-05-24
申请人： HITACHI MICROCUMPUTER ENG , HITACHI LTD
发明人： MATSUZAWA ASAO , SUZUKI AKIRA , TANAKA HIDEKI , OKAMOTO MICHIO
IPC分类号： H01L21/60
摘要： PURPOSE:To prevent the occurrence of the relative dislocation between sections of lead frame by constituting a heat block so as to uniformly heat the whole lead frame. CONSTITUTION:A lead frame 1 where a pellet 3 is bonded on its tab 2 is intermittently transferred in one direction along a guide 5a on a circumference heat block 5. While being synchronized with this intermittent transfer, the heat block 6 is raised and lowered with a raising and lowering device 9 and contacted with the lead frame 1. The lead frame 1 is uniformly heated as a whole with the central section heat block 6 so that its heat-expansion occurs uniformly as a whole.

2. 发明专利

JPS6298753A RESIN-SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6298753A
公开(公告)日：1987-05-08
申请号：JP23743485
申请日：1985-10-25
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： OKAMOTO MICHIO , MASUDA MASACHIKA , HAGIWARA YASUHISA , MATSUZAWA ASAO
IPC分类号： H01L23/28 , H01L23/31
摘要： PURPOSE:To shorten the length of the wires to be used for electrical connection by mounting a semiconductor pellet on the pellet attaching substrate whose pellet attaching surface is lower than the wiring forming surface. CONSTITUTION:A semiconductor pellet 3 is sealed in a packaging resin 1 along with a pellet attaching substrate 5 to which the pellet is being bonded through such a bonding agent 4 as a silver paste. The pellet attaching substrate 5 consists of a glass epoxy substrate, its peripheral upper surface is a wiring forming surface and a pellet attaching surface is formed at its central part at the position lower than the wiring forming surface. That is, the pellet attaching surface is formed as the bottom surface of the recessed part surrounded with the wiring forming surface in all directions. By this way, the length of wires can be shortened because a wiring layer 6 is allowed to approach the pellet 3 and moreover, as the wiring layer can be formed in a desired form, a bonding area of sufficient width can be ensured.

3. 发明专利

JP2003108961A ELECTRONIC TAG AND ITS MANUFACTURING METHOD 审中-公开
公开(公告)号：JP2003108961A
公开(公告)日：2003-04-11
申请号：JP2001300841
申请日：2001-09-28
申请人： HITACHI LTD
发明人： OKAMOTO MICHIO
IPC分类号： G06K19/07 , G06K19/077 , G08B13/24
摘要： PROBLEM TO BE SOLVED: To provide a low-price non-contact electronic tag and a manufacturing method of it. SOLUTION: This electronic tag is provided with a lead 2 constituting an antenna, a slit 5 formed in a part of the lead 2 and extended at one end toward the outer edge of the lead 2, a semiconductor chip 3 mounted on the lead 2 in the vicinity of the slit 5, and a single Au wire 7, in which one end is bonded onto a bump electrode 6 in the semiconductor chip 3 while the other end is bonded onto the lead 2 in the area opposed to the semiconductor chip 3 mounting area while putting the slit 5 between them. The semiconductor chip 3 and the Au wire 7 are sealed with a resin, and the back face of the semiconductor chip 3 is electrically connected to the lead 2.

4. 发明专利

JPH10229156A LEAD CUTTING/SHAPING METHOD AND DEVICE 失效
公开(公告)号：JPH10229156A
公开(公告)日：1998-08-25
申请号：JP4469397
申请日：1997-02-13
申请人： HITACHI LTD
发明人： HAGIWARA TAKATOSHI , FUJISHIMA ATSUSHI , OKAMOTO MICHIO
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide a lead cutting/shaping device having high versatility. SOLUTION: This lead cutting/shaping device 20 is provided with a work supply device 23, supplying a work 10 in which plural SOJ.IC(small outline J-reeled (phonetic) semiconductor integrated circuit device) and the like are assembled into multiple strain leads frame. The work 10 is provided with a cutting device 30, which individually detaches SOJ.IC and the like as intermediate products 19, first to fifth lead shaping devices 51-55 which stepwise shape the outer lead part of the intermediate product 19 detached by the cutting device 30 into the desired form of a J-reeled form and an unloading device 72, which unloads a completed product 1. Since the intermediate product is shaped into the J-reeled form after detachment, it is not restricted by the number of the strains and the structure of the multiple strain leads frame, and the cutting device and the lead shaping device are not required to be synchronized. Thus, the outer lead can be shaped into the J-reeled form and the various forms of a gal/wing and the like, and it can cope with the change of various specifications with the exchange of a punch and a die.

5. 发明专利

JPH10229155A LEAD WORK METHOD AND DEVICE 失效
公开(公告)号：JPH10229155A
公开(公告)日：1998-08-25
申请号：JP4469297
申请日：1997-02-13
申请人： HITACHI LTD
发明人： HAGIWARA TAKATOSHI , FUJISHIMA ATSUSHI , OKAMOTO MICHIO
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To relieve the trouble of exchange work and the adjustment work of a pressing die. SOLUTION: An upper-pressing die 33 is constituted so that the root of an outer lead part is pressed by the air pressure of an air cylinder device 40. A pressure-adjusting device 47 that changes/adjusts air pressure is provided for the air cylinder device 40. For changing pressing force by the upper-pressing die 33 and a lower-pressing die 19, the air pressure of the air cylinder device is changed/adjusted by the pressure-adjusting device 47. Since a pressing force can be changed corresponding to a work to be pressed by changing/adjusting the air pressure, the exchange work of the pressing die, which is required in prior art when the pressing die is biased by the repulsive force of a spring, can be omitted or relieved.

6. 发明专利

JPH0758142A WIRE BONDING DEVICE 失效
公开(公告)号：JPH0758142A
公开(公告)日：1995-03-03
申请号：JP8465894
申请日：1994-04-22
申请人： HITACHI LTD
发明人： OKAMOTO MICHIO
IPC分类号： H01L21/60
摘要： PURPOSE:To provide a bonding technique by which highly reliable wire bonding can be performed without giving any damage to bonding positions even when the material of wires or the diameter of balls changes. CONSTITUTION:A bonding arm 30 is equipped with a capillary 50 for guiding a wire 61 and performs bonding operations composed of initial crush process and compression-bonding process by pressing the ball at the front end of the wire 61 against a first position and, at the same time, pressing the loop end of the wire 61 against a second position. The bonding loads of the bonding arm 30 against the first and second positions are given from a voice coil 100 and a bonding load pattern generating section 103 changes the bonding load given to the coil 100 for at least either the bonding operation against the first or second position during at least either the initial crush process or compression- bonding process.

7. 发明专利

JPH04342144A COATING MECHANISM 失效
公开(公告)号：JPH04342144A
公开(公告)日：1992-11-27
申请号：JP11450891
申请日：1991-05-20
申请人： HITACHI LTD
发明人： OKAMOTO MICHIO
IPC分类号： B05C5/00 , H01L21/56
摘要： PURPOSE:To prepare a coating program automatically corresponding to a coated object and to enable improvement of quality in resin coating treatment especially operational efficiency of a coating process of TAB package method and by reduction of influence by an operator. CONSTITUTION:A bonding device 1 in resin sealing by TAB package method is constituted of a syringe 6 which is applied for a carrier tape 4 wherein a semiconductor chip is bonded and applies resin 5 to a specified position on the carrier tape 4, a Z-table 7, a Y-table 8 and an X-table 9 for driving of the syringe 6 in Z-axis, Y-axis and X-axis directions. The syringe 6 is automatically controlled by a dispenser 11 and Z-axis, Y--axis and X-axis driving controlling parts 18 to 20 according to a coating program which is automatically prepared within a main control part 21.

8. 发明专利

JPS62150836A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62150836A
公开(公告)日：1987-07-04
申请号：JP29064085
申请日：1985-12-25
申请人： HITACHI LTD
发明人： YAMAZAKI ISAMU , HINO SHUNICHI , WATANABE KENJI , OKAMOTO MICHIO
IPC分类号： H01L21/60
摘要： PURPOSE:To conduct wire bonding of a pellet with high bonding strength by interposing a metal layer between one end of a wire and a bonding portion of the pellet with a pad to prevent the base of the pad from damaging. CONSTITUTION:A pellet 3 is sealed in a package body 2 of a semiconductor device 1. The peripheral portion of a lead 4 of the body 2 sealed with epoxy resin is formed as an inner lead 4a. The connection of the lead 4a with a wire 10 made of copper with a pad 8 formed on the surface of the pellet 3 is performed, for example, as follows. The end of the wire 10 is heated to form a melted ball, and a ball portion 10b is pressed on a gold bump 9 on the pad 8. At this time, the bump 9 becomes a cushion to absorb the pressing force, thereby preventing the pad 8 from damaging.

9. 发明专利

JPS62123728A WIRE BONDING METHOD AND DEVICE THEREFOR 失效
公开(公告)号：JPS62123728A
公开(公告)日：1987-06-05
申请号：JP26245485
申请日：1985-11-25
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： OKAMOTO MICHIO , OKAMOTO ICHIRO
IPC分类号： H01L21/607 , H01L21/60
摘要： PURPOSE:To realize a higher-strength bondage at low temperatures by a method wherein wire bonding is accomplished in a second manufacturing process wherein a load and ultrasonic oscillation, which is smaller in intensity than that applied in a first manufacturing process, are applied. CONSTITUTION:A controlling section 32 actuates a voice coil motor 26 for the application of a load (g), for example, of approximately 60g/cm to the end of a capillary 29. Simultaneously, a ultrasonic wave oscillating section 27 is actuated and a ultrasonic oscillation (omega) travels through a ultrasonic horn 28 for the oscillation for example for approximately 5ms, the oscillation (omega) attenuates. Simultaneously, the load (g) is increased to a prescribed value for example of 100g/cm , which remains for a prescribed period for example of approximately 30ms. In this way, a ball portion is pressed against a pad 3 of a pellet 2 for the completion of a first bonding process.

10. 发明专利

JPS61241933A SEMICONDUCTOR MANUFACTURING DEVICE 失效
公开(公告)号：JPS61241933A
公开(公告)日：1986-10-28
申请号：JP8249485
申请日：1985-04-19
申请人： HITACHI LTD , HITACHI TOKYO ELECTRON KK
发明人： OKAMOTO MICHIO , SUMIYA OSAMU
IPC分类号： H01L21/60 , H01L21/50
摘要： PURPOSE:To stabilize a detected pattern image of the part to be processed and to contrive the improvement in the accuracy of position recognition by increasing number of opening parts by providing the upper member with a venting hole for exhausting the air between the upper and lower members when holding a lead frame to the outside in addition to the window part. CONSTITUTION:When a lead frame 22 is sent to the predetermined position for wire bonding, a heat block 36 and a lead stopper plate 27 come to close by up-down movement and hold and position the lead frame 22. By providing the lead stopper plate 27 with plural venting holes 34 in addition to a window part 29, the inside air is dispersed and exhausted through the window part 29 and the venting holes 34 except the air exhausted to the outside from a gap 41 between the heat block 36 and a chute 21. Accordingly, a local roll-up of the air can be prevented and a rapid flow of the air is reduced and a swing of the part to be wire-bonded of the lead frame 22 is substantially reduced. Thus the accuracy in position recognition is improved and the predetermined process for the lead frame can be effected well with high accuracy.

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