会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明专利
    • SEMICONDUCTOR STORAGE DEVICE
    • JPS6013400A
    • 1985-01-23
    • JP11834483
    • 1983-07-01
    • HITACHI MICROCUMPUTER ENGHITACHI LTD
    • KOYAMA YOSHIHISA
    • G11C29/00G11C29/42G11C29/44
    • PURPOSE:To execute rational operation in accordance with the existance of a defective bit and application by controlling a switching gate circuit in accordance with the existence of the fusion of a fuse means. CONSTITUTION:The fuse means F is formed by an aluminum layer. Namely, an extremely thin wire is connected between pads P1 and P2 formed by the aluminum layers to play a roll as a fuse. The quality of the semiconductor storage device is discriminated and tested in a wafer providing process when the semiconductor storage device is completed on a semiconductor wafer. If high speed operation/low power consumption is necessary for the semiconductor storage device discriminated to have resultant high quality, said fuse means F is held as it is without fusion. Thus, power supply voltage is supplied to the input of an inverter IV1 through the fuse means F, so that the output signal of the inverter IV1 is turned to a low level (logical ''0'') and AND gate such as gates G2, G5 receiving a signal from an ECC circuit are closed.
    • 2. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPS60161658A
    • 1985-08-23
    • JP1523584
    • 1984-02-01
    • HITACHI MICROCUMPUTER ENGHITACHI LTD
    • KOYAMA YOSHIHISA
    • H01L27/08H01L27/092H01L29/78
    • PURPOSE:To enhance reliability and yield of a semiconductor integrated circuit device by a method wherein an MISFET for checking of latch locking having short channel length and high transconductance is provided to the part being apt to generate the rise of electric potential of a semiconductor substrate. CONSTITUTION:An MISFET for checking of latch locking (a p-channel MISFET) QA is constructed of a gate electrode 5, an insulating film 4, a semiconductor substrate 1 and a semiconductor region 7C to be used as a source region or a drain region, and a semiconductor region 6C to be formed with the channel region thereof. Because channel length Lg thereof can be controlled according to the diffusion speed of impurities for formation of the semiconductor regions 6C, 7C, channel length can be formed extremely short, and high transconductance (gm) can be obtained. When an external noise voltage to exceed earth potential VSS is generated, the MISFET for checking of latch locking QA is made to be in the ''ON'' condition to remove the external noise voltage of the earth potential VSS or more. Accordingly, a latch locking phenomenon can be checked.
    • 4. 发明专利
    • MOS STORAGE MEMORY
    • JPS6013394A
    • 1985-01-23
    • JP11834183
    • 1983-07-01
    • HITACHI MICROCUMPUTER ENGHITACHI LTD
    • KOYAMA YOSHIHISA
    • G11C11/409G11C11/34
    • PURPOSE:To prevent the influence of the parasitic capacity of a power supply line to exert upon the precharging operation of complementary data lines by short circuiting also a pair of common power supply lines in the precharging period to turn off an MOSFET constituting a sense amplifier. CONSTITUTION:Power supply voltage Vcc is supplied to a latch circuit through p channel MOSFETs Q12, Q13 which are connected in parallel and the earth voltage Vss of the circuit is supplied through n channel MOSFETs Q10, Q11 connected in parallel. These power switches MOSFET Q10, Q11 and Q12, Q13 are used in common for sense amplifiers arranged in other similar lines. A reset MOSFET Q45 to be turned on in the precharging period is connected between a pair of power supply lines N1, N2 having said constitution. The potential between complementary data lines is increased by the amplification of SA and then the MOSFETs Q11, Q13 having comparative conductance are turned on to speed up the amplification.
    • 7. 发明专利
    • MULTILAYER INTERCONNECTION MEMBER
    • JPS60109249A
    • 1985-06-14
    • JP21631383
    • 1983-11-18
    • HITACHI MICROCUMPUTER ENGHITACHI LTD
    • KOYAMA YOSHIHISA
    • H01L27/10H01L21/3205H01L21/8242H01L23/52H01L27/04H01L27/108
    • PURPOSE:To contrive to improve the operating speed of the information write and readout of a DRAM by reduction in the resistance value of word lines by a method wherein a word line extending in a fixed direction and a stepwise difference present in the MISFET-forming region of a memory cell are put into intersection at a required angle. CONSTITUTION:The MISFET-forming region of the memory cell is provided in the state that a conductive plate 6 is opened so as to expose that section. Thereby, the stepwise difference S having a steep form is present on insulation films 7 and 8 at part of word line formation and on a field insulation film 4 by means of the insulation film 4, conductive plate, etc. The word line 9 is constructed by coating a polycrystalline Si layer 9A with a silicide layer 9B, the compound of a high melting point metal of a lower resistance and silicon. Since the word line and the stepwise difference are in intersection at a required angle, a current route that avoids a higher resistance part than the flat part generating at the stepwise difference, i.e., a current route that does not orthogonally intersect with the end of said stepwise difference, can be provided, and the resistance value of the word line can be reduced.
    • 9. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPS61194867A
    • 1986-08-29
    • JP3439185
    • 1985-02-25
    • HITACHI MICROCUMPUTER ENGHITACHI LTD
    • KOYAMA YOSHIHISA
    • H01L27/10H01L21/822H01L21/8242H01L27/04H01L27/108H01L29/78
    • PURPOSE:To suppress the fluctuation of the ratio of the capacity value between the capacitive elements due to the dispersion in processing by a method wherein a capacitive elements having different capacity value of prescribed ratio by means of an insulating film consisting of different crystalline faces in the case of an integrated circuit device having capacitive elements with small holes. CONSTITUTION:A field insulation film 2 electrically separates semiconductor elements and limits the formation-region for them in a semiconductor substrate 1. A small hole 3A is provided on the main plane on the memory cell-formation region of the semiconductor substrate 1, and all the side planes consist of (100) crystalline planes. A small hole 3C is provided on the main plane on the dummy cell-formation region of the semiconductor substrate 1, and all the side planes consist of (100) crystalline faces. Insulation films 4A and 4C are provided on the main upper plane of the semiconductor substrate 1 along the small holes 3A and 3C. The insulation film 4A constitutes a capacitive element for storing information, and the insulation film 4C constitutes a capacitive element for judging information.
    • 10. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF
    • JPS61166064A
    • 1986-07-26
    • JP19962384
    • 1984-09-26
    • HITACHI MICROCUMPUTER ENGHITACHI LTD
    • KOYAMA YOSHIHISA
    • H01L27/10H01L21/82H01L21/8242H01L27/108
    • PURPOSE:To capture unnecessary minority carries intruding to a depletion layer constituting a small hole type capacitance element sufficiently by constituting a carrier capture region by using a small hole or a small groove formed extended in the internal direction of a substrate from the main surface of the substrate. CONSTITUTION:Etching masks in the upper sections of a main surface, to which small holes 13 and 19 are shaped, of a substrate 1 are removed selectively, and the small holes 13 and 19 are formed by employing an anisotropic etching technique. The etching masks used for shaping the small holes 13 and 19 are removed, and insulating films 14 and 20 coating the inner walls of the small holes and the main surface of the substrate 1 are formed. Conductive layers 15 and 21 are formed. A conductive layer 22 and an insulating film 26 are shaped. The conductive layer 22 is formed by employing a polycrystalline silicon layer through a CVD technique. The polycrystalline silicon layer is connected electrically to the conductive layers 15 and 19, and shaped to the upper sections of a field insulating film 9 and the insulating films 14, 20, and an impurity is introduced. The polycrystalline silicon layers in the upper sections of regions, in which a MISFET and a semiconductor region 23 are formed, of the substrate 1 are removed selectively.