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1. 发明专利

JP2001068493A SEMICONDUCTOR DEVICE AND METHOD AND DEVICE FOR RESIN SEALING 失效
公开(公告)号：JP2001068493A
公开(公告)日：2001-03-16
申请号：JP24021199
申请日：1999-08-26
申请人： HITACHI MAXELL , SHINSEI KAGAKU KOGYO CO LTD
发明人： KAMEGAYA MITSUO , KAWAMURA TETSUSHI , MIYATA TSUNEO
IPC分类号： H01L21/56 , B29C45/14 , B29C45/26 , H01L23/28
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having a reliable sealing effect and stable quality. SOLUTION: One surface of a semiconductor chip 1 is coated with a first molding 17 made of a resin. By coating the other surface of the semiconductor chip 1 with a second molding 21 made of a resin, the semiconductor chip 1 is buried and sealed between the first molding 17 and the second molding 21. In this semiconductor device, thick corner protecting portions 7 extending along a direction of the semiconductor chip 1 thickness are provided at respective corners of the semiconductor chip 1 integrally with the first molding. The outer surfaces of the respective corner protecting portions 7 are coated with the second molding 21.

2. 发明专利

JP2004310793A Information input and output device 有权
公开(公告)号：JP2004310793A
公开(公告)日：2004-11-04
申请号：JP2004193561
申请日：2004-06-30
申请人： Hitachi Maxell Ltd , 日立マクセル株式会社
发明人： SHIMIZU SHIN , KAWAMURA TETSUSHI , INOSE FUMIYUKI , KANEKO TOSHIYUKI
IPC分类号： G06K17/00
摘要： PROBLEM TO BE SOLVED: To provide an information input and output (I/O) device which can communicate with a close non-contact information medium reliably, preferably, with a predetermined degree of freedom in terms of the form of the medium. SOLUTION: The information I/O device has an accommodating part which can accommodate two types of non-contact information media having different forms and an antenna part which can radio-communicate with the non-contact information media. COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明专利

JP2002324890A IC ELEMENT AND ITS MANUFACTURING METHOD 审中-公开
公开(公告)号：JP2002324890A
公开(公告)日：2002-11-08
申请号：JP2002010220
申请日：2002-01-18
申请人： HITACHI MAXELL
发明人： SHIMIZU SHIN , KAWAMURA TETSUSHI
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077 , H01L25/00
摘要： PROBLEM TO BE SOLVED: To provide a structure of an IC element that is suitable for manufacture of a non-contact communication type information carrier having a long communication distance, and to provide its manufacturing method. SOLUTION: In the IC element, a conductor constituting an electric coil 3 has a multilayer structure that comprises a metal sputter layer or a metal evaporation layer 6 and a metal plating layer 7. In the method for manufacturing the IC element, precision electroforming is used as a means of forming a metal plating layer 7. The information carrier can be manufactured by arranging the IC element 1a at a center in a horizontal plane of a substrate 21, more particularly, by manufacturing what a required mounting component including the IC element is mounted on any one of belt-shaped materials 41-45 and then by forming by punching the required information carrier 20a to 20h from this belt-shaped material.

4. 发明专利

JP2002319012A INFORMATION CARRIER 审中-公开
公开(公告)号：JP2002319012A
公开(公告)日：2002-10-31
申请号：JP2002010230
申请日：2002-01-18
申请人： HITACHI MAXELL
发明人： SHIMIZU SHIN , KAWAMURA TETSUSHI
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077
摘要： PROBLEM TO BE SOLVED: To provide an information carrier which provides for a longer communication distance, having mounted thereon an IC device with an integrally formed coil. SOLUTION: The IC device 1 is positioned at the center of a substrate 21 along the direction of a plane. The IC device 1 has an integrally formed coil 3, and a conductor forming the coil 3 is of a multilayer structure having either a metal sputtered layer or a metal deposition layer 6 and a metal plating layer 7. A method of manufacturing the information carrier includes fabricating either of material strips 41 to 45 to be formed into the substrate 21, on which required mounted components including the IC device are mounted, and then punching the required information carriers 20a to 20h out of the material strip.

5. 发明专利

JP2003229215A CABLE CONNECTOR IDENTIFICATION SYSTEM 审中-公开
公开(公告)号：JP2003229215A
公开(公告)日：2003-08-15
申请号：JP2002028024
申请日：2002-02-05
申请人： HITACHI MAXELL
发明人： NAKAGAWA KAZUNARI , KAWAMURA TETSUSHI
IPC分类号： H01R13/66
摘要： PROBLEM TO BE SOLVED: To provide a novel cable connector identification system based on a new concept. SOLUTION: A cable 100 is provided with a connector 10, which connects with an electronic equipment such as an oscilloscope 200. The connector 10 is provided with an IC element such as a coil-on-chip 11 storing prescribed informations such as correction data of the cable. The prescribed informations stored in the IC element can be read out by the electronic equipment. COPYRIGHT: (C)2003,JPO

6. 发明专利

JP2002343877A METHOD OF MANUFACTURING IC ELEMENT 审中-公开
公开(公告)号：JP2002343877A
公开(公告)日：2002-11-29
申请号：JP2002020219
申请日：2002-01-29
申请人： HITACHI MAXELL
发明人： SHIMIZU SHIN , KAWAMURA TETSUSHI
IPC分类号： G06K19/07 , G06K19/077 , H01L21/822 , H01L27/04 , H01Q1/36 , H01Q1/38 , H01Q7/00 , H01Q23/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing at high efficiency a high- performance IC element on which a coil is integrally formed. SOLUTION: Required conductive patterns 15, 16 containing antenna coils 3 are formed on a surface protective film 2 of a finished wafer 11 manufactured via prescribed processes. Then, the finished wafer 11, on which the required conductive patterns 15, 16 are formed, is scribed to obtain IC elements 1 on each of which an antenna coil 3 is integrally formed.

7. 发明专利

JP2002056361A READER FOR NON-CONTACT TYPE INFORMATION STORAGE MEDIUM AND INFORMATION PROCESSING SYSTEM FOR NON-CONTACT TYPE INFORMATION STORAGE MEDIUM 失效
公开(公告)号：JP2002056361A
公开(公告)日：2002-02-20
申请号：JP2000240958
申请日：2000-08-09
申请人： HITACHI MAXELL
发明人： SHIMIZU SHIN , KAWAMURA TETSUSHI , NAGAI NOBUYUKI
IPC分类号： B42D15/10 , G06K7/08 , G06K17/00 , H01Q3/24 , H01Q7/00 , H04B5/02
摘要： PROBLEM TO BE SOLVED: To provide a reader for non-contact type information storage medium or reader and writer therefor capable of reducing the power consumption on the reader side, reducing the unnecessary radiation of electromagnetic wave by excessive power supply, and further performing the power supply according to the shape of an information storage medium. SOLUTION: This reader comprises a plurality of loop antennas differed in outer diameter and a transmitting circuit for selectively driving one of the loop antennas 1 or a plurality thereof. The loop antenna to be driven is selected according to the shape of the non-contact type information storage medium.

8. 发明专利

JP2001202483A INFORMATION INPUT/OUTPUT DEVICE 失效
公开(公告)号：JP2001202483A
公开(公告)日：2001-07-27
申请号：JP2000342325
申请日：2000-11-09
申请人： HITACHI MAXELL
发明人： INOSE FUMIYUKI , KAWAMURA TETSUSHI , SHIMIZU SHIN , KANEKO TOSHIYUKI
IPC分类号： B42D15/10 , G06K17/00
摘要： PROBLEM TO BE SOLVED: To provide an information input/output device which surely communicates with a contact type contactless information medium, preferably, with a prescribed number of degrees of freedom for the shape of the medium. SOLUTION: The information input/output device as an illustrative mode is provided with a storage part where two kinds of contactless information mediums different by shapes can be stored, and an antenna part which can communicate with these contactless information mediums.

9. 发明专利

JP2000323643A IC ELEMENT AND ITS MANUFACTURE AS WELL AS INFORMATION CARRIER WITH MOUNTED IC ELEMENT AND ITS MANUFACTURE 失效
公开(公告)号：JP2000323643A
公开(公告)日：2000-11-24
申请号：JP2000044765
申请日：2000-02-22
申请人： HITACHI MAXELL
发明人： SHIMIZU SHIN , KAWAMURA TETSUSHI
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07 , H01L25/00
摘要： PROBLEM TO BE SOLVED: To reduce the loss of electromagnetic energy, to stabilize electric power received from a reader and a writer and to stabilize a communication between the reader and the writer, by a method wherein a conductor which constitutes an antenna container is formed in a multilayer structure which comprises a metal sputtered layer or a metal vapor-deposited layer and a metal plated layer. SOLUTION: A metal sputtered layer or a metal vapor-deposited layer 6 is formed uniformly on a surface protective film 2 which is formed on the circuit formation face of a completed wafer. Then, a metal plated layer 7 is laminated in the exposed part of the metal sputtered layer or the metal vapor- deposited layer 6. Then, the completed wafer in which the metal plated layer 7 comprising an electrode, an antenna coil and a lead is formed on the uniform metal sputtered layer or the uniform metal vapor-deposited layer 6 is obtained. As a result, the loss of electromagnetic energy can be reduced, electric power which is received from a reader and writer can be stabilized, a communication between the reader and the writer can be stabilized, and a communication distance between the reader and the writer can be expanded.

10. 发明专利

JP2000285636A OPTICAL DISK SYSTEM 失效
公开(公告)号：JP2000285636A
公开(公告)日：2000-10-13
申请号：JP9368399
申请日：1999-03-31
申请人： HITACHI MAXELL
发明人： YUSA ATSUSHI , YASUI TOSHIAKI , TANAKA YOSHITO , INOSE FUMIYUKI , KAWAMURA TETSUSHI
IPC分类号： G06K19/07 , G11B7/24 , G11B23/30
摘要： PROBLEM TO BE SOLVED: To enable non-contact storage/write/read to be performed on an optical disk by arranging an electronic circuit on the disk and communicating with the electronic circuit in the main body of the disk by providing a corresponding electromagnetic coupling coil at a position facing the optical pickup head of a drive device. SOLUTION: An electromagnetic coil 301 is provided on the drive side while facing a semiconductor chip 101 built in a main body 100 of disk. Even while the main body 100 of disk is rotated, communications between the semiconductor chip 101 and the electromagnetic coil 301 are secured for a half cycle. When reading information of an electronic circuit 305, the rotation of the main body 100 of optical disk is controlled into low speed and time for information exchange can be easily secured as well. The read only signal of the main body 100 of optical disk can be utilized from the optical pickup 210 and the signal of a semiconductor memory can be utilized through an electromagnetic coil 304, a second electromagnetic coil 303, the electromagnetic coil 301 and a coil formed on the surface of the semiconductor chip 101 by the electronic circuit 305 respectively.

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