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1. 发明专利

JP2001041140A IMPELLER FOR HYDRAULIC MACHINERY AND HYDRAULIC MACHINERY 失效
公开(公告)号：JP2001041140A
公开(公告)日：2001-02-13
申请号：JP21708999
申请日：1999-07-30
申请人： HITACHI LTD , KANSAI ELECTRIC POWER CO
发明人： ZEN MUNETOSHI , HATTORI TOSHIO , SHINMEI KATSUMASA , KUWABARA HIROSHI , NISHIO TORU
IPC分类号： B23K9/04 , C23F13/00 , F03B3/12
摘要： PROBLEM TO BE SOLVED: To provide an impeller for a hydraulic machinery, which is formed by welding steel materials of different kinds which can keep an anti-corrosion effect over a long period of time. SOLUTION: A stainless steel welding material is built up substantially like a flat plate on a support member 5 made of carbon cast steel to form at least one coating layer 13, a blade 3 made of stainless steel is welded to the coating layer 13, and welding material made of carbon steel is built up at least on the surface of the support member 5 coming into contact with the coating layer 13 to form a sacrifice anode 19. Thus, wear resistance to the cavitation action is provided so that anti-corrosion of an impeller can be kept over a long period of time by the sacrifice anode 19 having a low speed of consumption due to abrasion.

2. 发明专利

JP2002364588A IMPELLER AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002364588A
公开(公告)日：2002-12-18
申请号：JP2001168941
申请日：2001-06-05
申请人： HITACHI LTD
发明人： ZEN MUNETOSHI , HATTORI TOSHIO , KOBAYASHI HIROMI , TAKEDA KAZUO , YAMADA HIROSHI , YAEGASHI KENJI , YAMAZAKI HIROSHI
IPC分类号： F04D29/28
摘要： PROBLEM TO BE SOLVED: To provide an impeller of high reliability with any unwelded portion eliminated capable of effectively relieving a stress concentration simply at a low cost, compared with a conventional method including a projection on a rounded part, fillet welding and formation of rounded part by finishing with a grinder. SOLUTION: Using a brazing filler material 7, a part where the impeller 3 and a lower shroud 4 are consolidated is placed on an upper shroud 2 furnished on both sides with grooves 14 each having a rounded part, and a stress concentration at the root part of each vane is relieved by subjecting the boundary part with the vane part to an electron beam welding from the upper shroud part, and it is possible to manufacture low-cost impeller 1 equipped with an enhanced fatigue strength, free of defects an unwelded portion, and involving less risk of welding deformation.

3. 发明专利

JPH10146688A WELDING JOINT 失效
公开(公告)号：JPH10146688A
公开(公告)日：1998-06-02
申请号：JP30772896
申请日：1996-11-19
申请人： HITACHI LTD
发明人： MOCHIZUKI MASATO , ZEN MUNETOSHI
IPC分类号： B23K31/00 , B23K33/00
摘要： PROBLEM TO BE SOLVED: To reduce the residual stress on the surface of a structure by using a material having the stress to stress relation of being made in a smaller stress against the same strain amount in comparison with the mechanical property of a filler metal of a material to be welded or the filler metal of initial layer side for the filler metal of final layer in the case of forming a structure joint by a multilayer welding method. SOLUTION: A flange 1 of T type welding joint and a web 2 of T type joint are joined with both sides multi layer welding after machining grooves on both sides. In this case, as a filler metal 3 to be made in the joint surface of the final layer, a material is used which has a smaller stress and strain relation against the same strain amount in comparison with the mechanical property of the flange, the web 2 or the initial layer side common filler metal. For example, when the flange 1 and the web 2 are made of carbon steel SM490A, the filler metal equivalent to carbon steel SM400A is used. Since the absolute value of the residual welding stress on the joint surface depends on the yield stress, with this welding method, the residual stress can be reduced and the fatigue strength or the corrosion resistance are improved.

4. 发明专利

JPH04206542A PRESSURE REGULATOR AND STRUCTURE THEREOF 失效
公开(公告)号：JPH04206542A
公开(公告)日：1992-07-28
申请号：JP32930090
申请日：1990-11-30
申请人： HITACHI LTD
发明人： ZEN MUNETOSHI , OTA HIROYUKI , SAKATA HIROSHI
IPC分类号： G01L19/04 , H01L21/66
摘要： PURPOSE:To enable the film formation stress to be measured within a wide temperature range thereby enhancing the precision in the stress simulation in semiconductor film formation process by a method wherein pressure containers, metallic seals and pressure leading-in plate are made of materials in approximate thermal expansion coefficients. CONSTITUTION:The materials in approximate thermal expansion coefficients are used for upper and lower containers 2a, 3a, a susceptor 8 and metallic seals 4a, 4b, 4c of a pressure regulator 1a. The containers 2a, 3a and the susceptor 8 made of aluminum, stainless steel, inconell and ceramics are used in conformity with the film formation temperature while the seals 4a, 4b, 4c made of aluminum, stainless steel and inconell are used. At this time, since the deformation amount of the seals 4a, 4b, 4c is smaller than that of the rubber made O-rings, the surface precision of the containers 2a, 3a whereto the metallic seals are adjacent as well as the parallelism of the susceptor 8 are enhanced. In such a constitution, the physical values can be measured at the near film formation temperature thereby enabling the precision in simulation to be enhanced.

5. 发明专利

JPH0387270A THERMAL RECORDING HEAD 失效
公开(公告)号：JPH0387270A
公开(公告)日：1991-04-12
申请号：JP22533289
申请日：1989-08-31
申请人： HITACHI LTD
发明人： ZEN MUNETOSHI , WATANABE MICHIHIRO , KIYONO TASAKU , OBATA SHIGERU , ATO KAZUHIKO
IPC分类号： B41J2/345
摘要： PURPOSE:To enable bonding to be easily performed by a method wherein a driving IC is arranged separated from a heating board, and an output terminal of the driving IC and a corresponding wiring terminal of the heating board are so positioned as to be within almost the same plane. CONSTITUTION:A heating board 1 and a drive circuit board 2 are fixedly put on an upper surface of a heat sink 3 leaving a space, and a driving IC 4 of a heating resistor is disposed in a row along an outer fringe of the heating board 1 side of the drive circuit board 2. The upper surface of the heat sink 3 of a part on which the driving circuit board 2 is fixedly put is formed by one stage lower than a part on which the heating board 1 is fixedly put so that a position of an output terminal provided on an upper surface of the driving IC 4 and an upper surface of the heating board 1 become on almost the same plane. Then, for assembly of the thermal head, after first bonding the heating board 1 and the driving circuit board 2 simultaneously onto the heat sink 3, the driving IC 4 is mounted on the driving circuit board 2 and then, bonding wires 7, 8, 9 are bonded. Thereafter, a cover 11 is installed.

6. 发明专利

JPH0281648A THICK FILM TYPE THERMAL RECORDING HEAD 失效
公开(公告)号：JPH0281648A
公开(公告)日：1990-03-22
申请号：JP23528488
申请日：1988-09-20
申请人： HITACHI LTD
发明人： SATOU KAZUYASU , WATANABE MICHIHIRO , ZEN MUNETOSHI , OBATA SHIGERU , ATO KAZUHIKO
IPC分类号： B41J2/345 , B41J2/35
摘要： PURPOSE:To eliminate the irregularity of density due to the irregularity of a resistance value and to enhance printing quality by providing a means for measuring the resistance value of a resistor in lowering the resistance value of the resistor by applying voltage to said resistor to change an applying voltage value so as to bring the change quantity of the resistance value to a predetermined or definite value. CONSTITUTION:In such a case that the resistance value of a resistor is made larger than an objective resistance value and lowered by applying voltage to said resistor to be allowed to approach the objective resistance value, the resistance value is measured and an applying voltage value is changed so that the change quantity of the resistance value becomes a predetermined or definite value. By this method, the resistance value can be allowed to approach the objective resistance value without exceeding said objective resistance value. In this case, in order to allow the resistance value to approach the objective resistance value as near as possible, the applying voltage value is changed so that the change quantity of the resistance value becomes a small value. When the change quantity of the resistance value is set to a small value from the beginning in lowering the resistance value, a long time is required until the resistance value approaches the objective one and, therefore, a change rate is largely set at the beginning and pref. set to a small level when it is judged that the resistance value is approaching the objective one.

7. 发明专利

JPH01128849A THICK-FILM-TYPE HEAT SENSITIVE RECORDING HEAD 失效
公开(公告)号：JPH01128849A
公开(公告)日：1989-05-22
申请号：JP28731287
申请日：1987-11-16
申请人： HITACHI LTD
发明人： SATOU KAZUYASU , WATANABE MICHIHIRO , ZEN MUNETOSHI , OBATA SHIGERU , ATO KAZUHIKO
IPC分类号： B41J2/335
摘要： PURPOSE:To make it possible to increase the thermal conductivity of a protective film material, by mixing metallic particles or particles of metal oxides having good thermal conductivity into the protective film by a specific rate. CONSTITUTION:A glaze layer 4, an electrode 3, a resistor 2 and a protective film 1 are laminated one after another in this order onto an alumina substrate 5, thereby to obtain a thick-film-type heat sensitive recording head. A thermal energy produced by the application of voltage to the resistor reaches an ink paper through the protective film, so that the molten ink or sublimed ink is transferred onto a transfer paper. When metal particles or particles of metal oxides having good thermal conductivity are mixed in a glass material which is material for the protective film of the head, the thermal conductivity can be enhanced depending on the mixing amount. However, if the surface of the protective film has poor smoothness, the stick slips or the ink paper are adhered onto the head, resulting in the deterioration of the image quality. Thereafter, the mixing amount of the metallic particles or particles of metal oxides are set to be less than 10weight%.

8. 发明专利

JPS6463162A THERMAL RECORDING HEAD 失效
公开(公告)号：JPS6463162A
公开(公告)日：1989-03-09
申请号：JP22107587
申请日：1987-09-03
申请人： HITACHI LTD
发明人： OBATA SHIGERU , WATANABE MICHIHIRO , ZEN MUNETOSHI , SATOU KAZUYASU , ATO KAZUHIKO
IPC分类号： G01D15/10 , B41J2/335
摘要： PURPOSE:To ensure the reliability of a head and to enhance a thermal efficiency, by forming a heating resistor layer around electrodes provided on one surface of an alumina substrate through a heat accumulation layer made of a glass and further forming a heat-dissipating layer on the other surface of the alumina substrate through a heat insulating layer made of a low-heat conductivity material. CONSTITUTION:Application of pulse to electrodes 15 generates heat from a heating resistor layer 16 disposed around the electrodes 15. The heat energy is mostly transmitted to a recording ink material, but is partially transmitted to an alumina substrate 13 through a heat accumulation layer 14 as a heat to be released. This heat to be released is accumulated in the alumina substrate 13 because a heat insulating layer 12 having a low heat conductivity inhibits the rapid heat transmittance to a heat-dissipating layer 11. In this manner, the heat to be released is accumulated in the alumina substrate 13, whereby a head is thermally insulated as a whole. The heat-accumulation layer 14 directly abutting against the heating resistor layer 16 is made of a glass. As a result, the head can be prevented from separating at the heat-accumulation layer 14 even in the long-term use, and the reliability of the head is ensured.

9. 发明专利

JPS63276562A PREPARATION OF THICK FILM THERMAL HEAD 失效
公开(公告)号：JPS63276562A
公开(公告)日：1988-11-14
申请号：JP5004287
申请日：1987-03-06
申请人： HITACHI LTD
发明人： ZEN MUNETOSHI , WATANABE MICHIHIRO , SATOU KAZUYASU , OBATA SHIGERU , ATO KAZUHIKO
IPC分类号： B41J2/335
摘要： PURPOSE:To remove the warpage or undulation on a substrate, to reduce the surface roughness of the substrate and to enhance the flatness thereof, by sticking a polishing material having a width the same to that of the substrate on a polishing roller through a rubber material after the screen printing, drying and baking of a resistance body and pressing the same against the surface of the resistance body under definite load to integrally polishing said resistance body. CONSTITUTION:A common electrode 8 and an electrode 9 to which a recording signal is selectively applied are provided to the plane of an insulating substrate 2. A heat generating resistance body 10 is formed by printing a resistance paste of ruthenium oxide in a desired thickness by a screen printing method and drying and baking the paste layer. After the heat generating resistance body 10 is formed to the substrate 2 and backed, a polishing material 13, for example, a diamond film is sticked on a polishing roller 1 through a rubber part 14 composed of a cushion material and pressed to the heat generating resistance body 10 and the polishing roller 1 is rotated to polish the polishing part 16 of the resistance body. By this method, the unevenness on the heat generating resistance body 10 is removed. A protective layer 11 is molded so as to have an objective value with a small particle size and a reduced number of rotations since the hardness thereof is lower than that of the heat generating resistance body 10.

10. 发明专利

JPS6242857A METHOD FOR PREPARING THICK FILM TYPE THERMAL RECORDING HEAD 失效
公开(公告)号：JPS6242857A
公开(公告)日：1987-02-24
申请号：JP18171585
申请日：1985-08-21
申请人： HITACHI LTD
发明人： ZEN MUNETOSHI , WATANABE MICHIHIRO , SATOU KAZUYASU , ATO KAZUHIKO
IPC分类号： B41J2/335 , B41J2/345 , H01C7/00 , H01C17/06
摘要： PURPOSE:To enhance image capacity by reducing the irregularity in the resistance value of a heat generating resistor, by separating and shaping a heat generating resistor formed so as to cover a large number of current supply electrode patterns opposed to each other formed to the upper surface of a heat resistant layer by laser cutting so as to separate and form pairs of electrode patterns. CONSTITUTION:A pattern wherein the branched wires 121-12n of a common wire 12 and electrodes 131-13n correspond and oppose to each other so as to form pairs is formed on a substrate 15 having a heat resistant layer provided thereto. Appropriate intervals A are provided between both leading ends of the electrodes and the branched wires of the common wire 12. A strip like heat generating resistor 14 is connected and fixed to the substrate 15 so as to cover the upper parts of the leading ends of a large number of the electrodes and the branched wires 121-12n of the common wire 12 in a contacted state. Next, the strip like heat generating resistor 14 is cut and separated between adjacent electrodes by laser cutting not only to form a pair of thick film heads but also to perform shaping. By this method, because the thick film head has the same head shape as a thin film head, the irregularity in the resistance value of a resistor is reduced.

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