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1. 发明专利

JPH01137074A TEMPORARY SUPPORT STRUCTURE AND METHOD OF INSTALLATION CONSTRUCTION OF NUCLEAR REACTOR CONTAINER 失效
公开(公告)号：JPH01137074A
公开(公告)日：1989-05-30
申请号：JP29567587
申请日：1987-11-24
申请人： HITACHI LTD , HITACHI SERVICE ENG
发明人： SHIMIZU KIYOSHI , SUZUKI TADAO , NAGASE KATSUICHI , TAJIRI AKINORI , NAKAMURA YUTAKA
IPC分类号： E02D27/32 , E04G21/14 , E04H7/00 , G21C13/00
摘要： PURPOSE: To facilitate removal and recovery and to improve the safety and reliability of work by making temporary supports hollow and floatable on water in the temporary support state before a pressure-proof leakage test during the installation process of a reactor container. CONSTITUTION: During the installation process of a reactor container 10, assembling and temporary installation are conducted at the prescribed height position from a calotte 9 for a pressure-proof leakage test. Temporary supports 1a, 1b, 1c temporarily supporting the reactor container 10 are formed into shapes compatible with the contact faces of the reactor container 10 and the calotte 9, and they have a hollow structure and water-floatable specific gravity. For permanent installation utilizing water jacks, the temporary supports 1a-1c floating on water after water is filled are recovered. The removing work of the temporary supports 1a-1c before water is filled is not required, workability is improved, and the reactor container 10 can be prevented from being deformed.

2. 发明专利

JPS62258039A REINFORCEMENT STRUCTURE FOR OPENING PART OF CONCRETE STORAGECONTAINER 失效
公开(公告)号：JPS62258039A
公开(公告)日：1987-11-10
申请号：JP9796586
申请日：1986-04-30
申请人： HITACHI LTD , HITACHI SERVICE ENG
发明人： SHIMIZU KIYOSHI , TAJIRI AKINORI , OUCHI TARO , NAKAMURA YUTAKA
IPC分类号： G21C13/00 , E04C5/00

3. 发明专利

JPS60169797A METHOD OF CONSTRUCTION OF HOUSING FOR NUCLEAR POWER PLANT 失效
公开(公告)号：JPS60169797A
公开(公告)日：1985-09-03
申请号：JP2576584
申请日：1984-02-14
申请人： HITACHI LTD , HITACHI SERVICE ENG
发明人： SHIMIZU KIYOSHI , OOUCHI TAROU
IPC分类号： G21C13/00

4. 发明专利

JPS5325358A POSITIONING METHOD OF SMALL OBJECTS 失效
公开(公告)号：JPS5325358A
公开(公告)日：1978-03-09
申请号：JP9969276
申请日：1976-08-23
申请人： HITACHI LTD
发明人： NISHIDA SHIYOUICHIROU , SHIMIZU KIYOSHI , SASAKI SHIGETO , TAKAHASHI SEIZOU
IPC分类号： H01L21/68 , H01L21/58
摘要： PURPOSE:In positioning a small object to a predetermined position, the positioning of the small object is accurately performed by using a scope comprising bundling plural glass fibers to an integral unit.

5. 发明专利

JPS5314575A VACUUM PINCETTE 失效
公开(公告)号：JPS5314575A
公开(公告)日：1978-02-09
申请号：JP8817076
申请日：1976-07-26
申请人： HITACHI LTD
发明人： NISHIDA SHIYOUICHIROU , SHIMIZU KIYOSHI , SASAKI SHIGETO , TAKAHASHI SEIZOU , WATANABE TAKEFUMI
IPC分类号： H01L21/677 , H01L21/48
摘要： PURPOSE:To increase the efficiency of arraying and conveying of small parts by disposing plural suction nozzles communicating to the common vacuum hole within a main body via flexible tubes to the end of the main body and providing a hole for stopping vacuum suction through finger opening and closing as well as an adjusting tool for adjusting nozzleto-nozzle spacings to the main body.

6. 发明专利

JPS5314563A FIXING METHOD OF SEMICONDUCTOR PELLET TO LEAD FRAME 失效
公开(公告)号：JPS5314563A
公开(公告)日：1978-02-09
申请号：JP8816976
申请日：1976-07-26
申请人： HITACHI LTD
发明人： NISHIDA SHIYOUICHIROU , SHIMIZU KIYOSHI , SASAKI SHIGETO , TAKAHASHI SEIZOU
IPC分类号： H01L23/50 , H01L21/58
摘要： PURPOSE:To prevent pellet failure and positively fix the pellet to a lead frame by elastically holding and fixing the pellet from the lateral side thereof with the protruding metal pieces disposed around a tab.

7. 发明专利

JP2007334285A Sound absorbing structure and rail vehicle 审中-公开
标题翻译：声音吸收结构和轨道车辆
公开(公告)号：JP2007334285A
公开(公告)日：2007-12-27
申请号：JP2006329280
申请日：2006-12-06
申请人： Bridgestone Kbg Co Ltd , Hitachi Ltd , ブリヂストンケービージー株式会社 , 株式会社日立製作所
发明人： ITO KOICHI , TAKANO YASUSHI , MUTO DAISUKE , WATANABE MAKOTO , TANUMA TAKAYOSHI , SHIMIZU KIYOSHI , IIDA KAZUYOSHI , TAMATA SEIJI
IPC分类号： G10K11/16 , B61D49/00 , G10K11/162
摘要： PROBLEM TO BE SOLVED: To provide a sound absorbing structure that improves sound absorption characteristics in a frequency range of 500 Hz to 1 kHz without making a porous material thick nor increasing an air layer.
SOLUTION: The sound absorbing structure 1 is constituted by arranging a multilayer structure 2 having a filmy structure 5 sandwiched between mesh structures 4 on a top-surface side of a fabric material 6 of a sound absorbing material 3 having the fabric material 6 bonded or fused on its top surface. In this sound absorbing structure 1, the multilayer structure 2 excited with acoustic incident energy behaves as a multi-mass-point system, and vibrations between the mesh structures 4 and filmy structure 5 are transduced by friction into heat energy, and further transduced into heat energy by viscous resistance based upon vibrations of fibers, friction between fibers, and air vibrations. Consequently, efficiency of transduction from the acoustic incident energy to the heat energy increases to improve the sound absorption characteristics in intermediate/low frequency ranges without varying the thickness of the sound absorbing structure.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在500Hz至1kHz的频率范围内改善吸声特性而不使多孔材料变厚或增加空气层的吸音结构。解决方案：吸音结构1通过在具有织物材料6的吸声材料3的织物6的顶表面侧上布置具有夹在网状结构4之间的膜状结构5的多层结构2 在其顶表面上粘合或熔合。在这种吸音结构1中，用声波入射能激发的多层结构2表现为多质点系统，网状结构4和薄膜结构5之间的振动通过摩擦转换成热能，并进一步转换成热基于纤维的振动，纤维之间的摩擦和空气振动的粘性阻力的能量。因此，从声学入射能量到热能的转换效率增加，以改善中频/低频范围内的吸声特性，而不改变吸音结构的厚度。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JPH02168090A INSTALLATION METHOD FOR PIPING, VALVE, AND SUPPORT AND SUPPORT STRUCTURE 失效
公开(公告)号：JPH02168090A
公开(公告)日：1990-06-28
申请号：JP32464188
申请日：1988-12-22
申请人： HITACHI LTD
发明人： TAKANO HIROSHI , NOCHIDA KOICHI , SHIMIZU KIYOSHI
IPC分类号： E04F17/08 , F16L1/00
摘要： PURPOSE:To reduce the number of working processes by a method wherein a support is previously divided into upper and a lower leg part and the division parts are expandably engaged with each other, the upper leg part is secured to a ceiling part in a building, and the upper leg part is engaged with the support lower leg part of an integrally formed unit. CONSTITUTION:A support upper leg part 22 is centered to a ceiling part embedding metal 3 for setting by means of a lifter. In this case, a hoist rope 4 is set to a rotatable jig 23. A piping 5, a valve 6, and a support leg part 21 are assembled together on an indoor floor for welding. A rope 4 is secured to a bolt 24 inserted through a bolt through-hole 26 of a support leg part 21, an integrally formed unit is hoisted, and the upper and lower leg parts 22 and 21 are engaged with each other by sliding the bolt 24 and a groove 25 to perform a work to regulate the level position of the integrally formed unit. Temporary fastening and securing are effected by means of the bolt 24, and the two leg parts 22 and 21 are joined together by weld.

9. 发明专利

JPS51126067A RESIN SEALING FORM SEMIICONDUCTOR EQUIPMENT 失效
公开(公告)号：JPS51126067A
公开(公告)日：1976-11-02
申请号：JP4966975
申请日：1975-04-25
申请人： HITACHI LTD
发明人： SHIMIZU KIYOSHI , TAKESHIKE NAOHIKO
IPC分类号： H01L23/34 , H01L23/12 , H01L23/28 , H01L23/50
摘要： PURPOSE:Resin sealing form semi-conductor equipment being able to easily combine elements and also to establish a radiator able to radiate effectively the heat from the pellet.

10. 发明专利

JPS51112276A RESIN MOLDED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS51112276A
公开(公告)日：1976-10-04
申请号：JP3671475
申请日：1975-03-28
申请人： HITACHI LTD
发明人： NISHIDA SHIYOUICHIROU , SHIMIZU KIYOSHI , TAKAHASHI SEIZOU , NISHIZAWA KAZUNORI
IPC分类号： H01L23/50 , H01L23/04 , H01L23/12 , H01L23/28
摘要： PURPOSE:To obtain a semiconductor device which requires no dam cutting and trimming.

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