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1. 发明专利

JPS5161879A Totsukikenshutsusochi 失效
公开(公告)号：JPS5161879A
公开(公告)日：1976-05-28
申请号：JP13549374
申请日：1974-11-27
申请人： Hitachi Ltd , Hitachi Metals Ltd
发明人： SHIMOMURA YUKIJI , GOTO TATSUO , SAKAI NAOMI , ITO HISAAKI
IPC分类号： G01N27/82 , G01B7/28 , G01B7/34 , G01B21/20 , G01B21/30 , G01N27/00

2. 发明专利

JPS5166658A Butsutaihosokusochi 失效
公开(公告)号：JPS5166658A
公开(公告)日：1976-06-09
申请号：JP13842074
申请日：1974-12-04
申请人： Hitachi Ltd , Hitachi Metals Ltd
发明人： SHIMOMURA YUKIJI , YAMAGUCHI SUMIO , MATSUMURA YASUHIDE , GOTO TATSUO , ITO HISAAKI , SAKAI NAOMI
IPC分类号： F16H27/06 , B25J17/00

3. 发明专利

JPS5161878A Totsukikenshutsuki 失效
公开(公告)号：JPS5161878A
公开(公告)日：1976-05-28
申请号：JP13549274
申请日：1974-11-27
申请人： Hitachi Ltd , Hitachi Metals Ltd
发明人： SHIMOMURA YUKIJI , YAMAGUCHI SUMIO , GOTO TATSUO , SAKAI NAOMI , ITO HISAAKI
IPC分类号： G01N27/82 , G01B5/20 , G01B5/207 , G01B5/28 , G01N27/00

4. 发明专利

JPS5166889A Kyokumenbutsutaiototsukenshutsusochi 失效
公开(公告)号：JPS5166889A
公开(公告)日：1976-06-09
申请号：JP13549174
申请日：1974-11-27
申请人： Hitachi Ltd , Hitachi Metals Ltd
发明人： SHIMOMURA YUKIJI , HABU TOORU , GOTO TATSUO , ITO HISAAKI , SAKAI NAOMI
IPC分类号： G01N27/82 , G01B5/00 , G01B5/28 , G01B7/34 , G01B21/30
CPC分类号： G01B7/345 , G01B5/285

5. 发明专利

JPS5161946A Butsutaikiseininshikisochi 失效
公开(公告)号：JPS5161946A
公开(公告)日：1976-05-28
申请号：JP13549574
申请日：1974-11-27
申请人： Hitachi Ltd , Hitachi Metals Ltd
发明人： SHIMOMURA YUKIJI , TAKEYASU KYOO , YAMAGUCHI SUMIO , SAKAI NAOMI , ITO HISAAKI , GOTO TATSUO
IPC分类号： B23Q7/00 , B25J19/00 , B25J19/02 , G01B5/00 , G01B5/004 , G01B7/00 , G01B7/312 , G01B21/00

6. 发明专利

JPS5161947A Jidosochakusochi 失效
公开(公告)号：JPS5161947A
公开(公告)日：1976-05-28
申请号：JP13549674
申请日：1974-11-27
申请人： Hitachi Ltd , Hitachi Metals Ltd
发明人： SHIMOMURA YUKIJI , YAMAGUCHI SUMIO , HABU TOORU , TAKEYASU KYOO , GOTO TATSUO , ITO HISAAKI , SAKAI NAOMI
IPC分类号： B23Q7/04 , B25J9/00 , B25J15/06

7. 发明专利

JPS5133459A 失效
公开(公告)号：JPS5133459A
公开(公告)日：1976-03-22
申请号：JP10610474
申请日：1974-09-17
申请人： HITACHI LTD , HITACHI METALS LTD
发明人： SHIMOMURA YUKIJI , GOTO TATSUO , ITO HISAAKI , SAKAI NAOMI
IPC分类号： B25J15/00 , B07C5/02 , B25J15/08 , B25J19/00 , B25J19/02 , G01B5/20 , G01B21/00

8. 发明专利

JPH01102951A SEMICONDUCTOR LEAD FRAME WITH EXCELLENT RESIN CLOSE-CONTACT PERFORMANCE 失效
公开(公告)号：JPH01102951A
公开(公告)日：1989-04-20
申请号：JP26062987
申请日：1987-10-15
申请人： HITACHI METALS LTD
发明人： WATANABE RIKIZO , SEO TAKEHISA , SAKAMOTO DAIJI , ITO HISAAKI , IKO KAZUO , TABATA HARUO
IPC分类号： H01L23/50
摘要： PURPOSE:To obtain a lead frame whose close contact performance with reference to a resin has been enhanced without lowering plating performance and soldering performance by a method wherein an amount of C measured by using an X-ray photoelectron spectroscopic analytical method on the surface obtained by removing a range of 10Angstrom from the surface of an object to be tested is contained at less than a specific amount. CONSTITUTION:An amount of C measured in the surface obtained by removing a range of 10Angstrom from the surface of an object to be tested by using an X-ray photoelectron spectroscopic analytical method is made to be 20 atomic % or below in order to check a situation contaminated by C, the surface is sputtered for one minute; the surface is removed by about 10Angstrom ; this surface is analyzed; when the close contact performance with reference to a resin is good, 20 atomic % or below of C is contained; when the close contact performance is bad, C exceeding 20 atomic % is contained. At a face at about 30Angstrom from the outermost surface, a part contaminated by C and O is almost removed irrespective of whether the close contact performance is good or bad. In order to reduce contamination by C on the surface of a lead frame, an annealing method in dry hydrogen, a careful cleaning method by using a surfactant and an organic solvent or the like is effective.

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