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1. 发明专利

JP2003023134A Semiconductor device and its manufacturing method 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2003023134A
公开(公告)日：2003-01-24
申请号：JP2001207701
申请日：2001-07-09
申请人： Hitachi Hokkai Semiconductor Ltd , Hitachi Ltd , 日立北海セミコンダクタ株式会社 , 株式会社日立製作所
发明人： OGASAWARA KAZUTO , TANAKA MITSUGI , TOMIHARA SEIICHI
IPC分类号： H01L23/28 , H01L21/56 , H01L21/68 , H01L23/12 , H01L23/31 , H01L23/495 , H01L23/50
CPC分类号： H01L21/568 , H01L21/561 , H01L21/566 , H01L23/3107 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/18165 , H01L2224/85 , H01L2224/83 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve reliability by preventing lead sag from protruding on a lead mounting surface. SOLUTION: This semiconductor device consists of a sealing resin part 3 having a plurality of side surfaces 3b and rears 3a formed between the side surfaces 3b, a semiconductor chip 2 having a plurality of pads 2a on a main surface 2b, a plurality of leads 1a which are formed of conductor and have bonding parts 1d, terminal parts 1b for external connection and cutting parts 1c, a plurality of wires 4 for connecting a plurality of the leads 1a with a plurality of the pads 2a of the semiconductor chip 2, and a tab 1e on which the semiconductor chip 2 is mounted. The cutting part 1c in the lead 1a is made thinner than the terminal part 1b for external connection, thereby reducing the lead sag which is generated on the side surfaces 3b of the sealing resin part 3 when leads are cut by dicing after molding.
摘要翻译：要解决的问题：通过防止铅下垂在引线安装表面上突出来提高可靠性。解决方案：该半导体器件由具有多个侧表面3b和形成在侧表面3b之间的凸起3a的密封树脂部件3，在主表面2b上具有多个焊盘2a的半导体芯片2，多个引线1a 由导体形成，具有接合部分1d，用于外部连接的端子部分1b和切割部分1c，用于将多个引线1a与半导体芯片2的多个焊盘2a连接的多个导线4和突片1e，其上安装有半导体芯片2。引线1a中的切割部分1c比外部连接的端子部分1b薄，从而减少了在模制之后通过切割切割引线时在密封树脂部件3的侧表面3b上产生的引线凹陷。

2. 发明专利

JP2002118201A SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 失效
公开(公告)号：JP2002118201A
公开(公告)日：2002-04-19
申请号：JP2000306048
申请日：2000-10-05
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： TOMIHARA SEIICHI
IPC分类号： H01L23/12 , H01L21/301 , H01L21/56 , H01L21/58 , H01L23/31 , H01L23/498 , H05K3/00 , H05K3/24 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To improve the quality of a semiconductor device by preventing the peeling between a molding resin and the semiconductor. SOLUTION: There is prepared a film substrate 2 which can deform so as to follow the hardening and shrinking of the molding resin and has a plurality of demarcated device regions. After collective molding is performed in the chip supporting side of the film substrate 2 to collectively cover the device regions, a cutting blade 10 is entered from the rear surface of the film substrate 2 toward the collective molding 8, at the time of dicing to separate the film substrate 2 for every device region by a down cutting method. Thus, the substrate peeling can be prevented at the time of dicing.

3. 发明专利

JPH08130286A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08130286A
公开(公告)日：1996-05-21
申请号：JP26851194
申请日：1994-11-01
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： TSUGANE MASAYOSHI , TOMIHARA SEIICHI
IPC分类号： H01L21/60 , H01L23/28 , H01L23/50
摘要： PURPOSE: To provide a semiconductor device which prevents the contact of a connecting lead with the end of a semiconductor chip due to the variation in the lead by resin at the time of filling the resin. CONSTITUTION: The semiconductor device comprises a die pad 2 to place a semiconductor chip 1, inner leads 4 disposed on the periphery of the pad 2, and a TAB tape 6 connected at the one end to the electrode pad 9 of the chip 1 and at the other to the leads 4 in the state the part is supported in an insulating manner by the pad 2. The tape 6 operated as the connecting lead is partly supported by the pad 2 via an insulating film 8, and hence the contact of the lead 7 with the end 1A of the chip 1 due to the variation of the lead 7 with the resin at the time of filling the resin can be prevented.

4. 发明专利

JP2002064114A SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002064114A
公开(公告)日：2002-02-28
申请号：JP2000248744
申请日：2000-08-18
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： KASUGA TAKAHIRO , TOMIHARA SEIICHI , TASAKA KAZUO
IPC分类号： H01L23/28 , H01L21/56 , H01L23/31 , H01L23/50 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To inhibit the occurrence of resin cracks or rubbish when cutting gate- and air vent-curing resins in the manufacture of a non-lead semiconductor device. SOLUTION: The manufacture of the non-lead semiconductor device has a sealing body, and the gate- and air vent-curing resin allowed to remain by exposing a lead and a tab-suspending lead on the packaging surface of the sealing body for forming the sealing body. No grooves for allowing a distance resin to flow are provided in the entire circumference of the cavity of a mold die for forming the sealing body. Outside a region with no grooves, gate and air vents are provided. The resin between the cavity and the gate and air vents is allowed to flow through the gap between the adjacent leads and tab- suspending leads. When the lead and tab-suspending lead are cut at a place with no grooves, the surface of the gate- and air vent-curing resins is the same as the lead and tab-suspending lead and at the same time is flat, thus inhibiting the occurrence of the resin rubbish and cracks.

5. 发明专利

JPH09306944A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH09306944A
公开(公告)日：1997-11-28
申请号：JP12006496
申请日：1996-05-15
申请人： HITACHI LTD , HITACHI MICROCOMPUTER SYST , HITACHI HOKKAI SEMICONDUCTOR
发明人： ICHIHARA SEIICHI , TOMIHARA SEIICHI , SUZUKI HIROMICHI , HARUTA AKIRA , TSUBOSAKI KUNIHIRO , OKADA JOJI , KANEMITSU NOBUYA
IPC分类号： H01L21/60 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To reduce the number of leads with keeping a good throughput and suppressing the cost. SOLUTION: Coupling members 7 for electrically connecting those electrode pads for input/output of common signals among signal input/output electrode pads formed on a semiconductor chip 2 with specified circuit elements are formed on the chip 2. Leads 6 are composed of common leads 6a and independent leads 6b. The coupling members 7 are electrically connected to the common leads 6a and electrode pads other than the electrically connected pads are electrically connected to the independent leads 6b.

6. 发明专利

JPH08213540A LEAD FRAME, MANUFACTURE THEREOF, AND MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08213540A
公开(公告)日：1996-08-20
申请号：JP2008295
申请日：1995-02-08
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： TSUGANE MASAYOSHI , TOMIHARA SEIICHI
IPC分类号： H01L23/50 , H05K3/34
摘要： PURPOSE: To enhance the tips of outer leads in solder wettability and to enable solder to adhere to them by a method wherein a frame and a lead section separate from each other are fixed together with the tips of the outer leads. CONSTITUTION: A lead frame is composed of a frame 8 and a lead section 7 separate from each other, where the frame 8 and the lead section 7 are fixed together at the tips of outer leads 3b of leads 3 or the periphery of the lead frame is defined by the frame 8, and the lead section 7 is provided inside the frame 8. The tip faces of the outer leads 3b are exposed when the outer leads 3b are subjected to surface treatment, and a gap is provided between the frame 8 and the tip faces of the outer leads 3b. Therefore, the tip faces are coated with a surface treatment material 10, so that they are hardly deteriorated in solder wettability, and solder is attached enough to the tips of the outer leads 3b.

7. 发明专利

JPH08107176A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08107176A
公开(公告)日：1996-04-23
申请号：JP24270994
申请日：1994-10-06
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： TSUGANE MASAYOSHI , TOMIHARA SEIICHI
IPC分类号： H01L21/60 , H01L23/28 , H01L23/50
摘要： PURPOSE: To prevent tie leads from touching the end of a semiconductor chip by moving the leads due to a resin being charged. CONSTITUTION: A semiconductor device has a die pad 2 which mounts a semiconductor chip 1, tie lead supporting pad 4 coupled with the pad 2 and disposed around this pad at a higher position than it, TAB leads 9 supported with the pad 4 wherein one end of each lead 9 is connected to an electrode pad 11, and inner leads 6 connected to the other ends of the leads 9. Since the pad 4 is held higher than the pad 2, the leads 9 moves due to the charging of a resin so as to prevent them from touching the end 1A of the chip 1.

8. 发明专利

JP2001267484A SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 失效
公开(公告)号：JP2001267484A
公开(公告)日：2001-09-28
申请号：JP2000070817
申请日：2000-03-14
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： TOMIHARA SEIICHI
IPC分类号： H01L23/28 , H01L21/56 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To prevent short between a tab or tab suspension lead and a lead, related to a small semiconductor device of tab-exposed structure. SOLUTION: There are provided a sealing part 3 formed by resin-sealing a semiconductor chip 2; a tab 1b comprising a chip support surface 1c and an exposed surface 1d opposite to it, where a protruding part 1f protruding above the exposed surface 1d is formed at the peripheral part of the chip support surface 1c; a tab suspension lead 1e which extends from the tab 1b and is exposed on a rear surface 3a of the sealing part 3, a plurality of leads 1a provided around the tab 1b and so arranged as to expose a connected surface 1g at the outer peripheral part of the rear surface 3a of the sealing part 3; and a bonding wire 4 connecting a pad 2a of the semiconductor chip 2 to the lead 1a. An area of the exposed surface 1d of the tab 1b is smaller than the chip support surface 1c so that a chip mounting region of the chip supports surface 1c is assured, while a clearance between the tab 1b of the rear surface 3a of the sealing part 3 and the lead 1a is assured.

9. 发明专利

JP2001122380A MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND TRAY USED FOR THE METHOD 失效
公开(公告)号：JP2001122380A
公开(公告)日：2001-05-08
申请号：JP30631899
申请日：1999-10-28
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： TOMIHARA SEIICHI
IPC分类号： B65D85/86
摘要： PROBLEM TO BE SOLVED: To prevent the adhesion of foreign matters on outer terminals of a semiconductor device and reduce the defective mountings and also improve the yield thereof. SOLUTION: A semiconductor device is provided with a recessed pocket 1a formed on the surface 1e and having a protrusion 1b supporting a flat section 2d on the back 2c of a main body section 2a of one QFN 2 formed on a section 1c and a guide section 18 formed on the back 1f and supporting a surface outer peripheral section 2b of the main body section 2a of another QFN 2 laminated and disposed with one QFN 2 and positioning another QFN 2. When a plurality of traces 1 are overlapped, one QFN 2 is clamped by the protrusion 1b of one tray 1 and the guide section 1g of another tray 1 disposed on the upper side on the pocket 1a of the tray 1 disposed on the lower side and one QFN 2 is positioned by the guide section 1g and protrusion 1b is formed on the bottom 1c of the pocket 1a to prevent the adhesion of foreign matters 9 on leads 2e of the QFNs 2.

10. 发明专利

JPH08204097A LEAD FRAME AND SEMICONDUCTOR DEVICE STRUCTURE USING IT 失效
公开(公告)号：JPH08204097A
公开(公告)日：1996-08-09
申请号：JP941495
申请日：1995-01-25
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： MIYAKI YOSHINORI , TOMIHARA SEIICHI
IPC分类号： H01L23/50
摘要： PURPOSE: To considerably enhance heat radiation of a semiconductor chip by a method wherein there is provided heat-reading radiating means for radiating heat generated in the semiconductor chip directly toward the atmosphere not via a package. CONSTITUTION: In a die pad 2, there is provided a heat sink (heat-radiating means) 4 being a cross-shaped heat-radiating part constituting a single cross shape in a plane direction of the die pad 2 so as to project in a thickness direction of the die pad 2. A lead frame 1 forming the cross-shaped heat sink 4 is resin-sealed to form a QFP-type semiconductor device 5. The semiconductor device 5 is resin-sealed under a condition that the cross-shaped heat sink 4 constituting a single cross shape in a plane direction of the die pad 2 projects in a thickness direction of the die pad 2 and is located in the same height as a surface of a package 6, and the surface of the heat sink 4 is exposed in the atmosphere. As the heat sink 4 is a part of the die pad 2, it is possible to radiate heat generated from a semiconductor chip 7 directly toward the atmosphere not via the package 6 low in heat conductivity, and considerably enhance heat radiation of the semiconductor chip 7.

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