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1. 发明专利

JPS63107127A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS63107127A
公开(公告)日：1988-05-12
申请号：JP25174486
申请日：1986-10-24
申请人： HITACHI LTD , HITACHI COMPUTER ENG
发明人： KOBAYASHI ISAO , YAMADA TAKEO
IPC分类号： H01L21/60
摘要： PURPOSE:To improve reliability without an insulating film, which is yielded at a junction between different kinds of metals, or without the yield of electrically nonconducting surface, by bonding two Si chips in a form of Al pads, Al conductor parts and Al bumps. CONSTITUTION:Through holes are provided in a passivation film 2 of an upper chip 1. Al conductor parts 3 are formed in the through holes. The Al conductor parts 3 are connected to an inner Al electrode wiring 4 in said chip 1. Through holes are likewise provided in a passivation film 8 at the surface of a lower chip 7. Al conductor parts 9 are formed in the through holes. The Al conductor parts 9 are connected to an inner Al electrode wiring 10 in said chip 7. Al bumps 13 and 14 are formed on the surface of the chips 1 and 7. Heat and pressure are applied on the upper and lower chips 1 and 7 at a high temperature of 590-610 deg.C in a high vacuum state of 10 -10 torr. Then a chip-bonded product, in which the chip 1 and the chip 7 are rigidly bonded, is obtained.

2. 发明专利

JPS62169452A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62169452A
公开(公告)日：1987-07-25
申请号：JP1012386
申请日：1986-01-22
申请人： HITACHI LTD , HITACHI COMPUTER ENG
发明人： KOIKE JUNICHI , KOBAYASHI ISAO
IPC分类号： H01L23/28 , H01L23/31 , H01L25/04 , H01L25/18
摘要： PURPOSE:To prevent the destruction of a CCB connected part caused by silicon gel by a method wherein a spacer is placed between a mother chip and a child chip. CONSTITUTION:A spacer 3 is interposed between a mother chip 1 and a child chip 2. The child chip 2 is fixed to the mother chip 1 with its protruded electrodes 4 and 4. The spacer 3 is fixed to the mother chip 1 in advance using a silicon rubber bonding agent and the like. As a result, the quantity of the silicon gel 14 filled into the gap of the chips 1 and 2 can be reduced, the thermal stress generated by the thermal expansion of the gel can be reduced, and the effect inflicted to the connected part of these chips 1 and 2 can also be lessened, thereby enabling the title semiconductor device to prevent the damage on the connected part caused by thermal stress.

3. 发明专利

JPH0457104B2 失效
公开(公告)号：JPH0457104B2
公开(公告)日：1992-09-10
申请号：JP24592984
申请日：1984-11-22
申请人： HITACHI COMPUTER ENG
发明人： KOBAYASHI ISAO , SAITO TETSUYA
IPC分类号： H01L23/24 , H01L23/433

4. 发明专利

SG38886A1 Supporting mechanism of disk unit in magnetic disk apparatus 未知
公开(公告)号：SG38886A1
公开(公告)日：1997-04-17
申请号：SG1995001882
申请日：1995-11-21
申请人： HITACHI LTD
发明人： KOBAYASHI ISAO , KANEKO JIRO , UEFUNE KOUKI , SUZUKI TOMIO , TAKAHASHI TSUYOSHI
IPC分类号： G11B25/04 , G11B33/08 , G11B33/12 , G11B33/00
摘要： A magnetic disk apparatus includes a link mechanism constructed by at least a flexible portion and a hard member and one end of the link mechanism is attached to a fixing unit (6) and the other end is attached to a hard disk assembly (1) so that the flexible portion of the link mechanism is located on a straight line which passes through the center of gravity of the hard disk assembly, thereby having a sufficient rigidity for a disturbance in the straight line direction which acts on the HDA (Hard Disk Assembly) (1) and reducing a natural frequency of the HDA for the disturbance in the rotating direction of the HDA.

5. 发明专利

AT125830T 未知
公开(公告)号：AT125830T
公开(公告)日：1995-08-15
申请号：AT90124559
申请日：1990-12-18
申请人： HITACHI LTD
发明人： KUROISHI KAZUYOSHI , NAKA REISHI , KOBAYASHI ISAO , TANAKA KOUSUKE , GOTOO KATUHIKO
IPC分类号： F25D23/08 , C08G18/00 , C08G18/48 , C08G18/50 , C08G18/72 , C08G18/80 , C08G101/00 , C08J9/02 , C08J9/14 , C08G18/76
摘要： A rigid polyurethane foam obtained by foaming a special polyol component and an isocyanate component in the presence of a blowing agent comprising water and at least one member selected from the group consisting of 1,1-dichloro-2,2,2-trifluoroethane and 2,2-dichloro-2-monofluoroethane possesses balanced excellent properties, has no surface void, and shows only slight expansion after molding. Therefore, it can be effectively used as a heat insulator, in particular, a heat insulator for refrigerators.

6. 发明专利

DE69106684D1 未知
公开(公告)号：DE69106684D1
公开(公告)日：1995-02-23
申请号：DE69106684
申请日：1991-01-14
申请人： HITACHI LTD
发明人： KUROISHI KAZUYOSHI , KOBAYASHI ISAO , NAKA REISHI
IPC分类号： C08J9/02 , C08G18/10 , C08G18/40 , C08G18/42 , C08G18/48 , C08G18/50 , C08G18/66 , C08G18/76 , C08J9/14 , C08L75/04
摘要： A rigid polyurethane foam obtained by foaming a special polyol component and an isocyanate component using only water as a blowing agent has balanced excellent properties including a remarkably low density and a low thermal conductivity and is suitable for use as a heat insulator, particularly in a refrigerator.

7. 发明专利

DE3369522D1 PROCESS FOR PRODUCING RIGID POLYURETHANE FOAMS 未知
公开(公告)号：DE3369522D1
公开(公告)日：1987-03-05
申请号：DE3369522
申请日：1983-04-13
申请人： HITACHI LTD
发明人： NAKA REISHI , SHIBATA KATSUO , KOBAYASHI ISAO
IPC分类号： C08G18/00 , C08G18/48 , C08G18/50 , C08G18/14
摘要： A rigid polyurethane foam can be obtained in one-shot method by reacting a polyol mixture comprising a tetrafunctional tolylenediamine type polyol, a difunctional propylene type polyol, an octafunctional sucrose type polyol and a trifunctional diethanolamine type polyol with an isocyanate component in the presence of a reaction catalyst, a blowing agent and a foam stabilizer. The thus obtained rigid polyurethane foams have improved fluidity, dimensional stability, friability and thermal conductivity and shortened demolding time.

8. 发明专利

DE69535775D1 未知
公开(公告)号：DE69535775D1
公开(公告)日：2008-08-07
申请号：DE69535775
申请日：1995-10-04
申请人： HITACHI LTD , HITACHI HARAMACHI ELECTRONICS
发明人： YAMADA KAZUJI , TANAKA AKIRA , SAITO RYUICHI , KURIHARA YASUTOSHI , KUSHIMA TADAO , HARAMAKI TAKASHI , KOIKE YOSHIHIKO , HOSOKAWA TAKASHI , SAWAHATA MAMORU , KOIZUMI MASAHIRO , ONUKI JIN , SUZUKI KAZUHIRO , KOBAYASHI ISAO , SHIMIZU HIDEO , HIGASHIMURA YUTAKA , SEKINE SHIGEKI , KOIKE NOBUYA , KOKUBUN HIDEYA
IPC分类号： H01L25/07 , H01L23/049 , H01L23/373 , H01L23/495 , H01L25/065 , H02M7/00
摘要： A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes (15a,15b,17,18,19) of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base (13), the upper surface of the heat dissipating base being covered with a member (12) for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements being arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.

9. 发明专利

DE69525818T2 未知
公开(公告)号：DE69525818T2
公开(公告)日：2002-11-28
申请号：DE69525818
申请日：1995-11-27
申请人： HITACHI LTD
发明人： KOBAYASHI ISAO , KANEKO JIRO , UEFUNE KOUKI , SUZUKI TOMIO , TAKAHASHI TSUYOSHI
IPC分类号： G11B25/04 , G11B33/08 , G11B33/12
摘要： A magnetic disk apparatus includes a link mechanism constructed by at least a flexible portion and a hard member and one end of the link mechanism is attached to a fixing unit (6) and the other end is attached to a hard disk assembly (1) so that the flexible portion of the link mechanism is located on a straight line which passes through the center of gravity of the hard disk assembly, thereby having a sufficient rigidity for a disturbance in the straight line direction which acts on the HDA (Hard Disk Assembly) (1) and reducing a natural frequency of the HDA for the disturbance in the rotating direction of the HDA.

10. 发明专利

DK0443158T3 未知
公开(公告)号：DK0443158T3
公开(公告)日：1995-09-18
申请号：DK90124559
申请日：1990-12-18
申请人： HITACHI LTD
发明人： KUROISHI KAZUYOSHI , NAKA REISHI , KOBAYASHI ISAO , TANAKA KOUSUKE , GOTOO KATUHIKO
IPC分类号： F25D23/08 , C08G18/00 , C08G18/48 , C08G18/50 , C08G18/72 , C08G18/80 , C08G101/00 , C08J9/02 , C08J9/14 , C08G18/76
摘要： A rigid polyurethane foam obtained by foaming a special polyol component and an isocyanate component in the presence of a blowing agent comprising water and at least one member selected from the group consisting of 1,1-dichloro-2,2,2-trifluoroethane and 2,2-dichloro-2-monofluoroethane possesses balanced excellent properties, has no surface void, and shows only slight expansion after molding. Therefore, it can be effectively used as a heat insulator, in particular, a heat insulator for refrigerators.

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