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    • 6. 发明专利
    • Manufacture of casting mold
    • 铸造模具制造
    • JPS61103647A
    • 1986-05-22
    • JP22202684
    • 1984-10-24
    • Hitachi Ltd
    • NATORI TATSUOSHIMAGUCHI TAKASHIYAMADA TOSHIHIROWATANABE SHOEI
    • B28B1/26B22C9/04B22C9/12
    • B22C9/04
    • PURPOSE:To obtain a casting mold with which the residue of dissolution is thoroughly eliminated by forming a coating film insoluble in a solvent on the surface of a pattern made of an org. material and treating the pattern with a solvent in a water soluble mold material then subjecting the same to a heating treatment and removing finally the residue of dissolution with a solvent. CONSTITUTION:The insoluble rubber coating film 2 is formed over the entire surface of the soluble formed styrol pattern 1 over the entire surface thereof except the top part and the water soluble mold material is packed around the pattern 1 in a wooden flask 4 installed on an ingot mold stool 3 to form a casting mold 5. The mold 5 is upset and the stool 3 and the flask 4 are removed. The solvent is brought into contact with the top part of the pattern 1 on which the film 2 is not formed while the mold 5 is in the uncured state to dissolve the pattern 1. The mold 5 is then heated to cure and the residue of dissolution is removed to the outside of the mold 5 by the solvent. The through elimination of the residue of dissolution from the inside of the mold for slip casting is thus made possible.
    • 目的:获得通过在由组织形成的图案的表面上形成不溶于溶剂的涂膜,从而完全消除溶解残留物的铸模。 然后用水溶性模具材料中的溶剂处理图案,然后对其进行加热处理,最后用溶剂除去溶解残余物。 构成:不溶性橡胶涂膜2在除了上部之外的整个表面上形成在可溶形成的苯乙烯图案1的整个表面上,并且水溶性模塑材料围绕图案1包装在安装在 铸锭模具3以形成铸模5.模具5处于镦粗状态,粪便3和烧瓶4被去除。 当模具5处于未固化状态以溶解图案1时,使溶剂与未形成膜2的图案1的顶部接触。然后将模具5加热固化并使其溶解残留 通过溶剂除去模具5的外部。 因此,可以通过从模具内部通过消除溶解残留物进行滑移浇铸。
    • 7. 发明专利
    • DEVICE FOR COOLING SEMICONDUCTOR CHIP
    • JPS63283148A
    • 1988-11-21
    • JP11704787
    • 1987-05-15
    • HITACHI LTD
    • SATO MOTOHIROYAMADA TOSHIHIROOGURO TAKAHIROWATANABE SHOEI
    • H01L23/36
    • PURPOSE:To render thermal conduction between fins stable by a method wherein a housing and each fin of a heat transfer element are so set as to form an angle smaller than 30 deg. with a line perpendicular to the reference plane where the heat transfer element is in contact with the rear of a semiconductor chip. CONSTITUTION:A semiconductor chip 3 is mounted on a substrate 1 through a soldering ball 2. Heat generated by the chip 3 is transferred through such a structure in which fins 7 of a heat transfer element are engaged with fins 8 of a housing 5. Fins are so set as to form an angle of theta with a line 12 perpendicular to a face 9 in contact with the rear of the chip 3, and fins 13 are so set as to form the same angle of theta with a line perpendicular to a reference plane 10 of a housing 5 formed in parallel with the face 9. The angle theta is rendered smaller than 30 deg.. By these processes, the heat faces of the fins are in contact with each other without fail by engaging them, therefore a thermal conduction between fins can be rendered stable.