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1. 发明专利

JP2002074309A IC CARD 失效
公开(公告)号：JP2002074309A
公开(公告)日：2002-03-15
申请号：JP2000264376
申请日：2000-08-31
申请人： HITACHI LTD
发明人： TANIE HISAFUMI , SAITO NAOTO , SASAKI KOJI , SEKIHASHI MASAO , YOSHINO RYOZO
IPC分类号： B42D15/10 , G06K19/077 , H01L25/00
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable IC card capable of preventing disconnection in the card,. with low manufacturing cost and thin card thickness. SOLUTION: The side end part of a reinforcing board or an IC chip itself, which is arranged on an IC chip in the IC card is arranged on the outer side of sealing agent. Stress generated in the card is dispersed when a pressing load is generated in the IC card by arranging the reinforcing board side end part or the IC chip itself outer than sealing agent. Thus, shearing stress caused in wiring existing in the card is reduced and disconnection is prevented without increasing card thickness and manufacture cost.

2. 发明专利

JP2000151106A CERAMIC MULTILAYER WIRING BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JP2000151106A
公开(公告)日：2000-05-30
申请号：JP36721499
申请日：1999-12-24
申请人： HITACHI LTD
发明人： HORIKOSHI MUTSUMI , SEKIHASHI MASAO , TOZAKI HIROMI , MORI YASUHIRO , NOGUCHI TAKAHIRO , SHOJI FUSAJI , KINOSHITA MADOKA
IPC分类号： H05K3/46 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic multilayer wiring board, that can reduce the number of wiring pattern defects. SOLUTION: A binder such as ethyl cellulose or the like and an organic solvent such as n-butyl carbitol acetate or the like are compounded and the dissolved binder is used as a vehicle. This vehicle is filtrated with, for example, a filter having a hole size of about 5 to 50 μm. The filtrated vehicle and copper powder are compounded and mixed to prepare copper paste. A ceramic multilayer wiring board is manufactured by using this copper paste to print a predetermined pattern on a green sheet, then laminating and burning the green sheet.

3. 发明专利

JPH08293652A MANUFACTURE OF COPPER PASTE, CERAMIC MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH08293652A
公开(公告)日：1996-11-05
申请号：JP9912495
申请日：1995-04-25
申请人： HITACHI LTD
发明人： HORIKOSHI MUTSUMI , SEKIHASHI MASAO , TOZAKI HIROMI , MORI YASUHIRO , NOGUCHI TAKAHIRO , SHOJI FUSAJI , KINOSHITA MADOKA
IPC分类号： H05K1/09
摘要： PURPOSE: To obtain a method of manufacturing a ceramic multilayer printed circuit board, which can reduce the number of defects in a wiring pattern. CONSTITUTION: A binder, such as ethyl cellulose, is compounded with organic solvent, such as n-butylcarbitol acetate, the binder is dissolved to turn into a vehicle, this vehicle is filtered by a filter of a hole diameter of 5 to 50μm or thereabouts, for example, the filtered vehicle is compounded with copper powder and the vehicle is mixed with the copper powder to turn into a copper paste. This copper paste is used in the manufacture of a ceramic multilayer printed circuit board, desired patterns are respectively printed on green sheets, then, the green sheets are laminated and the laminated material is subjected to firing to manufacture the board.

4. 发明专利

JPH0445983B2 失效
公开(公告)号：JPH0445983B2
公开(公告)日：1992-07-28
申请号：JP13009383
申请日：1983-07-15
申请人： HITACHI LTD
发明人： SEKIHASHI MASAO , ISHIDA MASAKATSU
IPC分类号： H01L23/50 , H01L23/498

5. 发明专利

JPH0464281A MANUFACTURE OF CERAMIC MULTILAYER BOARD 失效
公开(公告)号：JPH0464281A
公开(公告)日：1992-02-28
申请号：JP17522590
申请日：1990-07-04
申请人： HITACHI LTD
发明人： SAKAMOTO KOZO , USHIFUSA NOBUYUKI , NAGAYAMA NOBUNARI , OGIWARA SATORU , SEKIHASHI MASAO
IPC分类号： H05K3/46 , H01L23/52
摘要： PURPOSE:To reduce and compensate for the deviation and failure of shrink produced by deformation behavior or difference in shrink in a conductor section and an insulation section by carrying out design and execution in preconsideration for difference in shrink in the conductor section and the insulation section and deformation behavior during laminating. CONSTITUTION:Difference in shrink in a conductor section and an insulation section and deformation behavior during laminating with regards to horizontal direction is estimated and confirmed experimentally. When the information thus obtained is reflected on through hole working position or the design and execution of wiring patterns, it will be possible to reduce and compensate for the deviation and failure of shrink after lamination and firing and produce a ceramic multilayer substrate having high dimensional accuracy.

6. 发明专利

JPH0367403A CONDUCTOR PASTE, MANUFACTURE THEREOF, AND CIRCUIT BOARD AND ELECTRONIC CIRCUIT MODULE USING IT 失效
公开(公告)号：JPH0367403A
公开(公告)日：1991-03-22
申请号：JP20285289
申请日：1989-08-07
申请人： HITACHI LTD
发明人： ARIMA HIDEO , KUROKI TAKASHI , SEKIHASHI MASAO , FUJII MITSURU , HORIKOSHI MUTSUMI
IPC分类号： H05K1/09 , C09D5/24 , H01B1/22 , H01F5/00 , H01L23/498
摘要： PURPOSE:To obtain excellent conductivity and long-term preserving property and high-density wiring, miniaturize a circuit board, and propagate signals at a high speed by constituting the thick layer circuit board with the conductor paste made of an organic vehicle containing the specific % of low-resistance high-melting point metal powder by the specific method. CONSTITUTION:Low-resistance high-melting point metal powder 85-90wt.% mainly consisting of tungsten and molybdenum and the remainder of an organic vehicle containing a binder 5-13wt.% are mixed, and the mixture is forcefully fed at the shear rate 1000s through the minimum interval section of a kneading machine having the minimum interval of at least 5mum and an larger interval around it and kneaded to obtain conducting paste 3. This paste 3 is pattern- printed on a green sheet 2 mainly made of ceramic and sintered to obtain a thick layer circuit board 1. Pins 12 and semiconductor elements 10 are soldered via connecting conductors 5 and 6 and a thin conductor 8 to complete an electronic circuit module.

7. 发明专利

JPS6483686A MULTILAYER PLATING METHOD 失效
公开(公告)号：JPS6483686A
公开(公告)日：1989-03-29
申请号：JP23897687
申请日：1987-09-25
申请人： HITACHI LTD
发明人： WATANABE TETSUYA , SEKIHASHI MASAO
IPC分类号： C25D5/10 , B23K20/233 , C23C26/00 , H01L21/48 , H01L23/498 , H05K3/24
摘要： PURPOSE:To improve the adhesion of a multilayer plating by heating a plated metal, then polishing the plating film surface to expose the diffusion layer between the substrate metal and the primary plating film, and then forming a secondary plating film thereon. CONSTITUTION:The primary plating film is formed on the surface of a substrate metal, and then heated to form a diffusion layer between the substrate metal and the primary plating film. The surface of the primary plating film is mechanically polished to expose the diffusion layer. The secondary plating film is then formed on the exposed diffusion layer.

8. 发明专利

JPS6227546B2 失效
公开(公告)号：JPS6227546B2
公开(公告)日：1987-06-15
申请号：JP7647478
申请日：1978-06-26
申请人： HITACHI LTD
发明人： SEKIHASHI MASAO , ISHIDA MASAKATSU , OOTSUKA KANJI , SUGITANI ISAO , USAMI TAMOTSU
IPC分类号： H01L23/50 , H01L23/48

9. 发明专利

JPS6143455A Manufacture of lead frame 失效
标题翻译：铅框架的制造
公开(公告)号：JPS6143455A
公开(公告)日：1986-03-03
申请号：JP16492084
申请日：1984-08-08
申请人： Hitachi Ltd
发明人： SEKIHASHI MASAO , FURUUMAYA KENICHI
IPC分类号： H01L23/50 , H01L21/48
CPC分类号： H01L21/4842
摘要： PURPOSE:To prevent the abnormal deformation and so forth of a lead frame from causing by a bend processing by a method wherein, firstly, a guide hole is provided in a part of the substrate, where is equivalent to a place to be cut off after the semiconductor package of the substrate is positioned, and the manufacturing operation in each process is conducted using this guide hole as a guide. CONSTITUTION:A guide hole 7 is provided in a part of a substrate 1, where is equivalent to a part where the semiconductor package of the substrate 1 is placed, and after that, an etching is performed on the minimum necessary parts of the substrate 1 excluding the parts where are cut off afterward including the place of the hole 7. Accordingly, the etching is not performed on the cuttable parts by press. Then, a bend processing is performed on the substrate 1 using the guide hole 7 as a guide. Subsequently, a plating layer 5 is coated by performing a plating, and lastly, unnecessary parts 8 are cut by the metal mold leaving lead parts 2 and the lead frame is finished. Since no etching is performed on the parts, where are cut off afterward in such a way, the parts can keep a state equal roughly to the strength of the substrate at the time before an etching is performed even in the state at the time when the etching.
摘要翻译：目的：为了防止引线框架的异常变形等引起弯曲加工，首先，在基板的一部分设置有引导孔，其中相当于在定位基板的半导体封装，并且使用该引导孔作为引导件进行每个处理中的制造操作。构成：在基板1的一部分设置有引导孔7，其中相当于放置基板1的半导体封装的部分，然后对基板1的最小必要部分进行蚀刻不包括随后被切断的部分，包括孔7的位置。因此，不能通过压制对可切割部分进行蚀刻。然后，使用引导孔7作为引导件对基板1进行弯曲加工。随后，通过进行镀覆来涂覆镀层5，最后通过金属模切割不需要的部分8，留下引线部分2，引线框架完成。由于不对这些部件进行蚀刻，所以在这种方式之后被切断的部分，即使在执行蚀刻之前的状态下，这些部件也可以保持与蚀刻之前的基板的强度大致相等的状态蚀刻。

10. 发明专利

JPS6132492A Metal screen for printing conductor pattern 失效
标题翻译：用于打印导体图案的金属屏幕
公开(公告)号：JPS6132492A
公开(公告)日：1986-02-15
申请号：JP15346784
申请日：1984-07-24
申请人： Hitachi Ltd
发明人： SANADA SAKAE , SEKIHASHI MASAO
IPC分类号： B41N1/24 , H01L21/52 , H05K3/12

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