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    • 1. 发明专利
    • Accelerator
    • 加速器
    • JP2007287538A
    • 2007-11-01
    • JP2006115247
    • 2006-04-19
    • Hitachi Ltd株式会社日立製作所
    • TSUCHIDA KAZUTERUSEKI HIROBUMI
    • H05H9/00G21G1/10H05H7/14H05H13/00
    • PROBLEM TO BE SOLVED: To provide an accelerator capable of reducing radioactivity after ending usage.
      SOLUTION: Gold plating is applied to the inside surfaces facing to an ion beam R of a quadrupole electrode 13 of this accelerator 10 for irradiating a target 20 with protons by accelerating them by an RFQ 12a and a DTL 12b, and drift tubes 14, the inside surface of a beam transmission duct 15, and a surface of a collimator electrode 15b. Since the half-life period of
      197 Hg generated by (p, n) nuclear reaction is short in the case of gold, the radioactivity level after ending the use of the accelerator can be reduced. As a result, a disposal cost can be reduced as compared with a conventional one. When gold plating is not applied to the parts of the accelerator, since the half-life periods of generated
      65 Zn and
      56 Co are long, the radioactivity level is increased, and the disposal cost is increased.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供能够在使用结束后能够降低放射性的加速器。 解决方案:将金电镀施加到面向该加速器10的四极电极13的离子束R的内表面,用于通过RFQ 12a和DTL 12b加速它们用质子照射靶20,以及漂移管 14,光束传输管道15的内表面和准直器电极15b的表面。 由于(p,n)核反应产生的 197 Hg的半衰期在金的情况下较短,所以可以减少在使用加速器之后的放射性水平。 结果,与传统的相比,可以降低处理成本。 当不对加速器的部分进行镀金时,由于生成的 65 Zn和 56 Co的半衰期长,因此放射性水平升高, 处理费用增加。 版权所有(C)2008,JPO&INPIT
    • 2. 发明专利
    • Radioisotope manufacturing equipment
    • 无线电制造设备
    • JP2006284337A
    • 2006-10-19
    • JP2005103936
    • 2005-03-31
    • Hitachi Ltd株式会社日立製作所
    • OKAZAKI TAKASHITSUCHIDA KAZUTERUSEKI HIROBUMIUMEGAKI KIKUO
    • G21G1/10G21K5/04G21K5/08H05H6/00
    • PROBLEM TO BE SOLVED: To provide radioisotope manufacturing equipment capable of obtaining with high yield, nuclide contained in radioactive medicine administered in vivo to an examinee in the PET test. SOLUTION: The radioisotope manufacturing equipment (10) comprises a transmitting membrane (22) forming a boundary between a vacuum region (U) and stuff (23) in a target (20) irradiated with accelerated ion beam (R), and the first clip (21) supporting the transmitting membrane (22) which a plurality of passages (27) where the ion beam (R) passes. The material of the first clip (21) is alumina dispersion strengthened copper. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了提供能够以高产率获得的放射性同位素制造设备,其在PET测试中向受检者在体内施用的放射性药物中所含的核素。 解决方案:放射性同位素制造设备(10)包括形成被加速离子束(R)照射的靶(20)中的真空区域(U)和填料(23)之间的边界的透射膜(22),以及 所述第一夹子(21)支撑所述离子束(R)通过的多个通道(27)的所述透射膜(22)。 第一夹子(21)的材料是氧化铝分散强化铜。 版权所有(C)2007,JPO&INPIT
    • 4. 发明专利
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • JP2002368078A
    • 2002-12-20
    • JP2001171903
    • 2001-06-07
    • Hitachi Ltd株式会社日立製作所
    • HOSHINO MASAKAZUSEKI HIROBUMIOYAMA KATSUMINUMATA YUKI
    • H01L21/302H01L21/3065H01L21/76
    • PROBLEM TO BE SOLVED: To realize a fine structure and a high speed operation of a semiconductor device by a method wherein a narrow element isolation groove is filled with a silicon oxide film without voids.
      SOLUTION: A silicon oxide film 2, a silicon nitride film 3, and a photoresist film 4 are formed on a wafer 1 as shown in (1) and (2) of Fig. 1 and a photoresist pattern 5 is formed. The nitride film 3 and the oxide film 2 are etched with the resist pattern 5 as a mask to form an aperture 6 and the resist pattern 5 is removed as shown in (3) and (4). The corners 7 of the nitride film 3 are removed by sputter etching in a high density plasma CVD device as shown in (5). A groove 8 having a depth of approximately 300 nm is formed in the wafer 1 by using the nitride film 3 as a mask and a thin silicon oxide film 9 is formed as shown in (6) and (7). Then the groove 8 is filled with a silicon oxide film. With such a constitution, as the dimensions of an element isolation region are reduced, a high speed operation and a fine structure of a semiconductor device can be realized.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:为了通过一种方法实现半导体器件的精细结构和高速操作,其中窄的元件隔离槽填充有无空隙的氧化硅膜。 解决方案:如图1(1)和(2)所示,在晶片1上形成氧化硅膜2,氮化硅膜3和光刻胶膜4。 形成光致抗蚀剂图案5。 用抗蚀剂图案5作为掩模蚀刻氮化物膜3和氧化物膜2以形成孔6,并且如(3)和(4)所示去除抗蚀剂图案5。 如(5)所示,通过溅射蚀刻在高密度等离子体CVD装置中除去氮化膜3的角部7。 如(6)和(7)所示,通过使用氮化膜3作为掩模,在晶片1中形成深度约为300nm的槽8,形成薄的氧化硅膜9。 然后,沟槽8被填充有氧化硅膜。 利用这种结构,随着元件隔离区域的尺寸减小,可以实现半导体器件的高速操作和精细结构。
    • 8. 发明专利
    • GAS LASER EXCITATION CIRCUIT
    • JPH08111555A
    • 1996-04-30
    • JP24589894
    • 1994-10-12
    • HITACHI LTD
    • SEKI HIROBUMI
    • H01S3/097H01S3/0971
    • PURPOSE: To bring the operation of a laser excitation circuit in a highly stable state, and to obtain semipermanent life for a switch by parallely connecting a saturable reactor to one of capacitors of a gas laser excitation circuit. CONSTITUTION: First, a saturable reactor 8 is put, in a nonsaturable state. A capacitor 12 is charged to voltage V0 by a charging power source 7. When a switch 13 is turned ON, the electric charge stored in the capacitor 12 is moved to capacitors 1 and 3. When the voltage applied to the capacitors 1 and 3 approaches the peak and the saturable reactor 8 is saturated, the electric charge stored in the capacitor 3 is inverted, and the voltage, which is almost twice as high as the voltage applied to the capacitors 1 and 3, is applied to a laser discharge tube 2. By using a saturable reactor as a switch, life can be extended and operation can be made stable.